Power Path & Priority
Two sources → one rail. Reverse block, select priority, guarantee hold-up, switch fast without glitches.
- Back-to-back MOSFETs for reverse blocking
- Explicit priority with hysteresis
- Hold-up sized from energy, not capacitance alone
- Non-overlap timing for clean switchover
- Measure: Vout dip, reverse current, gate timing
Definition
Power path = controlled OR’ing of multiple sources into a single rail. “Ideal diode” = MOSFET + controller emulating a low-loss diode. Reverse blocking prevents back-feed. Priority arbitration chooses the active source. Hold-up stores energy to bridge gaps.
Operating Principle
Ideal-diode control senses the MOSFET drop and drives the gate just enough to conduct forward with low loss while blocking reverse flow. Back-to-back N-FETs (sources tied) cancel body diodes. Priority uses a comparator/OR’ing amp with hysteresis. Switchover is non-overlap; hold-up bridges the gap.
Reverse Blocking Fundamentals
- Use back-to-back N-MOSFETs (sources tied) for true reverse block
- Ideal-diode/ORing controller with reverse comparator + blanking
- Loss & thermal: two devices → P ≈ I²·RDS(on)·2
- Kelvin sense/shunt outside hot loop; keep away from SW polygon
- Validate: forced reverse, cable-pull; log IREV pk and toff
- Choose back-to-back N-FETs (sources tied) + ideal-diode controller
- Start reverse blanking at 100 ns; tune to ignore switching spikes
- RDS(on) sizing for IMAX; keep ΔT < 40 °C worst case
- Kelvin sense/shunt placed outside the FET hot loop
- Short, quiet routing to controller sense pins; single PGND–AGND tie
- Bench: force reverse & cable-pull; log IREV peak and toff
Priority Arbitration
- Fixed A > B with hysteresis is the robust default
- Voltage-qualified for PDOs; capability-aware if current limits differ
- Non-overlap 1–5 µs to avoid shoot-through
- Min dwell 10–50 ms; debounce flapping inputs
- Mask downstream PG/RESET during reevaluation windows
- Default to fixed priority A > B with explicit hysteresis
- Set non-overlap 1–5 µs; confirm no shoot-through
- Min dwell 10–50 ms; debounce source flapping
- USB-PD: treat PDO change as reevaluation; apply PG/RESET mask
- Log transitions (time, dip mV, reverse I pk); export CSV
- Document override/force input and test matrix
Hold-Up Sizing
- Size by energy: E = ½·C·(Vhi2 − Vmin2)
- For constant power: C ≥ 2·P·thold / (Vhi2 − Vmin2)
- Placement choice: pre-path (cheap) vs post-path (tight Vout)
- Control inrush (soft-charge FET/RC); check ESR/ESL limits
- Validate: dip (mV), hold time (ms), cap current during yanks
- Pick pre- or post-path location (post preferred for tight Vout)
- Compute C from energy; verify with P, thold, Vhi, Vmin
- Limit inrush (soft-charge FET/RC); check ESR/ESL headroom
- Keep ripple < ½ of allowed dip; add UVLO/bleed path
- Bench: yank adapter/PDO; log dip (mV), hold-time (ms), cap current
- Thermal: check charge FET/NTC at warm ambient
Fast Switchover
- Non-overlap (dead-time) prevents cross-conduction
- Pre-bias safe handoff; no discharge into the inactive path
- Mask PG/RESET during the micro-dip window
- Coordinate downstream bucks/LDOs to avoid re-soft-start
- Measure ΔVout, tdead, Irev for every scenario
- Set dead-time 1–5 µs; prove no cross-conduction
- Make the handoff pre-bias safe (no back-discharge)
- Apply PG/RESET mask ≲ 50 ms (≈ 2× measured dip)
- Check downstream UVLO headroom; avoid re-soft-start
- Script A→B/B→A/PDO jumps; capture Vout, GateA, GateB, I
- Log ΔVout (mV), tdead (µs), Irev (A); compare to spec
Protections & Telemetry
- Fast comparators trip protection; ADC/PMBus logs slower telemetry
- Stack: reverse block, inrush limit, OVP/UVP, current limit, OTP
- Telemetry: Vin/out, Iload, T(FET/PCB), event IDs/timestamps
- Use hysteresis & blanking; reject spikes from SW polygon
- Export CSV/black-box; retain pre-trigger history for root-cause
- Comparator trips first; ADC logs second (separate routes)
- Apply hysteresis & blanking to reject SW spikes
- Telemetry: Vin/Vout, Iload, T(FET/PCB), event IDs/timestamps
- Pre-trigger buffer ≥ 5× dead-time; cap retention to avoid wear
- Export CSV/black-box; include cause codes
- Script OC/UV/REV tests; verify ttrip, toff, Irev
Layout Aids
- Minimize hot loops; “follow the caps” for true return paths
- Fence the SW polygon with 6–10 stitching vias to ground
- Kelvin sense pairs tightly coupled; avoid SW edge proximity
- Place snubbers/boot-R at the ringing node; short leads
- Partition AGND island; star-tie to PGND at controller
- Place FETs → MLCCs (pad-to-pad ≤ 2–3 mm) → controller sense
- Fence SW copper with 6–10 stitching vias per 20–30 mm edge
- Kelvin pair tightly; land directly on shunt pads
- Snubber/boot-R: shortest possible leads; mount at the node
- Partition AGND island; single star-tie to PGND
- Verify with EMI scan + time-domain ringing before/after damping
Checklist
- Reverse block truly isolates; no back-feed under forced reverse
- Priority switchover is fast, clean, and pre-bias safe
- Hold-up meets target window without overstress or reset
- Protections trip first; telemetry logs correctly with timestamps
- Layout minimizes hot loops; sense lines are quiet and short
- Power path priority defined (fixed/voltage-qualified), min dwell set, debounce applied.
- Back-to-back N-FETs sized; reverse threshold + blanking tuned; SOA and ΔT verified.
- Hold-up C calculated by energy; ESR/ESL headroom checked; soft-charge limits inrush.
- Non-overlap 1–5 µs; pre-bias safe handoff; PG/RESET mask ≤ 50 ms.
- Telemetry: Vin/Vout/I/T + event IDs; pre-trigger buffer ≥ 5× dead-time; spike reject set.
- Layout: MLCC pad-to-pad ≤ 2–3 mm; SW via-fence (6–10); Kelvin sense away from SW.
Validation Playbook
- Prove no shoot-through; reverse spike below limit
- Keep ΔVout dip within downstream UVLO margin
- Events correlate to captured waveforms and times
- Repeatability: 3 passes per scenario at corners
- Deliver scope caps + CSV + acceptance table
- Setup: 4-ch scope (Vout, GateA, GateB, Ipath), current probe, thermal cam.
- Run scenarios: A→B, B→A, PDO step, slow sag/rise, adapter yank, forced reverse, brownout.
- Measure: ΔVout (mV), tdead (µs), Irev (A), toff (ns), hold-time (ms).
- Correlate: event IDs/timestamps to waveforms; check false-trip rate.
- Corners: light/heavy load, −20/60 °C, long cable, spread-spectrum on/off.
- Accept: pass if 3 consecutive runs meet limits; otherwise fix & re-verify.
| Scenario | ΔVout (mV) ≤ | tdead (µs) | Irev (A) | Pass x3 |
|---|---|---|---|---|
| A → B (fixed priority) | … | 1–5 | < limit | ☐ |
| B → A (voltage-qualified) | … | 1–5 | < limit | ☐ |
| PDO step (USB-PD) | … | 1–5 | < limit | ☐ |
| Forced reverse / adapter yank | … | — | < limit | ☐ |
Application Scenarios
Typical dual-source patterns and what to prioritize. Copy the rules, probe the right nodes, and validate with a few repeatable tests.
Adapter ↔ Battery (Mobile/Edge)
- Priority: Adapter > Battery; mask PG during adapter yanks.
- Post-path hold-up for MCU/RTC; pre-charge battery path.
- Log VBUS, VBAT, Iload, event IDs.
USB-PD ↔ Barrel Jack (IPC/Maker)
- Voltage-qualified priority; re-evaluate on PDO change.
- Non-overlap 1–5 µs; pre-bias safe handoff.
- Add snubber near ringing SW node of downstream buck.
24 V Field Supply with Ride-Through
- ORing + eFuse + boost hold-up for 20–50 ms dips.
- Pre-path bulk; post-path decoupling by SoC rails.
- Record ΔVout, hold-time, toff, Irev.
Automotive VBAT ↔ Backup
- AEC-Q ideal diode + UV/OV monitors; cold-crank hold-up.
- Via-fence SW polygon; Kelvin to shunt pads.
- Pre-trigger event buffer for crank profiles.
PoE ↔ Local DC/DC (Edge Network)
- Fixed priority: PoE > Local; foldback on overload.
- Soft-charge the secondary path; PG gating on cable-pulls.
- EMI check: conducted bands + time-domain ringing.
Mini IC-Selection Pointers
Concrete, copy-ready part numbers grouped by function → brand. Use as starting points; verify ratings/packaging and latest datasheets.
Ideal-Diode / ORing / Power-Mux
- TI: LM74700-Q1, LM74800-Q1, TPS2121 — controllers/mux for reverse block & auto source select.
- ST: STEF12, STEF01, STPMIC1 — eFuse/PMIC options for protected power paths.
- NXP: NX5P3290, NX5P3090, PTN5150A — USB switches + CC companion for PD front-ends.
- Renesas: ISL6146, ISL6145 — ORing/hot-swap control for dual sources.
- onsemi: NCP45491, NCP45520, FPF3042 — protected load/power switches for muxing.
- Microchip: MIC94161, MIC2545A, MCP16502 — HS switch/dual switch/PMIC with rails.
- Melexis: use with Hall current sensors (see Telemetry); no ORing controllers.
Hold-Up / Ride-Through Helpers
- TI: LM5155, TPS2662, TPS25961 — boost holdup + eFuse/soft-start.
- ST: L5985D, STPMIC2 — boost control and multi-rail management.
- NXP: TEA2095T, NX3P series — secondary/ORing assist + current-limit switches.
- Renesas: ISL8107 (boost ctrl), ISL28022 (monitor) — sizing & verification support.
- onsemi: NCP81239 (buck-boost), NCP3066 (boost utility) — ride-through paths.
- Microchip: MCP1642B, MCP16301, MIC2876 — compact boost with soft-start control.
Protection / eFuse / Hot-Swap
- TI: TPS2660 / TPS2663, TPS25980 — industrial/high-current eFuses.
- ST: STEF05 / STEF12 eFuse, VN7003ALH smart HS (automotive loads).
- NXP: NX3P / NX5P families — protected 5 V/USB switches (reverse/ILIM).
- Renesas: ISL6144 (hot-swap), ISL28030 (monitor for protect loops).
- onsemi: NIS5420 (eFuse), IntelliMAX® FPF family (protected loads).
- Microchip: MIC2090 (hot-swap ctrl), MIC2790 (voltage supervisor).
Telemetry / Sensing
- TI: INA226 / INA228 power monitors; TMP235 temp sensor.
- ST: TSC2011 current-shunt amp; STTS22H temp.
- NXP: P3T1755 temp + NX3P switch + external shunt; add PCA-series ADC if needed.
- Renesas: ISL28022/25 power monitors; ZSSC3240 front-end.
- onsemi: NCS333 op-amp for shunt; NCV816x supervisors.
- Microchip: PAC1934 (4-ch power monitor), MCP6C02 (current sense amp).
- Melexis: MLX91220 / MLX91216 Hall-based current sensors (AEC-Q).
Frequently Asked Questions
How do I verify true reverse blocking under forced reverse?
Force a negative Vout→Vin with a source and series resistor, then sweep current to the device’s limit. Pass if I stays below the spec and the back-to-back FET body diode never conducts. Add blanking and hysteresis on the reverse comparator. See #reverse-block.
Ideal-diode ORing or auto power-mux—which should I use?
ORing excels at seamless sharing and back-feed immunity with minimal control overhead. Power-mux ICs add policy (priority, brownout rules) and timing control for cleaner handoffs. Choose mux when sources change priority or have PDO events; choose ORing for always-on dual feeds. See #priority.
What non-overlap window avoids shoot-through during switchover?
Start with 1–5 µs measured at the FET gates. Confirm no simultaneous conduction on scope current probes. Lengthen if cabling is long or gate charge is large; shorten if ΔVout dips. Always mask PG/RESET around the handoff. Validate at temperature and load extremes. See #switchover.
How do I size hold-up capacitance quickly and check ESR/ESL?
Use C ≈ 2·P·t / (V2 − V2). Verify ESR ripple Irms·ESR and transient ΔV = I·ESL/dt. If ΔVout margin is tight, add a small post-path polymer and place the bulk near the load. Log actual hold-time on bench. See #holdup.
How do I keep pre-bias loads from discharging during handoff?
Enforce non-overlap, ensure ideal-diode direction is correct, and add a small output series R or active ideal diode toward the load if needed. Disable synchronous rectification briefly on downstream bucks. Confirm zero negative current at Vout during the transition. See #switchover.
What ride-through targets make sense for 24 V and automotive?
Industrial 24 V often needs 20–50 ms dips at 18–20 V; automotive cranking can sag to 6–7 V for tens of milliseconds. Hold up post-path rails, not just VBAT/VBUS. Validate with scripted profiles, not DC steps. Thermal-check the holdup path. See #holdup.
How much debounce, dwell, and hysteresis prevents source flapping?
Start with 10–50 ms debounce on slow sources, 2–5 ms on regulated supplies. Dwell of 100–200 ms after a switch avoids ping-pong. Set hysteresis ≥ 3× observed ripple at the sense node. Log event counts to verify stability over hours. See #priority.
Inrush limiting vs soft-charge—where should I put it?
Limit current at the path that charges the largest downstream bulk (usually post-path). For sensitive upstream sources, add a gentle soft-charge there as well. Keep the sense resistor Kelvin-routed. Confirm peak and average inrush against connector and fuse limits. See #protect.
Protection vs telemetry—who trips first and how do I log it?
Comparators should trip the gate path first; ADC/PMBus records the event ID, timestamp, and channels. Use a pre-trigger circular buffer (≥ 5× dead-time) and spike rejection to avoid false latches. Export CSV for A/B comparisons. See #protect.
How do I stop min/max latches being spammed by SW spikes?
What’s the right Kelvin routing for a shunt in this path?
Route differential sense traces directly from the shunt pads, tightly coupled, away from SW edges and returns. Do not share ground between sense and power returns. Land at the ADC/amp with symmetric entry and guard copper if space allows. See #layout.
Any quick rules for RC snubber and bootstrap resistor placement?
Place both at the ringing node with the shortest possible loop—lead length comparable to the device pad spacing. Start with C that halves the overshoot and R that critically damps. Measure dissipation at max duty and ambient. See #layout.
USB-PD PDO changes: how do I re-qualify priority without dips?
On PDO change, reevaluate the voltage-qualified rule with a small dwell before switching. Mask PG until Vout is inside the safe band. Verify non-overlap and ΔVout across fast and slow PDO transitions. Log event IDs per change. See #priority.
What corner cases should I always test?
Light-load PFM, long cables, cold/hot extremes, adapter yank, forced reverse, and downstream buck ringing with spread-spectrum on/off. Require three consecutive passes per scenario and correlate events to waveforms. Track drift over soak time. See #validation.
What acceptance criteria should QA use for sign-off?
ΔVout within downstream UVLO margin, no shoot-through, Irev below limit, tdead inside window, and correct event logging. Each scenario must pass three consecutive runs at temperature corners. Archive scope captures and CSV with configuration hashes. See #validation.
Small-batch build? Send your rails and priorities—we’ll shortlist parts and validate handoff signals.