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Index of memory topics: NOR/NAND, eMMC/UFS, EEPROM/FRAM/MRAM, DRAM/LPDDR/PSRAM/SRAM/eDRAM, controllers & management (FTL/ECC/training/crypto), key specs, use-case mapping, design hooks and quick pairings.

Non-Volatile Memories

Parallel NOR Flash

XIP, fast random reads, slower program/erase; async parallel bus with page buffers for code/boot storage.

Raw NAND (SLC/MLC/TLC/QLC)

High capacity, page/block ops; requires FTL/ECC/bad-block handling (ONFI/Toggle) for logs & bulk data.

eMMC / UFS (Managed NAND)

Controller with ECC & wear leveling built-in; HS400/UFS gears; ideal for system/rootfs and cameras.

FRAM / FeRAM

Near-SRAM speed with 10¹²+ endurance and retention; frequent parameter writes, metering.

MRAM / ReRAM

Non-volatile with high endurance and low write power; store critical state for power-loss recovery.

Volatile Memories

DRAM (SDR/DDR2/3/4/5)

High bandwidth/low cost; tRCD/tRP/tCL timing and refresh; main memory, frame buffers, caches.

LPDDR (LPDDR2/3/4/5)

Mobile low-power DRAM with deep power states; for handhelds, embedded graphics and edge AI.

PSRAM / HyperRAM

DRAM core with SRAM-like interface; HyperBus/Octal ease of use for displays and mid-size caches.

SRAM (Async/Sync/Tag)

Ultra-low latency, smaller capacity; use for caches, high-speed tables and small dual-port needs.

Embedded DRAM / TCM

On-chip high bandwidth memory for accelerators, imaging pipelines and networking.

Controllers & Management

NAND Controller / FTL

ECC strength (BCH/LDPC), wear leveling, bad-block tables and static data refresh strategies.

eMMC/UFS Features

Boot partitions, RPMB secure area, health metrics and power-loss protection options.

DDR Controller / PHY

Write/read training, clock/jitter tolerance and temperature-aware refresh (T-REFI).

Security & Crypto

XIP authentication, storage encryption (AES/XTS) and anti-rollback/version counters.

Key Specs & Metrics

NOR/EEPROM/FRAM Metrics

Read latency, program/erase time, endurance, retention, sector/page size and temperature grades.

NAND/eMMC/UFS Metrics

Capacity, page/block sizes, interface rates, ECC needs, write amplification/TBW and robustness.

DRAM/LPDDR Metrics

Data rate (MT/s), bus width, timings, power states; Bandwidth = rate × width / 8.

General & Qualification

ESD/temperature grades (industrial/automotive), service life/EOL and second-source availability.

Use-Case Mapping

Boot / XIP

Parallel NOR or Octal-NOR/HyperFlash (DTR) for execute-in-place boot paths.

High-Capacity Data

Raw NAND + controller for maximum capacity, or eMMC/UFS for easier integration.

Design Hooks & Pitfalls

Boot Chain & Security

XIP image signature/rollback, dual-image fallback and using eMMC boot partitions safely.

Refresh & Power-Loss

DRAM refresh vs. temperature; refresh NAND/MLC/TLC data at high temp to avoid disturb/retention loss.

SI/PI & Layout

DDR length-match/impedance/continuous reference; OSPI/HyperBus lane matching & clock symmetry; tight decoupling.

Power Sequencing

Define rail order and back-feed protection; obey tPU/tR/tINIT before first access.

Performance Tuning

OSPI/HyperBus with DTR + XIP cache; eMMC HS400 & deeper queues; DDR bursts/prefetch.

Secure Regions

Use eMMC RPMB/secure partitions and NOR protected sectors; isolate keys/certificates.

Quick Pairings

Automotive Gateway

A53/A55 + LPDDR4-ECC + eMMC health monitoring + secure boot + ring logs.

Wearables

QSPI NOR + FRAM params + PSRAM cache; deep sleep and fast wake.