Sample-&-Hold / Track-&-Hold (S/H, T/H) Design Guide
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What S/H and T/H really do (and where they sit)
Scope: S/H (sample-and-hold) and T/H (track-and-hold) as analog signal-conditioning blocks that freeze a voltage at a defined instant so downstream measurement can finish with predictable timing and error.
A sample-and-hold family block has one core job: turn a continuous-time input into a short-time stable value. That stability window is not “free”; it is created by a switch, a hold capacitor, and a buffer, and it carries characteristic error terms (settling residue, pedestal, droop, and timing uncertainty).
S/H vs T/H is not just naming:
- S/H (Sample → Hold): the input is connected during a sampling window; at the sampling edge the circuit switches to hold. The critical requirement is that the held value must be settled to the target accuracy by the end of the acquisition interval.
- T/H (Track → Hold): the output actively follows the input during track, then freezes at the hold event. This is preferred when the system must define a precise sampling instant and keep the output consistent right up to that moment (common in fast pulse/step capture and tightly timed multi-channel sampling).
Where it sits (boundary kept intentionally clean): a practical chain places S/H or T/H after front-end gain/buffering and before the downstream decision/measurement engine. The block is often inserted because downstream needs time to settle, integrate, compare, or serialize the measurement—but the input may not wait.
Timing model: track window, aperture, and hold event
Purpose: align all later specs to one time-axis language. Without a shared timing model, “acquisition time,” “aperture,” and “hold step” become ambiguous and design decisions drift.
The timing model defines when the circuit is allowed to follow the input and when the output must remain stable. The boundary between these states is the sampling event. In real circuits, the switching event produces a short transient (pedestal/glitch) that must be separated from the usable hold interval.
Core terms (execution-level definitions):
- Track time: interval where the switch is on and the hold node follows the input.
- Acquisition time: time required after an input change for the hold node to reach the target accuracy (e.g., ≤0.01%FS).
- Hold time: interval after the hold event where the output must remain within the allowed droop/error budget.
- Aperture delay: delay from the control edge to the effective sampling instant at the hold node.
- Aperture jitter (σt): time uncertainty of the effective sampling instant; converts input slope into voltage noise.
Key specs map (what to read on datasheets & how they translate to errors)
Purpose: turn datasheet terms into predictable failure modes. Each spec below is mapped to the error it creates and the use cases where it becomes the dominant limit.
S/H and T/H parts are often compared by “typical specs” without checking the conditions. The same headline metric can mean different real behavior depending on step size (ΔV), source impedance, hold capacitor, and timing window. A practical selection starts from error budget + timing window, then verifies which spec controls that budget.
| Datasheet spec | What goes wrong (error signature) | When it matters most (typical triggers) |
|---|---|---|
| Acquisition time | Step not fully captured → settling residue at the sampling instant (missed step amplitude). Always interpret as tacq@accuracy (e.g., 0.1% vs 0.01%FS). | Short track windows, multiplexed scanning, large ΔV steps, high source-Z. Watch test conditions: Chold, Rsource, temperature. |
| Aperture jitter | Time uncertainty becomes voltage noise (and phase noise) proportional to input slope. SNR degrades rapidly as input frequency increases. | High-frequency sine amplitude capture, fast edges sampled at a precise instant, tight time-alignment across channels. |
| Droop rate | Hold value drifts over time → long-hold error set by leakage and Chold. Often worsened by board leakage and humidity. | Long hold intervals, slow readout/integration, high-impedance hold nodes, precision DC/low-frequency measurements. |
| Hold step / pedestal | A step at the hold event caused by charge injection / feedthrough. Key split: repeatable (calibratable) vs signal-dependent (harder to remove). | Absolute accuracy at the sampling instant, channel-to-channel consistency, step/pulse capture where switching transient overlaps the readout window. |
| Feedthrough / isolation | Hold output is still modulated by input/clock → leak-tracking or ripple during hold. Appears as coupling-related error even when “hold” is asserted. | Large input swing continuing during hold, high clock edges nearby, poor layout isolation, high-sensitivity measurements. |
| THD / large-step linearity | Nonlinearity under large ΔV → distortion, gain error, or non-monotonic behavior. Often linked to Ron modulation and driver recovery limits. | Single-supply near rails, wide dynamic range pulses, high-slew steps, high-accuracy capture across full input swing. |
Acquisition & settling: the RC + driver story (why large steps are hard)
Purpose: explain why large steps are the hardest case and provide a calculation framework to back-solve acquisition time or Chold from an accuracy target.
During track, the hold capacitor must be charged (or discharged) toward the new input value. The dominant first-order path is an equivalent resistance feeding Chold: Req ≈ Rsource + Ron + Rdriver. For many systems, the “headline” acquisition time is simply the time needed for this network to reduce the step error below a target.
A practical approximation for the remaining error after track time t is: residue ≈ exp(−t / (Req · Chold)). This turns acquisition into a back-solvable constraint:
- Pick target error ε (e.g., 0.1%FS = 1e-3, 0.01%FS = 1e-4).
- Required time-constants N ≈ ln(1/ε) → about ~7τ for 0.1% and ~9–10τ for 0.01%.
- Enforce ttrack ≥ N · Req · Chold (or back-solve Chold / Req).
Common large-step failure signatures (and what they imply):
- Ramp-like approach to final value → driver is slew-rate limited (track window must increase or driver must be upgraded).
- Long tail after an initial jump → driver recovery dominates (headroom, output swing, or recovery behavior is limiting).
- Overshoot / bounce around the hold node → parasitics and drive impedance interact (layout and isolation become first-order).
Hold errors: droop, leakage paths, and dielectric absorption (DA)
Purpose: split “hold drift” into controllable terms. Hold accuracy is a charge budget problem: leakage removes charge linearly with time, while dielectric absorption adds memory-like recovery tails.
During the usable hold window, the held value changes mainly because a net leakage current discharges (or charges) the hold capacitor. A first-order droop estimate is: ΔV ≈ Ileak · thold / Chold. This makes hold design back-solvable: for a given drift limit and hold time, the maximum allowed leakage can be derived.
Where leakage comes from (dominant paths):
- Switch off-leakage: device leakage through the sampling switch when open; rises strongly with temperature.
- Buffer/input bias paths: input bias currents and ESD/protection leakage connected to the hold node.
- PCB surface leakage: contamination/humidity create parallel leakage; often dominates in high-impedance nodes.
Dielectric absorption (DA) is different from droop. DA behaves like a “memory tail”: after track-to-hold transitions and voltage steps, trapped polarization relaxes slowly and can cause rebound / slow recovery. DA can corrupt precision sampling sequences even when droop looks small over the same time window.
Chold selection (decision-grade conclusion):
- C0G/NP0: low DA and stable behavior → preferred for precision hold and repeatable sampling sequences.
- X7R (high-K): higher volumetric efficiency but typically higher DA and stronger voltage/temperature dependence → more “memory tail” risk.
| Observed symptom | Likely dominant cause | Best first knob |
|---|---|---|
| Linear drift with time | Leakage current dominates droop (switch/input/PCB paths). | Increase C_hold or reduce t_hold; then attack leakage (guard ring, cleanliness, lower-leak parts). |
| Rebound / slow recovery | DA memory tail in capacitor dielectric. | Switch to low-DA dielectric (C0G/NP0) and verify with step-and-hold sequence tests. |
| Strong humidity sensitivity | PCB surface leakage on high-impedance node. | Guard ring + clean + conformal coat; shorten exposed high-Z trace length. |
| Strong temperature sensitivity | Switch off-leakage / input leakage dominates. | Choose lower-leakage device grade; reduce hold node voltage stress; validate across temperature corners. |
Switching artifacts: charge injection, clock feedthrough, pedestal & glitch energy
Purpose: treat pedestal/glitch as controllable engineering terms, not vague “switch noise.” The hold edge can create an instantaneous step (pedestal) plus a transient (glitch) that must be reduced or time-gated.
Two dominant mechanisms create a hold-edge step: charge injection (channel charge released when the switch turns off) and clock feedthrough (capacitive coupling from the clock gate into the hold node). Both appear as a pedestal error that scales against the hold capacitance: ΔV ≈ Qinj / Chold (injection-dominated), and ΔV ≈ (Ccpl/Ctot) · ΔVclk (feedthrough-dominated).
Why “repeatable vs non-repeatable” matters:
- Repeatable pedestal (stable offset): can be calibrated or subtracted if it is consistent over PVT and signal conditions.
- Signal-dependent pedestal (varies with V_in / common-mode): harder to calibrate; structural suppression is preferred.
Common suppression toolbox (with what each one mainly attacks):
- Bottom-plate sampling: reduces charge injection into the hold node by turning off plates in a controlled order.
- Dummy switch: injects compensating charge to cancel part of Qinj.
- Complementary switch / transmission gate: improves linearity and reduces signal-dependent artifacts.
- Differential sampling: cancels common-mode feedthrough and improves rejection of clock coupling.
- Clock shaping: reduces ΔVclk and coupling energy (must not compromise sampling instant definition).
| Observed behavior | Most likely dominant mechanism | Best first knob |
|---|---|---|
| Fixed step each hold edge | Feedthrough or repeatable injection component. | Clock amplitude/edge shaping; differential cancellation; verify repeatability for calibration. |
| Step varies with V_in | Signal-dependent charge injection and R_on modulation effects. | Bottom-plate sampling; complementary switch; reduce signal swing at the switch (buffering/ranging). |
| Short spike then settles | Glitch energy coupling into node + bandwidth-limited settling. | Reserve a settling window; reduce coupling; minimize parasitics at hold node. |
Aperture jitter: when timing uncertainty dominates your SNR
Purpose: set a clear threshold for when jitter is the limit. If SNR degrades mainly with input frequency (f_in), timing uncertainty is converting slope into voltage noise.
Aperture jitter (σt) is uncertainty in the effective sampling instant. For a changing input, that time error becomes a voltage error proportional to the signal slope. As fin increases, slope increases, and the same σt produces more noise.
A common engineering estimate of the jitter-limited SNR for a sinusoidal input is: SNRjitter ≈ −20·log10(2π·fin·σt). This formula is most useful for back-solving a maximum allowable σt given a target SNR at fin,max.
What tends to worsen σt (high-level drivers):
- Control edge noise: noise on the sampling control edge shifts threshold crossing time.
- Threshold drift: comparator/logic threshold variation translates into timing uncertainty.
- Supply disturbance: supply/ground noise modulates edge speed and thresholds.
- Comparator jitter: when the sampling moment is derived from a comparator event, its internal noise becomes σt.
Large-step linearity: bootstrapped switches, Ron modulation, and distortion
Purpose: turn “large-step linearity” into actionable knobs. Many S/H/T/H paths look fine for small signals, but distort or miss-settle under large steps because the sampling impedance changes with input level.
A key nonlinearity driver is Ron modulation: the sampling switch on-resistance varies with input voltage, especially on single-supply systems or near the rails where available VGS margin shrinks. When Ron depends on Vin, the effective acquisition time-constant changes with amplitude, turning a fixed time window into an amplitude-dependent residue.
Bootstrapped switches address this by keeping the switch VGS approximately constant during tracking. A flatter VGS produces a flatter Ron vs Vin, improving large-swing THD and reducing “some amplitudes settle worse than others.” However, bootstrap techniques introduce risks that must be checked at the architecture level.
Actionable knobs (what to change first):
- Improve headroom: avoid near-rail operation or range the signal before the sampling switch.
- Flatten R_on: bootstrapped or complementary switch structures to reduce V_in dependence.
- Strengthen drive: reduce R_driver and ensure the driver does not slew-limit on large steps.
- Reduce coupling: minimize parasitics at the hold node and isolate clock/drive return paths.
Architectures you can actually choose (open-loop, buffered, differential, multiplexed)
Purpose: make architecture selection concrete without leaving the S/H / T/H scope. Each choice shifts which error term dominates: node vulnerability, isolation, common-mode control, or memory/crosstalk penalties.
Architecture is not about “best”; it is about putting the dominant error term into a controllable place. A direct hold capacitor is simple, but the hold node is exposed. Adding a hold buffer isolates the node from load variability. A differential T/H structure improves common-mode behavior and can cancel some clock-related artifacts when symmetry is maintained. Multiplexed sampling trades cost/area for isolation and memory effects.
What changes between architectures (decision-grade summary):
- Direct (unbuffered) hold: simplest; hold node is fragile. Any load, leakage path, or coupling directly corrupts the held value.
- Buffered hold: isolates the hold capacitor from external loading; shifts hold accuracy toward buffer input leakage/bias and recovery behavior.
- Fully-differential T/H: improves common-mode control and can reduce apparent pedestal by symmetry; requires matched parasitics and routing.
- MUXed S/H: enables many channels; adds isolation limits, charge sharing, and “memory” between channels if the hold element is shared.
| Architecture | Main strength | Dominant risk / cost | When it is the right pick |
|---|---|---|---|
| Direct / open-loop | Minimum parts, minimum power, lowest complexity. | Hold node is exposed: load sensitivity, coupling, leakage and humidity issues show up immediately. | Short hold times, stable high-impedance load, tight physical placement, low coupling environment. |
| Buffered hold | Isolation from load; repeatable behavior across fixtures and ranges. | Buffer bias/leakage and recovery behavior become part of the error; extra power and area. | Unknown or varying load, longer hold windows, routing constraints, measurement repeatability required. |
| Differential T/H | Better common-mode handling; symmetry can cancel clock-related artifacts. | Matching and symmetry requirements; doubled components and routing constraints. | Differential signal chains, spur/pedestal sensitivity, demanding distortion/common-mode budgets. |
| MUXed sampling | Scales channel count efficiently (cost/area). | Isolation limits, charge sharing, and channel “memory” unless reset/settling windows are budgeted. | Many channels with moderate per-channel bandwidth; acceptance of per-channel timing/settling overhead. |
Layout & parasitics: what ruins S/H in real hardware
Purpose: convert “works in theory, fails on PCB” into actionable layout rules. The hold node is often high-impedance and extremely sensitive to leakage, coupling, and reference movement (ground bounce).
1) Leakage and contamination (hold drift becomes random):
- Guard ring and cleanliness: humidity, flux residue, and contamination create surface leakage that directly increases droop.
- Shortest possible high-Z routing: keep the hold node compact and shielded; avoid long exposed traces and vias.
- Material and coating decisions: if the environment is humid or variable, protective measures can make drift repeatable.
2) Coupling and loop area (pedestal/glitch grows):
- Clock isolation: the sampling clock edge is a strong aggressor. Keep it physically separated from the hold node and input network.
- Minimize the C_hold loop: place C_hold close to the switch/buffer; reduce loop area to reduce pickup and return-path injection.
- Control the return path: avoid routing digital return currents through the analog reference region near the hold node.
3) Symmetry and grounding discipline (differential cancellation only works if parasitics match):
- Symmetric differential routing: keep both halves in similar environments so common-mode coupling does not become differential error.
- Kelvin ground for sensitive references: separate high-current returns from the hold reference node.
- Local decoupling: place decoupling close to the switch driver and buffer supply pins to reduce edge-induced supply modulation.
Validation & production checklist: how to prove it works (and keep it consistent)
Purpose: turn “it seems to work” into a repeatable proof flow. Each test maps to a specific error mechanism (acquisition, pedestal, droop/leakage, jitter, coupling/memory) and produces pass/fail criteria that can be re-run in production and service.
Test philosophy (keep results comparable):
- Define the sampling instant (the effective hold event). All numbers must reference the same timing point.
- Separate “mean” vs “spread”: mean pedestal can often be calibrated; random spread sets the hard limit.
- Measure trends, not only single points: droop vs time, SNR vs fin, and step error vs time reveal root causes faster.
| Test item | Stimulus & setup | Record | Pass criteria (template) | Common failure signatures | Example material numbers (fixtures / blocks) |
|---|---|---|---|---|---|
| Acquisition time t_acq@0.1% / 0.01% |
Fast step (small + full-scale). Low source Z. Fixed track window. Trigger on hold edge. | Error vs time curve after hold. Extract time-to-threshold. | At max step, t_acq@X% ≤ budget. No abnormal amplitude-dependent “knee”. | Long tail → driver recovery / current limit. Strong amplitude dependence → R_on modulation / near-rail headroom loss. |
Switch: ADG1211 / ADG1219, TMUX1101 Buffer op-amp: OPA356, ADA4807-1 Hold cap (C0G): Murata GRM series (C0G/NP0) |
| Pedestal / hold step mean + σ |
Input shorted or fixed DC. Repeat N cycles across multiple DC levels. Same clock edge each run. | Histogram of held value. Mean step and standard deviation. | |mean| ≤ limit (or calibratable). σ ≤ noise budget. | Mean stable but σ large → coupling/clock noise. Mean varies with DC level → charge injection dependence on V_in. |
“Short input” hook: ADG1419 / ADG1409, TMUX1136 Relay (low leakage option): SIP reed relay families (pick per voltage) EEPROM (cal storage): 24LC02 / 24AA02, AT24C02 |
| Droop / leakage screen ΔV vs t_hold |
Fixed DC → hold for multiple t_hold values. Sweep temperature and humidity (or “clean vs contaminated”). | Slope of droop; drift vs environment; channel-to-channel variance. | ΔV(t_hold) stays within limit across corners; droop slope variation bounded. | Large humidity sensitivity → board surface leakage / cleanliness. One channel worse → local routing/contamination. |
Guard strategy helper (layout): driven guard ring + keepout Ultra-low leakage switch option: ADG1201 / ADG1204 class Hold cap: C0G/NP0 MLCC families (avoid high-DA dielectrics) |
| Jitter back-solve σt estimate |
High-frequency sine at fixed amplitude. Measure SNR/amp noise across multiple f_in points. | SNR vs f_in plot; fit high-f region slope. Estimate σt using jitter-SNR relation. | In jitter-limited region, SNR trend meets target at f_in,max. No unexpected spurs dominating. | No 20 dB/dec trend → not jitter-limited (noise floor or distortion dominates). Random spurs → clock feedthrough/layout. |
Clock buffer options (low additive jitter class): vendor-specific (verify) Comparator (if used for timing): high-speed low-jitter families (verify) Isolation aids: series-R + controlled edge shaping (layout + driver) |
| MUX memory / crosstalk channel-to-channel |
Alternate channels with two DC levels (A then B). Control dwell time and track window; measure residue. | Held value error on channel B vs previous channel A level. Settling vs time budget. | Residue below limit after defined settle/reset window. Isolation meets system requirement. | Strong dependence on previous channel → charge sharing / shared C_hold memory. Edge-synchronous spikes → clock coupling. |
MUX: ADG1208 / ADG1608 class, TMUX1208 class “Reset/discharge” switch: ADG1419 / TMUX1101 Per-channel buffer option: OPA356 / ADA4807-1 |
| Production hooks self-test + calibration |
Dedicated short/loopback path; known reference injection; periodic pedestal check at boot or temperature delta. | Self-test signature, stored calibration constants, re-check logs (pass/fail counters). | Self-test repeats across units; calibration reduces mean pedestal without inflating σ; re-check triggers defined. | Self-test unstable → fixture coupling / grounding. Calibration drift → temp-dependent pedestal or leakage changes. |
EEPROM: AT24C02 / 24LC02 / 24AA02 Short/loopback switch: ADG1419 / ADG1409 / TMUX1136 Reference (if needed): precision reference families (verify per rails) |
FAQs (answers + structured data)
These FAQs target common field failures in Sample-&-Hold / Track-&-Hold stages: settling, pedestal, droop/leakage, jitter, MUX memory, and layout-driven coupling. Answers stay within the S/H / T/H scope and map back to the related sections for fast troubleshooting.