123 Main Street, New York, NY 10001

← Back to: eFuse / Hot-Swap / OR-ing Protection

What Is Reverse Polarity Protection?

Reverse polarity protection is a safeguard mechanism that prevents damage to electronic systems when the power supply’s polarity is accidentally reversed. Without this protection, critical components like MOSFETs, voltage regulators, or microcontrollers can be irreparably damaged due to reverse current flow.

In real-world environments—especially in automotive, battery-powered, or field-serviceable devices—misconnection is a common risk. Users may reverse battery terminals, connect DC power plugs backward, or create momentary polarity inversion during hot-swaps. These mistakes can destroy semiconductors, burn traces, or compromise system integrity.

To mitigate these risks, reverse polarity protection is designed into the input stage using one of three common strategies:

  • 🟡 Schottky diode: Simple and cheap, but suffers from high voltage drop and power loss.
  • 🟢 Ideal diode controller + external MOSFET: Offers low drop and fast switching, suitable for high-reliability systems.
  • 🔵 Active reverse-MOS switch: Actively driven MOS to disconnect under reverse voltage; requires more logic but very efficient.
Reverse Polarity Fault Risk Overview Illustration of typical reverse polarity fault scenarios and current paths, showing reversed battery, damaged load, and lack of protection. Reversed Battery + Unprotected Load 💥 Without protection, reversed input causes destructive current flow through body diodes or vulnerable IC pins.
Figure: Illustration of typical reverse polarity fault scenarios and current paths.

Ideal-Diode vs. Active-MOS Topologies

Reverse polarity protection can be implemented through various circuit topologies, each offering different trade-offs in terms of voltage drop, response speed, and implementation complexity. The three most common are passive diode protection, ideal-diode controllers with external MOSFETs, and active-MOS configurations.

Passive diode protection is the simplest form—typically using a Schottky diode in series with the input. While cost-effective, this approach suffers from a fixed forward voltage drop of 0.3–0.7V, causing efficiency loss and thermal issues under high current.

Ideal-diode controllers actively drive an external N-MOSFET to mimic an ideal diode. These controllers detect the voltage polarity and rapidly enable or disable the gate to ensure low voltage drop (as low as 20mV) in the forward direction, and fast cutoff during reverse conditions—making them suitable for automotive, battery, and high-efficiency applications.

Active-MOS topologies implement reverse protection logic using either high-side or low-side MOSFETs, controlled by comparator or discrete logic. While flexible, they may introduce latency due to sensing and decision-making circuitry. Still, this approach is common in MCU-controlled systems or cost-optimized designs.

The table below compares these topologies across key metrics like voltage drop, speed, power loss, complexity, and PCB footprint.

Reverse Topology Comparison Comparison of diode-based, ideal-diode, and active-MOS reverse polarity protection circuits. Passive Diode Ideal Diode + MOS Active Reverse MOS Vin+ 0.6V drop Output Vin+ N-MOS Controller Output ~20mV drop Vin+ P-MOS Logic Output ~50–100mV drop Diode: simple but lossy · Ideal Diode: efficient, fast · Active-MOS: flexible but timing-sensitive
Figure: Comparison of diode-based, ideal-diode, and active-MOS reverse polarity protection circuits.

Each topology serves different application priorities. In the next section, we’ll explore how to choose between them based on system requirements and practical trade-offs.

Key Design Considerations

While topology selection is a critical first step, effective reverse polarity protection also depends on nuanced design decisions. These include the voltage drop under normal operation, body diode behavior, gate control timing, and mechanical considerations like packaging and thermal dissipation. Here’s what you must evaluate carefully:

Voltage Drop Impact: Excessive forward drop across the protection element may reduce the available voltage to downstream components like PMICs, MCUs, or LDOs. Even a 0.3V loss can prevent proper startup in low-voltage systems, especially in cold-crank or battery-discharge conditions.

Reverse Current Blocking Integrity: Many MOSFETs have an internal body diode between drain and source, which will conduct if the gate is not properly biased. This diode can inadvertently allow reverse current to pass through before the controller reacts—leading to a “leaky” protection state.

Control Logic & Sensing Path: Ideal-diode controllers typically compare Vin and Vout or sense the direction of current. Designers must account for comparator delay, gate driver strength, and overshoot conditions. External sense resistors or Kelvin connections may improve detection speed.

Fail-Safe Design: Consider what happens if the MOSFET fails short or the gate becomes floating. Add gate pulldowns, zener clamps, or watchdog resets to ensure the reverse path cannot be unintentionally enabled. In automotive designs, ISO 7637/ISO 16750 transient compliance must also be ensured.

Packaging and Thermal Constraints: For applications exceeding 1A, thermal performance becomes critical. Choose MOSFETs with low RDS(on) in packages like DPAK, PowerSO-8, or DFN with exposed pads. Check RθJA and thermal derating curves under expected ambient temperature. For car-grade systems, confirm AEC-Q100 qualification and leakage specifications across temperature.

MOSFET Body Diode Behavior in Reverse Polarity How body diode and control gate interact in reverse-polarity scenarios. Without Gate Control With Gate Control MOSFET (G floating) Reverse current flows via body diode MOSFET (Gate pulled low) Reverse current blocked Gate controlled by reverse sense Always ensure gate control disables conduction during reverse polarity to avoid leakage through the body diode.
Figure: How body diode and control gate interact in reverse-polarity scenarios.

Timing is critical—if your protection circuit reacts too late, even microseconds of leakage can be catastrophic. Let’s now examine how fast switchover behavior affects performance and safety.

Fast Switchover & Startup Behavior

In reverse polarity protection, reaction time is everything. A delayed response can result in damaging reverse current flowing through the body diode before the MOSFET is properly turned off. Since polarity shifts often happen in milliseconds or less—like battery insertions or field connections—the switchover must be immediate.

Ideal-diode controllers typically detect a voltage drop (ΔV) between input and output rails to determine whether to enable or disable the MOSFET. The controller’s internal comparator monitors this voltage and, upon detecting valid forward conditions, rapidly turns on the gate. The detection threshold and comparator hysteresis significantly impact both performance and stability.

Several factors contribute to switching delay: comparator response time (typically 100–500 ns), gate driver strength, and MOSFET Cgs. Larger FETs with higher gate capacitance may slow down the transition unless actively pulled with a strong driver. Designers should size the gate resistor and driver current accordingly.

Another common challenge is soft-start compatibility. If the upstream regulator slowly ramps up its output voltage, the controller might misinterpret this as a reverse condition and block conduction. Solutions include: adding a startup blanking time, choosing a controller with programmable thresholds, or implementing external delay logic.

Lastly, the PG (Power Good) signal should reflect actual readiness of the output, not just voltage presence. It’s best to assert PG only after the MOSFET has fully turned on and the output is stable. Otherwise, downstream circuitry may attempt to operate prematurely and trigger brownout resets or latch faults.

Fast Switchover Timing Behavior Response behavior of a fast switchover reverse protection IC during power transitions. Vin (ramp with soft-start) Vout (delayed response) PG asserted ΔV threshold crossed MOS turns on Vin (input) Vout (output) PG (Power Good) Controllers must react within microseconds to ensure seamless switchover and protect downstream circuits.
Figure: Response behavior of a fast switchover reverse protection IC during power transitions.

With timing behavior addressed, we can now explore ICs from seven major vendors that offer fast protection, low drop, and scalable features for automotive and industrial systems.

Reverse Battery Protection ICs from 7 Brands

Reverse polarity protection solutions vary across semiconductor brands. Some ICs integrate the protection MOSFET and control logic, while others act as controllers for external MOSFETs—especially in high-voltage or automotive environments. Below is a brand-by-brand overview and IC matrix for quick comparison.

Swipe to scroll horizontally →
Brand Model Vin Range I Limit MOS Type Package AEC-Q PG / Fault Bidirectional
TI TPS2662 4.5–60V 2–6A adj Internal HTSSOP Yes Yes No
TI LM74502-Q1 3.2–65V Ext MOS External VSON Yes Yes No
ST STEF01 3.5–18V Adjustable External SO-8 Yes Yes No
ST STEF033 3.5–10V Fixed External SOT-23 No No No
NXP NX5P3090 2.5–20V 3.0A Internal WLCSP No Yes No
Renesas ISL6146 9–75V Ext MOS External DFN Yes Yes Yes
Renesas RAA489206 3–35V 3A integrated Internal QFN Yes Yes Yes
onsemi FPF1320 1.2–5.5V 2.0A Internal UDFN No Yes No
onsemi NCP361 2.2–5.5V 1.5A Internal TSOP No No No
Microchip MIC2042 2.5–5.5V 2.0A Internal MSOP No Yes No
Microchip MIC28514 4.5–60V Ext MOS External QFN No Yes Yes
Melexis MLX80051 5–27V LIN domain Integrated DFN Yes No No

Automotive-grade with external MOS: Choose TI LM74502-Q1 or Renesas ISL6146 for robust, high-voltage input paths.

USB/portable devices: NXP NX5P3090, onsemi FPF1320, or Microchip MIC2042 are optimal for compact, low-voltage protection.

High-integration & dual-direction support: Consider Renesas RAA489206 or Microchip MIC28514.

Comms transceivers: Melexis MLX80051 protects LIN/CAN power rails with built-in reverse blocking and fault immunity.

Request a Quote

Accepted Formats

pdf, csv, xls, xlsx, zip

Attachment

Drag & drop files here or use the button below.

How to Test Reverse Protection Effectiveness

Evaluating reverse polarity protection goes beyond verifying basic conduction. Real-world fault conditions—such as fast transients, soft-start interaction, and body diode leakage—must be tested to ensure the IC truly blocks reverse current without causing downstream damage.

A basic test involves applying a negative input voltage (e.g., –12V or –24V) and observing whether the output remains at 0 V and the PG/Fault signals behave correctly. Use a differential voltage probe across the FET to monitor VDS and check for leakage current in the microamp range.

Key Indicators:
• Output remains blocked (VOUT ≈ 0V)
• PG/Fault goes low when reverse is detected
• No heating at the MOSFET over 10–60s injection
• Leakage current stays <10μA (for high-impedance loads)

For automotive systems, validation must include immunity to pulses defined in ISO 7637 (Pulse 1, 2a, 2b, 3a/b) and IEC61000-4-5 (common-mode surge). Inject the pulse onto the VIN line and verify that the reverse-blocking state holds even under ±1kV CM surges.

Recommended tools include a programmable bipolar power supply, a differential oscilloscope probe, and thermal imaging. Trigger the oscilloscope on VIN inversion and overlay PG/Fault/VOUT for synchronized diagnosis.

Reverse Fault Testbench and Waveform Snapshot Bench setup for validating reverse polarity protection using real-world fault injection. Programmable Bipolar Supply –24V / +40V Sweep Reverse Protection DUT Vin Vout Oscilloscope PG / Vout / Vds Thermal Camera Check for heating Vout waveform PG/Fault Observe reverse-block integrity, PG delay, and Vout suppression during test events.
Figure: Bench setup for validating reverse polarity protection using real-world fault injection.

Different application domains—from USB to industrial to automotive—require distinct protection strategies. Let’s now explore which reverse-blocking patterns show up in sibling systems.

Frequently Asked Questions

Which ICs support automotive-grade reverse protection with AEC-Q qualification?

Devices like TI’s LM74502-Q1, Renesas ISL6146, and ST’s STEF01 are AEC-Q qualified. They meet the temperature and EMI standards required for in-vehicle applications and often support high-voltage ranges and fault diagnostics.

Can I replace a discrete diode with an ideal-diode controller for better efficiency?

Yes. Ideal-diode controllers like TI’s LM74502-Q1 allow you to use low-RDS(on) MOSFETs for minimal forward drop, improving efficiency dramatically over Schottky diodes, especially at high current.

Will reverse protection ICs interfere with my upstream soft-start regulator?

Possibly. If the input voltage rises slowly, the controller may delay turning on the output due to insufficient ΔV detection. Look for ICs with blanking time or programmable thresholds to avoid false detection during soft-start.

How do reverse protection circuits behave during dual battery switchover?

Good ICs with fast switchover maintain output stability by quickly detecting polarity changes and avoiding body diode conduction. Priority OR-ing may be required when switching between main and backup sources.

Can any reverse protection ICs allow bidirectional current for charging and discharging?

Yes. Some ICs like Renesas RAA489206 or Microchip MIC28514 allow bidirectional flow, but most protection ICs block reverse current completely. Always check the datasheet for directionality and reverse-block configuration.

Are there reverse protection solutions built into communication ICs like CAN transceivers?

Yes. Devices like Melexis MLX80051 integrate reverse blocking into their LIN/CAN transceivers, protecting the Vbat supply pin. This simplifies the BOM for automotive modules.

What’s the best way to simulate reverse voltage in a testbench?

Use a programmable bipolar supply (e.g., Keysight N6781A) to inject –12V to –40V across VIN. Monitor the output with differential probes and log PG/Fault signals to verify proper blocking and timing behavior.

Why does my PG signal stay high during a reverse event?

PG may be misconfigured or referenced incorrectly. In some ICs, PG is pulled high by default and only deasserted when Vout crosses a threshold. Ensure PG is tied to the correct logic rail and timing is validated.

How can I detect μA-level leakage during reverse polarity conditions?

Place a high-value resistive load on the output and use a precision ammeter or a low-offset current sense amplifier to measure leakage. Expect <10μA if the IC is functioning correctly.

My MOSFET heats up slightly in reverse mode—what could be wrong?

The body diode may still be conducting due to slow gate turn-off or faulty logic. Check if the controller pulls the gate low fast enough, or if there’s an unexpected pull-up path keeping the FET partially on.

What’s a good switching time target to block reverse voltage spikes?

Ideally, the IC should respond in under 1μs. Look for datasheets specifying comparator and gate-drive delays. For ISO pulse compliance, <500ns is preferred to suppress spike conduction through body diodes.

Are there any ICs that combine USB input protection with reverse blocking?

Yes. NXP NX5P3090 and onsemi FPF1320 offer reverse protection, current limiting, and short-circuit detection in one package—ideal for USB ports, PD adapters, and battery chargers.