This page delivers a practical “protection set” blueprint for buck/boost/buck-boost rails: OCP/OVP/UVP/OTP operate as one safety envelope, with a fast-short path and hiccup/latch/auto-retry timers aligned to soft-start. You get actionable thresholds, tolerances, test hooks, and cross-brand IC picks so small-batch builds can set numbers, validate, and ship with confidence.
1) Introduction & Scope
Protection sets for buck/boost regulators work as a cohesive safety envelope: OCP, OVP, UVP, and OTP backed by a fast-short path for severe faults, plus restart policies (hiccup, latch, auto-retry) and right-sized timers tied to soft-start. Set thresholds with tolerance and drift in mind, filter noise to avoid nuisance trips, and validate across load × VIN × temperature so small-batch builds remain robust in the field.
Reader promise: actionable thresholds, timers, validation checklist, and brand-agnostic IC selection logic.
2) Taxonomy of Protections (What each one does)
OCP — cycle-by-cycle vs average; valley/peak; SS fold-back
- Sense path: RDS(on) / Rsense (Kelvin) / DCR; valley detection reduces spikes.
- Trip & latency: cycle-by-cycle is fastest; average limit is smoother but slower.
- Policy tie-ins: persistent OCP → hiccup; fast-short path runs in parallel.
- Knobs: ILIMIT = Iload,max + 0.5×ΔI; leading-edge blanking.
- Pitfalls: RDS(on) temp drift; non-Kelvin routing error.
OVP — clamp vs shutdown; bleed; downstream LDO coexistence
- Sense: FB divider tolerance/leakage; optional clamp FET or bleed.
- Trip: comparator direct; clamp adds heat/ripple.
- Policy: sensitive loads → shutdown + hiccup; mild events may clamp.
- Knobs: map divider tolerance to ±VOVP (target ±1–2%).
- Pitfalls: backfeed into downstream LDO; using clamp as regulation.
UVP — brownout ride-through vs restart; hold-up; preload
- Sense: output comparator or PG threshold.
- Trip: linked to SS ramp and error-amp recovery.
- Policy: batteries/automotive → ride-through + debounce; deep dips → auto-retry.
- Knobs: tdeglitch, preload, hold-up capacitance sizing.
- Pitfalls: too-tight UVP causing nuisance trips; small preload destabilizes loop.
OTP — die vs external NTC; fold-back slope; hot-soak
- Sense: junction sensor + external NTC near hot spots/copper.
- Trip: fold-back (current derate) vs hard trip.
- Policy: long hot environments → fold-back; safety-critical → hard trip + latch.
- Knobs: NTC divider curve, thermal hysteresis ΔT.
- Pitfalls: poor thermal coupling; restart “temperature chatter”.
Fast-short — dedicated high-speed path bypassing slow loops
- Sense: dedicated comparator + leading-edge blanking (LEB).
- Latency: microsecond-class gate discharge / SW clamp.
- Policy: pair with hiccup to avoid sustained stress.
- Knobs: blanking too short → false trips; too long → miss first peak.
- Pitfalls: jig parasitics / probe ground loops creating fake spikes.
3) Sensing & Trip Architecture
Current sense: RDS(on), sense-resistor (Kelvin), DCR
- RDS(on): lowest cost, strong temp drift; guardband for +60…90% rise hot.
- Sense-resistor (Kelvin): most accurate; route true Kelvin pads; keep return off gate driver ground.
- DCR of inductor: low loss; needs temp compensation (NTC or table).
- Noise tools: leading-edge blanking tblank & RC sense filter tied to slope comp.
Voltage sense: FB comparators, divider tolerances, leakage
- Keep FB node impedance ≤ 100 kΩ eq.; place Rbot close to FB pin.
- Account for bias/leakage around FB and routing; map E96 tolerances to Vout accuracy.
- OVP clamp/bleed gate available on some ICs—use for mild overshoot only.
- Consider small Cff only after loop stability check.
Comparator speed vs noise: deglitch, LEB, slope-comp tie-ins
- Deglitch: ns–µs digital window; choose ≈3–5× the dominant spike width.
- LEB location: at sense amp or PWM latch; verify trip under worst-case VIN/load.
- Slope compensation: match inductor ramp; too small → subharmonic; too large → slower trips & lower loop gain.
4) Thresholds & Tolerances (How to set numbers)
OCP: derive ILIMIT
- Inductor ripple: ΔI ≈ (VL/L) · D · Ts.
- Rule: ILIMIT ≥ ILOAD,max + 0.5·ΔI + margin.
- Rsense: Vtrip = ILIMIT · Rsense; include amp offset and resistor tolerance.
- RDS(on): guardband +60…90% hot drift; validate at hot VIN.
- DCR: temperature-calibrate (NTC/table) and include copper coeff.
OVP / UVP bands
- Target ±(1–2%) at Vout; map E96 divider tolerances via Vout = Vref · (1 + Rtop/Rbot).
- Include bias/leakage at FB node and routing film.
- UVP deglitch: long enough for ripple ride-through; short enough for real brownouts.
- Example start: OVP +4% trip / +1% clear; UVP −8% trip / −3% clear.
OTP setpoint via NTC & PCB thermal path
- Ttrip = Tmax,allowed − ΔTpath (junction-to-NTC gradient).
- Hysteresis: ΔThyst ≥ ramp_rate · restart_latency to prevent temperature chatter.
- Place NTC near hotspot copper; avoid airflow artifacts; validate hot-soak and cycles.
| Input | Value | Derived | Result | Notes |
|---|---|---|---|---|
| L, Fsw, VIN, VOUT | (user) | ΔI ≈ (VL/L) · D · Ts | ΔI | Use worst-case VL at VIN max/min |
| ILOAD,max, ΔI | (user) | ILIMIT ≥ ILOAD,max + 0.5·ΔI | ILIMIT | Then add policy margin (mode transitions) |
| Rsense | (pick) | Vtrip = ILIMIT · Rsense | Vtrip | Include amp offset & tolerance |
| Starter values; verify at cool/room/hot and VIN min/max. | ||||
| Component | Tolerance / Drift | Affects | Add to Margin |
|---|---|---|---|
| Rtop/Rbot (FB) | ±1–2% + leakage | OVP/UVP bands | ±VOUT error budget |
| RDS(on) | +60…90% hot | OCP | Raise ILIMIT margin |
| Rsense | ±1% + temp | OCP | Adjust Vtrip |
| Sense amp | offset + noise | OCP trips | Increase tblank/RC or threshold |
| NTC network | β tolerance | OTP | ΔThyst sizing |
5) Timers, Blanking & Deglitch
Definitions
- tBLANK: leading-edge blanking to mask turn-on spike in the OCP path.
- tDEGLITCH: window filter for comparator outputs (OVP/UVP/OTP) against noise.
- tHICCUP: off-time after fault before reattempt; thermal & input recharge.
- tRESTART: controlled re-enable window (usually equals or exceeds soft-start).
Interactions with tSS & EA recovery
- Choose tHICCUP ≈ 4–8 × tSS to cool and recharge caps.
- Ensure tRESTART ≥ tSS + EA_unwind to avoid chatter on restart.
- PFM needs longer tDEGLITCH than CCM; tBLANK tied to di/dt and FSW.
Starter ranges
- tBLANK: 80–200 ns (500 kHz–2 MHz); start ≈120 ns at VIN max/hot.
- tDEGLITCH: digital rails 0.2–0.5 µs; motor/inductive 0.5–2.0 µs.
- tHICCUP: 4–8 × tSS (or fixed 10–200 ms per IC).
- tRESTART: 1–2 × tSS depending on pre-bias and PG gating.
| Load class | tBLANK | tDEGLITCH | tHICCUP | tRESTART | Notes |
|---|---|---|---|---|---|
| Quiet digital | ~100 ns | 0.3 µs | 4× tSS | 1× tSS | Tight OVP/UVP bands |
| Mixed I/O | 120–150 ns | 0.5–0.8 µs | 5× tSS | 1–1.5× tSS | Filter FB routing |
| Motor / inductive | 150 ns | 1.0 µs | 6× tSS | 1–2× tSS | Add RC on sense |
| Automotive cranking | 150–200 ns | 1.5 µs | 8× tSS | ≥1.5× tSS | Brownout ride-through |
6) Restart Policies: Hiccup / Latch / Auto-Retry
Failure trees (quick rules)
- Persistent short / severe overload → Hiccup for thermal relief and repeated attempts.
- Intermittent EMI / brownouts → Auto-retry with short cadence and good deglitching.
- Safety certification / hazard → Latch with manual clear via EN/RESET or power cycle.
User experience vs availability
- Hiccup: self-recovering, low heat; may pulse downstream rails.
- Auto-retry: quick service return; can chatter if margins are tight.
- Latch: safest/auditable; needs field reset path and clear PG messaging.
PG/FAULT behavior & memory
- PG low during fault; hiccup toggles PG on retries; auto-retry holds PG low until stable; latch keeps PG low until manual clear.
- FAULT pin is open-drain; OK to wire-OR; add debounce on noisy backplanes.
- Use sticky FAULT registers (if available) to log last-fault cause for service.
| System | Preferred policy | Retry / tHICCUP | Thermal headroom | UX note | Certification note |
|---|---|---|---|---|---|
| Consumer gadget | Auto-retry | Short cadence | Low–med | Fast recovery | — |
| Industrial motor | Hiccup | ≥6× tSS | High | Avoid coil heating | — |
| Automotive ECU | Auto-retry / Hiccup | Backoff or 6–8× tSS | Med | Ride-through | OEM profile |
| Safety-critical | Latch | Manual clear | N/A | Predictable stop | Manual reset required |
7) Fast-Short Path (Severe short response)
What happens in microseconds
- Fast comparator: hard-short threshold bypasses slow control loop.
- Gate discharge: low-impedance pull-down, shortest return to PGND.
- SW clamp: limits dv/dt and peak current; contains first spike.
- Goal: detect-to-turn-off within ~1–3 µs (family dependent).
Blanking pitfalls & coordination with current-limit slope
- Too long tBLANK: misses the first edge of a hard short.
- Too short tBLANK: switching spikes trigger false shutdown.
- Coordinate: align blanking and slope compensation with inductor di/dt; validate at VIN max/hot.
Test recipe
- Low-Z short via pulse MOSFET on Vout (2–20 µs pulses).
- Scope GATE, SW, Vout, Isense with ≥200 MHz probes.
- Capture turn-off delay, overshoot, PG/FAULT timing, and thermal under repeated pulses.
8) Interactions: Soft-Start, Pre-bias, Sequencing
Pre-bias start & reverse discharge avoidance
- When Vout is pre-charged, prevent body-diode back-discharge with ideal-diode FET/ORing.
- Disable active discharge during faults if reverse current is a risk.
- Probe for reverse current on SW/body diode at startup.
Soft-start ramp vs OCP fold-back
- Ramp too fast → inrush trips OCP; too slow → long start and potential dropouts.
- Ensure ILIMIT(startup) ≥ Iinrush + 0.5·ΔI; use fold-back if IC supports it.
- Tune CSS, Cout/ESR and startup current limit per load type.
Sequencing with Boost / LDO / VRM (PG gating)
- Use Boost PG → Buck EN, then Buck PG → downstream EN cascading.
- Block downstream start during OVP/UVP; add debounce and min-EN-pulse.
- For multi-rail systems, avoid reset storms with staged PG/FAULT and deglitch.
9) Pins & Telemetry: PG / PGOOD / FAULT / EN
Quick primer
- PG/PGOOD: asserts when Vout within regulation window; open-drain or push-pull.
- FAULT: open-drain; may be sticky (latches until cleared) or momentary.
- EN/RESET: observe min high/low pulse; some devices require hysteretic thresholds.
Wiring patterns
- Wire-OR FAULTs to one MCU input (open-drain, shared bus).
- Pull-ups: 4.7–10 kΩ typical; long/noisy backplanes may use 2.2–4.7 kΩ + RC.
- Debounce: RC 1–5 ms or digital filtering to reject hot-plug/EMI chatter.
- PG→EN gating: cascade upstream PG to downstream EN; apply min EN pulse.
Minimal supervisor network
- OR all FAULT (open-drain) → one pull-up → MCU + LED/relay.
- Comparator/supervisor sets window for critical rails; outputs gate downstream EN.
- Expose testpads for EN, PG, and FAULT; log sticky fault cause when available.
| State | Policy | PG | FAULT | EN requirement | Clear condition | Notes |
|---|---|---|---|---|---|---|
| Normal regulation | — | High | High-Z | — | — | PG may glitch at load steps if tight bands |
| OCP persistent | Hiccup | Toggles with tries | Low (momentary) | — | Auto after tHICCUP | Ensure tRESTART ≥ tSS |
| EMI/brownout | Auto-retry | Low until stable | Low (momentary) | — | Auto after retry delay | Increase tDEGLITCH if chatter |
| Safety trip | Latch | Low | Low (sticky) | EN low ≥ tmin or power cycle | Manual clear | Log fault code if available |
10) Thermal & OTP Behavior
Behavior map
- Fold-back: current derates with temperature; maintains output but reduces capability.
- Hard shutdown: fastest safe stop; may pair with latch for certification.
- Trip/clear: define Ttrip and ΔThyst with explicit clear conditions.
Hot-spot vs average
- Hot spots lead average temperature; place NTC near copper hot areas, not in direct airflow.
- Copper area & vias control diffusion; measure ΔTpath to set Ttrip.
- Validate with thermocouple/IR and on-die telemetry if available.
Setpoint & hysteresis
- Ttrip = Tallow,max − ΔTpath.
- ΔThyst ≥ ramp_rate × restart_latency (avoid temperature chatter).
- Include β tolerance of NTC, divider error, and ADC quantization (if MCU involved).
| Environment | Ttrip start | ΔThyst | Fold-back? | Sensor | Validation focus |
|---|---|---|---|---|---|
| Sealed enclosure | Lower (earlier trip) | ≥10–15 °C | Yes | Die + NTC | Soak 60 min; repeated trips |
| Ventilated chassis | Nominal | 8–12 °C | Maybe | NTC | Airflow X m/s; ramp cycles |
| Automotive engine bay | Lower | 12–18 °C | Yes | Die + NTC | Cranking heat; brownouts |
| Outdoor airflow | Nominal–higher | 8–12 °C | No/Maybe | NTC | Wind gusts; sun load |
Repeat-trip aging & validation
- Track ESR drift, magnetics heating, MOSFET threshold shifts after repeated OTP trips.
- Set max retry count or extend tHICCUP to limit thermal cycling duty.
- Run soak tests (30–60 min) and 3–10 thermal cycles; log Ttrip/clear and PG/FAULT changes.
11) Layout, EMI, and Measurement Hooks
Current sense & power path
- Rsense Kelvin: two sense traces direct to IC pins; avoid high-di/dt regions; matched length.
- Gate discharge loop: driver → gate → back to PGND by the shortest path; avoid AGND/FB.
- Local MLCC: 0.1–1 µF HF bypass at FET pins + 10–22 µF bulk; minimize loop area.
Ground & analog domain
- PGND/AGND split with a single bridge near IC; keep comparators and FB divider on the AGND island.
- Guard the SW node; avoid parallel routing with FB; add ground moat if needed.
- Probe grounds on the AGND island to reduce bounce.
EMI optimization & measurement hooks
- Minimize hot loop: VIN → HS FET → SW → inductor → Vout → return to CIN.
- dv/dt control via gate resistor / RC snubber; keep SW copper compact.
- Bode injection pad: 50–100 Ω series point at COMP/FB, with coax pads.
- Dedicated testpads: GATE, SW, Vout, Vsense, PG/FAULT, EN (low-inductance, common ground).
12) Validation Checklist (engineering)
Master checklist
- Matrix: Load(0→full→transient) × VIN(min/nom/max) × Temp(cool/room/hot).
- Fast-short: pulse MOSFET; detect-to-off ≤ µs; record overshoot & thermal.
- Hiccup: N retries; duty & peak temp within limits.
- OVP: overshoot < spec; clamp/bleed heating acceptable.
- UVP: brownout ride-through ≥ target; no reset chatter.
- OTP: soak 30–60 min + 3–10 cycles; record trip/clear temp.
- PG/SS: EN→PG delay, PG glitches count; SS slope vs I_LIMIT(startup).
Artifacts & naming
- CSV: VIN, Iload, Temp, Vsense_pk, Vout_pk, t_trip, t_clear, policy, PG, notes.
- Registers: read FAULT/STATUS after events; mark sticky bits and retry count.
- Scopes: consistent filenames with channels/temp/VIN/load/timebase.
Pass / fail thresholds
| Item | Target | Method | Pass threshold | Notes |
|---|---|---|---|---|
| Fast-short | µs-class shutoff | Pulse MOSFET | t_trip→gate-off ≤ 3 µs | VIN max/hot |
| OVP | Overshoot | Load step | ≤ X% | Clamp temp ≤ Y°C |
| UVP | Ride-through | Brownout profile | ≥ Z ms | No chatter |
| Hiccup | Thermal duty | N retries | T_hot < spec | Back-off if needed |
| OTP | Trip/clear | Soak & cycle | Within band | ΔT_hyst as designed |
| PG/SS | Timing & stability | Scopes | EN→PG ≤ target | Glitches ≈ 0 |
13) IC Selection Guide (structure slot; real PNs)
Bucket A — Built-in robust protection set
| Brand | Series / PN | OCP (type) | OVP (mode) | UVP | OTP | Fast-short | Restart | SS / PG features | Notes |
|---|---|---|---|---|---|---|---|---|---|
| TI | TPS562200 | Cycle-by-cycle (valley) | Comparator shutdown | Yes (UVLO/UVP) | Yes | High-speed CL path | Hiccup (auto-recover) | Internal SS; (PG via family variants) | 17 V in / 2 A sync buck; compact BOM |
| ST | L7987 / L7987L | Peak limit (prog.) | OVP shutdown | Yes | Yes | Fast shut via gate pull-down | Hiccup | SS pin; PGOOD | 61 V / 3 A class; industrial wide-VIN |
| Renesas | ISL85410 | Cycle-by-cycle | OVP shutdown | Yes | Yes | Fast current limit path | Auto-retry | SS cap; PG/EN pins | 40 V in / 1 A sync buck |
| onsemi | NCV890430 | Cycle-by-cycle | OVP shutdown | Yes | Yes | Gate rapid discharge | Hiccup | PG pin (variant-dep.) | 45 V in / auto battery friendly |
| Microchip | MCP16301 / MCP16301H | Cycle-by-cycle | OVP shutdown | UVLO/UVP | Yes | Sense-path fast trip | Auto-retry | Soft-start (int.); EN | 30 V non-sync buck; SOT-23-6 |
Bucket B — External sense & supervisor-friendly
| Brand | Series / PN | OCP (type) | OVP (mode) | UVP | OTP | Fast-short | Restart | SS / PG features | Notes |
|---|---|---|---|---|---|---|---|---|---|
| TI | LM5145 | Cycle-by-cycle + avg (ext. sense) | Comparator; PG gating | UVLO/UVP | Yes | Dedicated fast CL path | Configurable hiccup | PGOOD; SS pin; ext. amp friendly | 75 V sync buck controller |
| TI | LM5176 | Peak + average (shunt/DCR) | OVP shutdown | UVLO/UVP | Yes | Fast-short path (cmp → gate off) | Hiccup / auto-retry | PGOOD; SS; 4-switch BB | 55 V 4-switch buck-boost |
| Renesas | ISL81601 | Peak + average (bidirectional) | OVP shutdown | UVLO/UVP | Yes | Fast gate discharge | Auto-retry | PG; TRACK/SS; bidirectional | 60 V 4-switch BB controller |
| onsemi | NCV8871 | Cycle-by-cycle (boost) | OVP shutdown | UVLO | Yes | Fast current limit | Hiccup | EN/SS; comp pin | 40 V boost controller |
| Melexis | MLX91220 / MLX91216 | External current sensing (Hall) | — | — | Diag. flags | Fast over-current telemetry | — | Isolation-friendly; feeds supervisor | Use to enhance OCP/OTP strategy |
Bucket C — Automotive AEC-Q variants
| Brand | Series / PN | OCP (type) | OVP (mode) | UVP | OTP | Fast-short | Restart | SS / PG features | Notes |
|---|---|---|---|---|---|---|---|---|---|
| TI | LM5176-Q1 | Peak + average | OVP shutdown | UVLO/UVP | Yes | Fast-short path | Hiccup / auto | PGOOD; SS; AEC-Q100 | 55 V 4-switch buck-boost |
| TI | LM5145-Q1 / LM5146-Q1 | Cycle-by-cycle + avg | OVP shutdown | UVLO/UVP | Yes | Gate rapid discharge | Hiccup | PGOOD; SS; AEC-Q100 | 75–100 V sync buck controllers |
| TI | LM5156x-Q1 / LM51561-Q1 | Cycle-by-cycle (boost/SEPIC) | OVP shutdown | UVLO | Yes | Fast current limit | Hiccup | SS/PG; AEC-Q100 | 65 V boost/SEPIC/flyback |
| onsemi | NCV890430 | Cycle-by-cycle | OVP shutdown | UVLO | Yes | Fast pull-down | Hiccup | PG pin (variant-dep.) | Automotive battery rails |
| onsemi | NCV8871 | Cycle-by-cycle (boost) | OVP shutdown | UVLO | Yes | Fast CL path | Hiccup | EN/SS; AEC-Q | Front-end boost |
| NXP | FS5600 | Integrated limit & monitor | Supervisor OVP | UVP/UVLO | Yes | Supervisor-aided | Latch / auto configs | Multi-rail PG/WDT; AEC-Q100 G1 | Power System Basis IC style |
14) FAQs
Cycle-by-cycle OCP vs average-current limit—when to use each?
Cycle-by-cycle trips at the next PWM decision, catching sub-millisecond surges to protect FETs and magnetics—best for spiky or fault-prone loads. Average limit filters ripple to preserve throughput and reduce nuisance trips—good for motors/LEDs. Many controllers combine both: set average near thermal safe current, cycle limit above ripple crest.
Validate at VINmax/hot with square-wave steps; log ttrip, duty loss.
Valley vs peak current detection and nuisance trips.
Peak sensing reacts earlier but is vulnerable to leading-edge spikes; blanking and RC filtering are mandatory. Valley sensing inherently ignores that spike but reacts one half-ripple later, so thresholds must include ripple amplitude. On noisy boards, start with valley plus modest slope compensation; migrate to peak only after measuring spike width.
Tune tblank ≈ 3–5× spike width; verify across temp.
How fast-short shutdown cooperates with blanking windows.
A fast-short path bypasses the slow error amp: comparator → strong gate pull-down → SW clamp. Keep the blanking window short enough not to mask the first catastrophic edge, yet long enough to ignore switch spikes. For MHz bucks, start ~100–150 ns and confirm turn-off within ~1–3 µs.
Measure detect-to-gate-off delay and overshoot at VINmax/hot.
OVP clamp vs full shutdown for sensitive loads.
Clamp limits overshoot with a bleed or clamp FET and keeps the rail alive—ideal for analog rails, but it dissipates heat and can modulate ripple. Full shutdown removes drive and is safest for digital/logic rails; it causes service interruption but avoids thermal stress during faults.
Set clamp only for small overshoot; otherwise prefer shutdown.
UVP ride-through vs restart for brownouts and battery dips.
Ride-through holds regulation through brief sags using output capacitance and deglitching—good for UX continuity. Restart drops the rail and re-ramps, clearing latched faults but resetting downstream devices. Choose ride-through for digital loads with hold-up; use restart when safety or sequencing requires a clean power-on.
Size deglitch for worst sag; confirm PG behavior.
Mapping divider tolerances to precise OVP/UVP thresholds.
Start from Vout=Vref(1+Rtop/Rbot). Propagate E96 tolerances, reference accuracy, and FB bias/leakage to the threshold. Keep the FB node impedance ≤100 kΩ to limit leakage error. Target ±1–2% at the output, and verify across temperature and PCB contamination scenarios.
Guardband with worst-case Vref, bias, and temp drift.
Hiccup timing that won’t overheat during persistent shorts.
Set tHICCUP about 4–8× tSS to limit average power in a hard short and allow input caps to recharge. Verify thermal duty by measuring hotspot temperature over repeated cycles. If temperature creeps upward, extend off-time or back-off retries to keep silicon and magnetics within limits.
Log duty vs temperature; cap worst-case retries.
Latch behavior and safe manual clear strategies.
Latch keeps the rail off until a manual clear via EN/RESET or power cycle—preferred for safety-critical paths. Document the minimum EN low pulse and any timing needed for supervisors. Expose FAULT/PG pins and log the cause to aid field service and certification audits.
Provide onsite clear path and visible FAULT indication.
Pre-bias startup without reverse discharge.
When Vout is pre-charged, prevent reverse discharge through body diodes. Use an ideal-diode ORing FET or controller, and disable active discharge during faults. Verify startup with pre-bias at various levels and ensure SW/node current never flows into the load on enable.
Probe SW/body-diode current; confirm no undershoot.
OTP fold-back profiles vs hard trips in hot enclosures.
Fold-back reduces current with temperature, preserving partial service but lowering capability; good for fan failures or transient heat. Hard trips shut down quickly to protect hardware and may require manual recovery. In sealed boxes, prefer fold-back with adequate hysteresis; log Ttrip and recovery time distributions.
Set ΔThyst ≥ ramp×latency; run soak tests.
PG/FAULT truth tables and multi-rail interactions.
Hiccup toggles PG with each attempt; auto-retry keeps PG low until stable; latch holds PG low until manual clear. FAULT is usually open-drain and can be wire-ORed. Debounce PG and respect minimum EN pulses to avoid reset storms in chained VRMs or MCU domains.
Document clear conditions and PG masks.
Sense-resistor vs RDS(on) for accurate OCP across temperature.
Rsense with Kelvin routing gives best accuracy and repeatability at the cost of power loss and area. RDS(on) saves BOM but drifts +60–90% hot and varies by lot; guardband aggressively or calibrate. For higher currents, DCR sense plus NTC compensation is a low-loss middle ground.
Recheck limits at hot VIN and hot board.
EMI bursts causing false trips—filter and deglitch recipes.
Start with a small RC at the sense node, tight Kelvin routing, and leading-edge blanking around 80–200 ns. Add comparator deglitch 0.5–2 µs for inductive loads, shorter for digital rails. Validate with conducted/radiated immunity bursts and count nuisance trips against thresholds.
Correlate spike width to tblank before increasing thresholds.
Coordinating upstream Boost and downstream VRMs during faults.
Gate downstream EN from upstream PG to avoid starting into a collapsing bus. Mask downstream PG during upstream faults and enforce minimum EN pulses. On brownouts, allow ride-through at the front end while holding downstream rails off until the boost recovers and PG is stable.
Scope PG/EN edges; add debounce to shared lines.
What to log in production to track rare field faults.
Log VIN, Iload, board temperature, ttrip, tclear, PG state, and a compact fault code (OCP/OVP/UVP/OTP/retry count). Include pre-bias flag and firmware revision. Store rolling windows in non-volatile memory and export CSV during service to accelerate root-cause analysis.
Add timestamps and board serials for traceability.
15) Mini-CTA (small-batch buyers)
Need cross-brand options or stricter protection sets? Send your BOM—we return a shortlist with risk notes in 48 hours.
Submit your BOM (48h)