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Why Self-Test Matters

Build a repeatable, measurable self-test loop around three paths—thresholds, reset, and watchdog—to raise first-pass yield, reduce false resets, and cut FRU recovery time. This page is scoped to detectability and testability for those three paths only (no multi-rail sequencing, reset tree fanout, or RTC details here).

Failure Modes

  • UV/OV drift; window threshold chatter
  • Late/early reset; delay instability vs ramp
  • WDT feed errors (early/late/missed)
  • Reset-cause overwritten or lost
  • Temp drift and ripple coupling

Detectability Matrix

Stimuli: DAC steps / ladder / source-measure
Observables: PG / RESET / WDT / local log

Metrics

  • Coverage = detected / key failure cases
  • False-reset rate (per hour)
  • Critical-point repeatability (σ / Hyst)
  • FRU self-test elapsed time

Target KPIs: false-reset rate < 1e-6/h; 3σ of trip point ≤ 30% of Hyst; field FRU self-test ≤ 2 minutes.

Self-Test Coverage Map Failure modes (rows) vs stimuli and observables (columns). Cell shading shows coverage level: none/low/medium/high. Self-Test Coverage Map DAC Ladder Source PG RESET WDT/Log UV/OV drift Window chatter Late/early reset WDT early/late/miss Reset-cause lost Temp/ripple coupling Legend: none / low / medium / high coverage
Failure modes to test-method coverage heatmap for supervisors/watchdogs.

Threshold Injection Basics

Inject UV/OV/window thresholds, hysteresis and delay without disturbing rail impedance or loop stability. We cover single-rail techniques (no multi-rail dependencies here).

Trip point model:

V_trip(actual) = V_set × (1 ± Acc%) ± ΔT × (ppm/°C) ± Tol_divider ± I_in × R_src

“No-chatter” hysteresis rule-of-thumb:

Hyst ≥ 1.5 × max( V_ripple(pk-pk), V_ramp_noise )

SOP

  1. Programmable DAC → isolation switch → divider node (or SMU sweep)
  2. Bypass/decouple large caps or add series isolation to protect phase margin
  3. Measure up- and down-sweeps, record trip and retrip to get Hyst
  4. Add ripple 20–50 mV @ 100–500 kHz and repeat
  5. Test −40/25/85/125 °C; ≥10 reps per point for mean/σ
  6. Separate delay vs voltage by re-running at slow (1–5 mV/ms) and fast (≥100 mV/ms) ramps

Acceptance

  • Up/down delta ≤ 40% of Hyst
  • Injection path induced error ≤ 0.5% × V_set
  • No false resets at max ripple or within project PPM budget

Pitfalls → Fix

  • Injection loading → buffer/high-Z source; cross-check with bypassed path
  • Divider leakage/offset → evaluate I_in × R_src; consider buffer
  • Ripple injected upstream → inject at the DUT node, not only at the source
  • Delay misread as drift → compare slow vs fast ramps at the same setpoint
Rail V_set Acc% ppm/°C Hyst Delay V_trip↑ V_trip↓ Δ(V↑−V↓) Temp (°C)
VDD_5V 4.65 V ±1.0% 50 60 mV 20 ms 4.66 V 4.60 V 60 mV 25
VDD_3V3 3.10 V ±1.5% 70 40 mV 15 ms 3.13 V 3.09 V 40 mV -40
Threshold Injection & Isolation Programmable DAC or SMU injects into divider via isolation; large caps bypassed or isolated; measure up/down trips and retrip to get hysteresis without disturbing rail impedance. Threshold Injection & Isolation DAC / SMU Isolation Divider node Supervisor PG / RESET WDT / Log Large cap bypass/series Sweep up/down; record V_trip↑, V_trip↓ → Hyst Add ripple 20–50 mV @ 100–500 kHz; test −40/25/85/125 °C Compare slow vs fast ramps to separate delay vs drift
DAC/ladder injection with isolation to avoid rail impedance disturbance.

Automated Sweeps & Coverage

Establish a fully automated plan that spans three axes—ramp slope, temperature, and ripple—to quantify stability and jitter of trip point, hysteresis, and delay. We only measure detectability quality here; higher-level restart behavior is out of scope.

Recommended DoE

  • Ramp: slow 1–5 mV/ms; fast ≥100 mV/ms
  • Ripple: 20 / 35 / 50 mV (pk-pk) at 100–500 kHz
  • Temp: −40 / 25 / 85 / 125 °C
  • Repeats: ≥10 per point (borderline: 30)

Recorded Metrics

  • V_trip↑, V_trip↓, Hyst = V_trip↑ − V_trip↓
  • Reset/PG delay distribution (mean/σ)
  • Chatter (toggle counts), false resets, late/early reset events

Pass/Fail Criteria

  • 3σ ≤ 0.3 × Hyst
  • Chatter = 0; false resets = 0
  • Late/Early reset within spec or project PPM limit

Automation hooks: SCPI control of SMU/function generator (ripple), electronic load, and temperature chamber. Export CSV/JSON per sweep ID with timestamps. Use scope/datalogger triggers to collect trip markers and build result bins.

Sweep ID Ramp (mV/ms) Ripple (mV@kHz) Temp (°C) V_trip (mean/σ) Chatter count Pass/Fail
SP-001 3 20@200 25 4.642 V / 6 mV 0 Pass
SP-002 120 50@400 85 4.651 V / 9 mV 0 Pass
Sweep Timeline & Result Bins Up/down ramp with injected ripple, trip markers, and right-side distribution bins for mean/σ; criteria annotate chatter=0 and 3σ ≤ 0.3×Hyst. Sweep Timeline & Result Bins Slow ramp (1–5 mV/ms) Fast ramp (≥100 mV/ms) Injected ripple (20–50 mV @ 100–500 kHz) Trip↑ Trip↓ Distribution bins 3σ ≤ 0.3 × Hyst Chatter = 0 False resets = 0 Automate via SCPI; export CSV/JSON per sweep ID with timestamps and markers.
Up/down ramp with ripple injection and trip distribution bins.

Watchdog Fault Injection

Validate simple WDT and windowed WDT under early, late, and missed feeds. The goal: illegal feeds must reset; legal feeds never false-trigger; reset latency stays within spec (±10%).

Simple WDT

  • Missed feed: must assert Reset/IRQ
  • Early feed: allowed for simple WDT; no false reset
  • Measure trigger→reset latency

Windowed WDT

  • Early (forbidden window) → must reset
  • Late (after open window) → must reset
  • Edge jitter: legal feeds with ±Δt must not false-trigger

Acceptance

  • Illegal feed pass-through = 0
  • Legal feed false reset = 0
  • Reset latency within ±10% of datasheet spec

Script hooks: SCPI timers + MCU timestamping; independent timebase for window-WDT; ≥10 runs per case (window edges: 30). Record reset-cause where available and verify W1C clear after persistence.

Mode (simple/window) Timeout (ms) Injection (early/late/miss) Expected Observed Reset delay (ms) Pass
simple 120 miss Reset Reset 118 Yes
window 80 early Reset Reset 78 Yes
Windowed Watchdog Timing Forbidden and allowed windows with three faulty feed waveforms (early/late/missed); reset assertion and latency annotated within ±10% spec. Windowed Watchdog Timing Time → Forbidden window Allowed window Forbidden window Early Legal Late Timeout (miss) RESET response (±10% latency) Illegal feeds → Reset (pass-through = 0) Legal feeds → No false reset Reset latency within spec ±10%
Windowed watchdog timing with early/late/missed feeds and reset response.

Reset-Cause Readback & Logging

Ensure every reset has traceable evidence and a race-safe “read → verify → write-1-to-clear → persist” flow. Focus only on Supervisor/WDT/external reset cause bits; RTC/time-stamp details are out of scope.

Stage-0 Minimal Loop

  1. Early read: at the earliest boot point, read cause register (POR/BOR/WDT/EXT).
  2. Classify: map bit-fields to standard event classes; allow multi-bit combos.
  3. Cache-then-clear: buffer to SRAM/EEPROM/FRAM before any W1C.
  4. Brown-out safe: if supply unstable, write only to a ring buffer; defer commit.
  5. Atomic W1C: read-modify-write masks; verify by post-read.
  6. Persist: evidence tuple (cause_bits, source_path, boot_id, stage, crc/hash).

Acceptance (KPI)

  • Single-board evidence present for any reset path
  • No causal loss under brown-out (ring buffer → later commit)
  • No overwrite of concurrent bits after W1C (mask verified)

Pitfalls → Fix

  • Clearing before logging → cache then W1C
  • Multi-bit overwrite → mask-based W1C + pre/post read
  • Power-loss writes → ring buffer + CRC and replay on boot
  • Late boot read → move to Stage-0, no FS dependency
Cause bit Meaning W1C? Source path Test case ID Persisted? Notes
POR Power-on reset Yes Supervisor RC-01 SRAM→EEPROM Verify first boot counter
BOR Brown-out reset Yes (mask) Supervisor RC-02 Ring buffer Commit after stable PG
WDT Watchdog reset Yes (mask) WDT block RC-03 SRAM→EEPROM Check window mode flag
EXT External reset pin Yes EXT pin RC-04 SRAM Debounce duration recorded
Reset-Cause Read → Verify → Clear → Persist Swimlane of Bootloader/MCU, Supervisor, and Storage showing boot-time cause read, classification, cache, masked write-1-to-clear, and persistence. Reset-Cause Evidence Flow Bootloader / MCU Supervisor Storage Read cause (POR/BOR/WDT/EXT) Classify & cache (SRAM/FRAM) W1C (mask) + post-read verify Persist + hash signature Status bits exposed; W1C requires read-modify-write Concurrent events preserved by masks Ring buffer under BOR; commit after PG stable CRC/hash; boot_id & stage included
Boot-time reset-cause read, verify, write-1-to-clear and persist flow.

Production Hooks & Field Service

Convert lab self-tests into a Golden-Sequence usable on the line and in the field. ICT fixtures and FRU scripts share the same evidence model and signature format. JTAG/boundary-scan specifics are intentionally out of scope.

Factory Self-Test (FST)

  1. Micro-sweep: 5–7 points within ±3% of V_set (up/down) → confirm Hyst & 3σ
  2. WDT injection: simple/ windowed (early / miss / late)
  3. Cause match: observed bit-map vs expected matrix
  4. Signature: key values + cause_bits + version hash → store
  5. Failure path: step re-run → sequence re-run → reject

FRU Quick Script (≤2 min)

  1. 3-point threshold probe at V_set−Δ / V_set / V_set+Δ (up/down)
  2. 1 WDT edge-case injection (boundary of window)
  3. Read reset-cause; compare against expectation
  4. Export CSV/JSON + mini-signature; attach board temp

Acceptance (KPI)

  • In-lot repeatability: 3σ ≤ 0.4% × V_set at key points
  • WDT: illegal feeds reset; latency within ±10%
  • Signatures: factory ↔ FRU comparable by the same schema
Station Step Stimulus Expected Observed Signature Pass
ICT Threshold micro-sweep V_set±3%, 5–7 points, up/down Hyst & 3σ within limits Hyst=60 mV; 3σ=14 mV ae3d… hash Yes
ICT WDT injection early / miss / late Reset; latency ±10% Reset; 118 ms b94a… hash Yes
FRU 3-point + 1×WDT + cause ΔV around V_set; boundary feed Match cause; pass window Matched; latency OK mini-sig d2f1… Yes
Factory & Field Hooks Left: ICT connection points and golden-sequence. Right: FRU minimal path with 3-point threshold probe, 1 WDT injection, reset-cause readback, and signature. Factory & Field Hooks ICT · Golden-Sequence Micro-sweep: 5–7 pts within ±3% of V_set WDT injections: early / miss / late Cause match vs expected matrix Signature: values + cause_bits + hash FRU · ≤ 2 min 3-point thresholds around V_set 1× WDT at boundary Read reset-cause; compare Export CSV/JSON + mini-signature In-lot repeatability: 3σ ≤ 0.4% × V_set WDT latency within ±10% spec
Factory golden-sequence and field FRU re-validation minimal path.
Submit your BOM (48h)

Feature Mapping (Self-Test & Diagnostics)

Use this table to shortlist parts by threshold programmability, window supervision, and WDT type, then gate by reset-cause readability, AEC-Q100 grade and package height. Notes explain why each PN fits self-test/diagnostics workflows.

Brand Family / PN Threshold programmability Window supervisor? WDT type Reset-cause readable AEC-Q100 grade Pkg height Datasheet Notes (why selected)
TI TPS37-Q1 / TPS38-Q1 Delay/Hyst pins; per-rail options Yes (variants) External (pair with WDT) Grade 1/2 (device-dep.) Low (SOT/DFN) TPS37-Q1 PDF / TPS38-Q1 PDF Window/precision UV/OV for threshold injection & delay jitter tests.
TI TPS389x-Q1 (e.g., TPS3890-Q1) Fixed/accurate; configurable delay No External (pair with WDT) Grade 1/2 Very low TPS3890-Q1 PDF Clean ±3% micro-sweep baseline; great for FRU quick checks.
TI TPS386000 Multi-rail timing/threshold config Yes (multi-rail) External (pair with WDT) TSSOP PDF Parallel coverage for multi-rail test matrices; PG aggregation.
TI TPS3436-Q1 (Window WDT) Windowed WDT Status readable (MCU) Grade 1/2 Small DFN PDF Ideal for early/late/miss feed injections; “illegal feed ⇒ reset”.
ST STM703 / STM706 Fixed thresholds; delay options No External (pair with WDT) SOT-23 STM703 PDF / STM706 PDF uP supervisors for Stage-0 baseline; robust for ±3% micro-sweep.
ST STWD100 / STWD180 / STWD912 Independent / Window WDT MCU readable Tiny (SOT/DFN) STWD100 / STWD180 / STWD912 Window mode supports strict illegal-feed testing in production.
NXP FS85 / FS84 / FS66 / FS56 (Safety PMIC) I²C/Reg programmable Yes Windowed WDT Yes (regs) Grade 0/1 QFN/LQFP FS84/FS85 / FS66 / FS56 End-to-end self-test with cause readback & W1C integration.
NXP PF5020 / PF8100 (PMIC) Programmable (I²C) Per-rail windowing (family-dep.) Integrated WDG (family-dep.) Yes (status regs) Low QFN PF5020 / PF8100 Multi-rail micro-sweep + PG aggregation diagnostic friendly.
Renesas ISL88002/003/021/031 Fixed/precision; delay options No External (pair with WDT) SOT/DFN ISL88002/3 / ISL88021/31 Low-drift thresholds—great for high-temp stability sweeps.
Renesas RAA271000 / RAA271082 (PMIC) Reg programmable Multi-rail supervision Integrated WDG Yes (regs + W1C) Grade 1/2 (device-dep.) QFN RAA271000 / RAA271082 Cause bits + W1C match Stage-0 evidence chain.
onsemi NCP302 / NCP303 / NCP304 Fixed; delay variants No External (pair with WDT) SOT-23/SC70 NCP302 / NCP303 / NCP304 Cost-effective micro-sweep baseline; simple FRU scripts.
onsemi NCV809 / NCV811 / NCV8110 Fixed; automotive variants No External Grade 1/2 Ultra-low NCV809 / NCV8110 Height-restricted boards; drop-in car-grade supervisors.
Microchip MIC2775 / MIC2776 (Dual supervisor) Two thresholds; delay control Window-like (dual rails) External/MCU MSOP/DFN MIC2775 / MIC2776 Dual thresholds useful for window-style coverage.
Microchip MCP1316 / MCP1318; MCP130/131 Fixed; some delay options No WDT + reset (family-dep.) MCU readable SOT/DFN MCP130/131 / MCP1316/1318 Combines WDT + reset path to simplify FRU sequences.
Melexis MLX81116 / MLX8111x (LIN body SoC) System-level (via regs) System-level Integrated WDG (SoC) Yes (SoC regs) QFN MLX81116 When main controller is Melexis SoC, reuse internal WDG/Diag; pair with discrete supervisor if needed.

Tip: For second-source migration, first match RESET polarity, PG semantics, WDT window logic, then verify pins. Run the minimal golden-sequence before release.

BOM & Procurement Notes

BOM essentials
  • V_rail, n_rails, threshold tolerance (±%), Hyst/Delay
  • Output type (OD/PP), WDT type (simple / window)
  • AEC-Q100 grade (0/1/2…), package height
  • Second source (Y/N) + pin/semantics compatibility statement

Optional: I²C/PMBus (thresholds/delays), reset-cause readable/latchable, fixture access pins (inject/measure/reset).

Risks & mitigations
  • Pin/semantics mismatch → map a “minimal golden sequence” first (three threshold points + 1×WDT + cause readback + W1C).
  • EOL/MOQ → maintain a “second-source equivalence table” and lock the substitution priority.
  • Fixture variance → standardize SCPI/CSV fields, sampling cadence and timeouts; keep a dedicated script for FRU ≤ 2 minutes.

Ready to validate with a 48-hour loop? Submit your BOM and we’ll return a cross-brand shortlist aligned to your self-test hooks.

Submit your BOM (48h)
TI TPS38-Q1 Window supervisor Supports threshold micro-sweeps and delay jitter checks; clean window semantics for pass/fail bins. Yes (grade-dep.) Low PDF
TI TPS3436-Q1 Window WDT Enforces illegal-feed ⇒ reset; perfect for early/late/miss fault injection in FST/FRU scripts. Yes Small DFN PDF
ST STWD100 / STWD912 WDT (independent/window) Window option for strict timing acceptance; independent type for baseline miss-feed checks. Tiny STWD100 / STWD912
ST STM706 uP Supervisor Simple, repeatable thresholds for ±3% sweeps; ideal FRU anchor. SOT-23 PDF
NXP FS85 / FS84 Safety PMIC (supervisor+WDT) Registers expose status/cause; tight WDT windowing for production bins. Grade 0/1 QFN/LQFP PDF
NXP PF5020 PMIC (multi-rail) Programmable thresholds; PG aggregation favors coverage maps. QFN PDF
Renesas ISL88021 / ISL88031 Supervisor (precision) Low drift helps high-temp sweep repeatability (3σ). DFN/SOT PDF
Renesas RAA271000 PMIC + WDG Cause bits + W1C fit Stage-0 evidence model. Grade 1/2 QFN PDF
onsemi NCP302 / NCV809 Supervisor Fixed thresholds for quick pass/fail at ±3% points. (NCV) Yes Ultra-low NCP302 / NCV809
Microchip MIC2776 Dual supervisor Two thresholds emulate window coverage; good for migrations. MSOP/DFN PDF
Melexis MLX81116 SoC (LIN; WDG/Diag) Reuse internal WDG/Diag when SoC is main controller; pair with discrete supervisor as needed. QFN PDF

Replace each “PDF” with the official datasheet URL and keep rel="nofollow noopener". For second-source, attach your minimal golden-sequence result to the RFQ.

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FAQs — Self-Test & Diagnostics

How do I inject UV/OV thresholds without disturbing the rail impedance?

Inject with a DAC or source-measure unit through a high-impedance buffer and isolation switch into the divider node, and temporarily bypass large capacitors. Keep the stimulus equivalent source resistance ≤10% of the node impedance and bound offset via ΔV≈Iin·Rsrc ≤0.5%·Vset. Sweep up/down and repeat with ripple. See threshold-injection and table T1.

What hysteresis is “just enough” when ramps are slow and ripple is 20–50 mV?

Use Hyst ≥ 1.5×max(Vripple,pk-pk, Vramp_noise). For 1–5 mV/ms ramps, include ADC sampling jitter and comparator input noise in Vramp_noise. Acceptance: chatter count = 0 and trip 3σ ≤ 0.3×Hyst across temperature and slopes. Validate with the DoE in sweep-plans.

How do I plan up/down sweeps and choose ramp slopes to expose chatter?

Use a three-factor DoE: slow ramps 1–5 mV/ms, fast ramps ≥100 mV/ms; ripple 20/35/50 mV at 100–500 kHz; temperatures −40/25/85/125 °C. Repeat ≥10 per point, record mean/σ and chatter events. Pass when chatter = 0 and 3σ ≤ 0.3×Hyst. See sweep-plans and T2.

When should I pick ±1% vs ±1.5% threshold accuracy in automotive rails?

Build a full budget: device accuracy, divider tolerance, temp drift, and injection offset. If “3σ + aging drift” approaches 0.3×Hyst, choose ±1% to protect margins; otherwise ±1.5% improves availability and second-source options. Confirm with micro-sweeps and temperature points. See threshold-injection and BOM.

How do I translate ppm/°C into mV drift on a 5 V supervisor threshold?

Use ΔV = Vset × (ppm/°C × 10⁻⁶) × ΔT. Example: 50 ppm/°C over 100 °C on 5.00 V → 25 mV drift. Acceptance: |ΔVmeas − ΔVcalc| ≤ 30% at temperature corners. Capture results in T1 per rail and correlate with hysteresis. See threshold-injection.

What’s a safe delay/blanking to avoid false resets on pre-biased rails?

Set blanking ≥ 3× the largest RC discharge constant of the input network plus the comparator sampling window. Add “power-up inhibit” and PG de-bounce when soft-start or pre-bias exists. Acceptance: no false resets across slopes and temperatures. Validate per threshold-injection and sweep-plans.

How do I size the divider to limit leakage error on a 1 MΩ-class input?

Ensure the divider’s Thevenin resistance is small versus the input leakage: pick Rtop∥Rbot ≪ Vset/(10×Iin). Bound offset via ΔV≈Iin·Rsrc ≤ 0.5%·Vset. If power allows, buffer the divider or add a small series resistor to the sense pin. See threshold-injection.

Does OTP-fixed threshold beat I²C-programmable for stability and spread?

OTP reduces part-to-part spread and guarantees power-on determinism; programmable thresholds accelerate bring-up, multi-rail tuning, and field calibration. Typical flow: use programmable during self-test, then freeze via OTP or locked registers for production. Re-verify with the minimal golden-sequence. See brand-mapping and BOM.

How do I structure watchdog fault-injection for window vs simple WDT?

Simple WDT needs miss-feed and early-feed tests; windowed WDT defines allowed and forbidden windows, then inject early, late, and edge-jitter cases. Acceptance: every illegal feed must assert reset and reset delay must meet data-sheet ±10%. Record in T3. See wdt-fault-injection.

What’s a robust acceptance criterion for self-test pass/fail at −40~+125 °C?

Require chatter = 0 at all corners; trip 3σ ≤ 0.3×Hyst; reset delay within spec ±10%; measured drift vs calculation ≤30% at extremes. Sample size ≥10 per DoE point, logging means/σ and temperature. Gate release on these metrics. See sweep-plans and threshold-injection.

How do I log reset-cause codes so power-loss cannot erase the evidence?

In Boot Stage-0, read cause registers, classify POR/BOR/WDT/EXT, then persist to SRAM/FRAM/EEPROM ring buffer before any W1C. Under unstable power, cache to a small buffer, then commit when supply is safe. Each reset path must leave single-station evidence. See reset-cause and T4.

Can I reuse the ADC sense divider for the supervisor without skewing trips?

Shared dividers add sampling currents and alter the node’s Rsrc, shifting trip points. If reuse is necessary, use a high-impedance ADC front-end with sample-and-hold, or buffer the supervisor input. Acceptance: |ΔV| ≤ 0.5%·Vset across DoE conditions. See threshold-injection and the KPI in intro.