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Audio AR Glasses: Low-Power SoC, Mic AFE, IMU & USB-C PD

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Audio AR Glasses succeed when the system is engineered as a verifiable chain: ultra-low-power audio capture/playback, IMU head-tracking with tight timestamp alignment, robust 2.4 GHz coexistence, and a quiet USB-C PD power path. This page shows how to partition domains, choose key IC blocks, and debug real-field symptoms using evidence (rails, counters, flags, timestamps) instead of guesswork.

H2-1 — Page “Answer” + What this page covers

Page Answer (for humans + SEO)

Audio AR glasses succeed when five hardware chains are engineered as a single, testable system: ultra-low power domains, mic-array AFE, IMU head-tracking timing, BT/Wi-Fi coexistence, and a USB-C PD power path that does not inject audible noise.

This page is built for selection (key specs per block), architecture (domain + interface partitioning), and field debug (symptom → evidence → isolate → fix) using measurable points on rails, counters, and timestamps.

What you will get from this page
  • Block-level architecture with named interfaces (PDM/TDM/I2S, I²C/SPI) and first measurement taps (VBUS/SYS/BAT/AON/AMP).
  • Always-on vs active partition rules to prevent overnight drain and “won’t stay asleep” failures.
  • Evidence-first debug hooks: rail ripple signatures, RF retry counters, IMU timestamp drift, amp protection flags.
  • Hard boundaries that prevent scope creep into cloud/app/OS topics.
Low-power domainsMic-array AFEIMU head tracking Coexistence evidenceUSB-C PD sinkEMC/ESD hardening
Scope Guard (mechanical check)

Allowed (this page):

audio AR glasses, low-power audio SoC/DSP, mic-array AFE, IMU timing/sync, temple speakers/amps, BT/LE Audio + Wi-Fi coexistence (device-side), USB-C PD sink power path, charger/fuel gauge/PMIC rails, EMC/ESD, validation evidence.

Banned (do not cover):

cloud voice platforms, mobile app UX, router/mesh tuning, generic Bluetooth tutorials, OS audio stack deep dives, camera/ISP, optics/display deep dives, unrelated wearables.

Quick Navigation (this batch)
  • H2-1 — Page Answer + coverage boundaries
  • H2-2 — Always-on vs Active domains (partition + budget)
Figure F1 — System overview (testable block diagram)
Audio AR Glasses — Hardware System Overview Block diagram showing mic-array AFE, audio SoC/DSP, IMU head tracking path, BT/Wi-Fi coexistence, and USB-C PD power path with key measurement taps. Audio AR Glasses: Hardware Evidence Map Blocks + interfaces + first measurement taps (no cloud/app scope) Mic Array + AFE PDM mics • bias • EIN/PSRR Temple L Bridge Temple R AFE Low-Power Audio SoC / DSP Voice pipeline • LC3/codec • timers Audio I/F TDM / I2S AON wake • logs Timestamp Align IMU ↔ audio frames BT / Wi-Fi Radio 2.4G coexistence evidence Retry Ctr RSSI IMU Head-Tracking 6-axis/9-axis • drift • sync IMU I²C/SPI TS Drift Playback (Open-Ear) Amp PSRR • click/pop • protect Amp L Amp R USB-C PD Power Path VBUS → charger → battery → PMIC rails PD Sink Charger Battery PMIC Rails AON/CORE/RF/AMP/IMU Taps VBUS SYS BAT Audio out RF burst → noise paths Coupling
How to use this figure: treat it as a measurement map. When a symptom appears (noise, dropouts, drift, drain), start from the nearest tap (VBUS/SYS/BAT/AON/AMP) and the nearest counter (retry/RSSI/timestamp drift) before changing algorithms.
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Figure F1 — “Audio AR Glasses: Hardware Evidence Map” (ICNavigator)
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H2-2 — System Partitioning: Always-on vs Active Domains

Design goal (why partitioning matters)

Audio AR glasses fail silently when “standby” is not truly low-power. The fix is not a bigger battery first—it’s a clean partition: Always-on (AON) handles only detection and logging, while Active domains (SoC cores, RF, amps) wake on explicit events.

This section defines a partition that is measurable (rail-level current and wake reasons), debuggable (domain-by-domain isolation), and audio-safe (no RF/charger bursts injected into mic/amp rails during sensitive states).

Partition rules (enforceable, not “advice”)
  • AON domain is allowed to: wear detect, button/gesture IRQ, minimal IMU sampling, wake reason logging, timekeeping.
  • AON domain is NOT allowed to: keep main RF active, poll sensors continuously, run audio DSP frames, or hold high-speed clocks.
  • Active domain wakes only on events: wear + user intent, wake word trigger, link request, or USB attach (debounced).
  • Every domain must be observable: rail enable state, wake source, average current, and at least one “health flag”.
  • Audio/IMU sync must be planned: IMU samples need timestamp alignment to audio frames (or drift appears as spatial instability).
Practical current budget (use it to find the “culprit”)

Use ranges and deltas. The exact number depends on battery size and feature set; what matters is which domain causes the step.

  • Ship / storage: “almost off” — only ship-mode logic. If drain exists, suspect leakage paths (port protection, charger, gauge).
  • Standby (AON only): µA to sub-mA class. If higher, suspect IMU not in low-power mode, noisy wake loops, or rail never disabling.
  • Listen / trigger-ready: low-mA class. If too high, suspect mic bias/AFE never gating, or “AON” accidentally pulling high-speed clocks.
  • Call / music: tens-to-hundreds mA. If unexpectedly high, suspect RF retries (poor link), amp efficiency/rail choice, or charger burst coupling.

Debug principle: reduce the system to one powered domain at a time (AON only → AON+IMU → add RF → add amp) and record the current delta after each enable.

Evidence checklist (minimum tools, maximum certainty)
  • Rail current steps: log AON/CORE/RF/AMP enable states and measure step size per transition.
  • Wake reasons: count wake IRQ types (wear, button, timer, USB attach, RF event). “Too many wakes” is often the root cause.
  • RF retry counter: a link issue can double RF duty cycle and make “battery drain” look like a power-design problem.
  • Charger burst marker: correlate audible artifacts with charger switching bursts during play-while-charging states.
Figure F2 — Power domain state machine (rails + triggers)
Audio AR Glasses — Power Domains and State Machine State machine showing Ship, Standby, Listen, Call, Spatial+Music, Firmware Update with rails AON/CORE/RF/AMP/IMU and main vs optional power paths. Always-on vs Active: State → Rails Thick path = main power; thin path = optional USB-C play-while-charging Rails: AON CORE RF AMP IMU ON OFF Battery PMIC Rails distributed AON / CORE / RF / AMP / IMU USB-C VBUS PD + Charger Thin path: play-while-charging (noise risk) States (left → right) Ship storage Standby AON only Listen trigger Call link Spatial music FW Update USB attach AON CORE RF AMP IMU IMU ↔ audio timestamp align enter: ship cmd enter: idle enter: wear enter: link enter: play enter: USB
How to use this figure: isolate drain and noise by turning rails on one step at a time. A “standby drain” root cause is proven when AON-only current exceeds its target, or when wake reasons show excessive USB attach / timer / sensor IRQ loops.
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Figure F2 — “Always-on vs Active: State → Rails” (ICNavigator)
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H2-3 — Audio Capture Front-End: Mic Array, AFE, and PDM/TDM Plumbing

What this section solves

In audio AR glasses, microphone performance is limited by three coupled chains: mechanical coupling (wind/handling), front-end noise & PSRR (rail/RF/charger bursts), and multi-mic timing (PDM clock distribution and TDM slot mapping). This section locks each chain to measurable evidence so “algorithm blame” can be avoided.

Signature A — handling noise touch/temple press → wideband impulse + fast decay (structure path)
Signature B — wind noise head turn / outdoor wind → low–mid band rise + modulation (port/flow path)
Signature C — power/RF coupling BT/Wi-Fi burst or charging → noise synced to rail ripple or retry duty cycle
Signature D — sync / mapping beamforming “ghosts” → channel phase mismatch or wrong TDM slot/word format
Card 1 — Mic placement & mechanical coupling (glasses-specific)
  • Temple mics (near hinges): best mouth proximity but highest exposure to finger contact and wind shear; treat as “high-SNR, high-disturbance” inputs.
  • Bridge mic (nose/center): lower handling/wind sensitivity but often needs higher gain; AFE EIN and bias stability become first-order.
  • Reference/environment mic (rear/outer): more likely to see near-field RF coupling (antenna adjacency + long routing); keep PDM routing short and return path controlled.
  • Mechanical isolation priority: seating compliance (grommet/foam), controlled port geometry, and a clear “no-touch zone” are often higher ROI than DSP tuning.

Minimum evidence: record a short clip per channel during (1) quiet room, (2) temple touch, (3) head turn in airflow. Compare the channel-to-channel amplitude ratios and the spectrum “shape” before any algorithm changes.

Card 2 — AFE spec checklist (each spec maps to a field symptom)
  • EIN (input-referred noise): dominates when bridge mic gain is high or when acoustic ports attenuate speech. Evidence: noise floor rises roughly with gain; compare quiet-room clips across gain steps.
  • PSRR (rail-to-audio rejection): critical for glasses because RF bursts and charger switching are frequent. Evidence: audio hiss/glitches time-align with AFE rail ripple.
  • Input range & bias stability: prevents clipping on loud speech and handling impulses. Evidence: flat-top waveforms or sudden “crack” aligned with bias settling.
  • Dynamic range / THD+N: keeps loud speech + ambient from pushing nonlinearity. Evidence: harmonic rise during high SPL without a corresponding rail disturbance.
  • Start-up / gating behavior: enables listen-trigger states without pops or missed frames. Evidence: first 100–300 ms after wake shows transients or missing channel data.

Design check: treat AFE as both an analog block and a “rail sensor.” If BT/charging changes the AFE output in silence, the first fix is usually rail isolation + routing/return, not algorithm.

Card 3 — PDM/TDM plumbing: clocks, sync, and mapping
  • PDM clock distribution: use a single low-jitter source and keep clock/data edge integrity consistent; routing asymmetry shows up as channel phase mismatch.
  • TDM slot mapping: wrong slot/word-width/sign extension can mimic “bad mic.” Evidence: a single-tone input appears on the wrong channel or with unexpected amplitude scaling.
  • I²S/TDM timing integrity: BCLK/LRCLK jitter or bursts can raise the noise skirt. Evidence: spectral “hash” that correlates with RF activity even when rails look clean.
  • Debug taps are mandatory: include at least one PDMCLK tap, one TDM/I²S tap, and one AFE-rail ripple tap for correlation.

Minimum test method: inject a consistent acoustic source (beep/whistle) and verify channel order, polarity, and relative phase before attempting beamforming tuning.

Figure F3 — Mic array + clock/data plumbing (with debug taps)
Audio AR Glasses — Mic Array and PDM/TDM Plumbing Diagram showing temple and bridge microphones, PDM clock/data routing into an AFE, then TDM/I2S into the audio SoC, with test points for logic analyzer and rail ripple correlation. Mic Array → AFE → TDM/I2S → SoC Add taps: PDMCLK, TDM, AFE rail ripple (correlate with RF/charge bursts) Mic Placement (Glasses) Wind / handling coupling signatures Temple L Bridge Temple R Ref Mic Handling Wind Clock/Data Plumbing PDM CLK/DATA → AFE → TDM/I2S PDM CLK AFE EIN/PSRR PDM DATA PDM CLK TDM / I2S slots • word • polarity Debug Taps TP_PDMCLK • TP_TDM • TP_AFE_RAIL TP_PDM TP_TDM TP_RAIL Audio SoC + Tools Verify mapping + sync before tuning Audio SoC / DSP TDM/I2S Rx • DMA • frames Slot Map Check channel order • sign • gain Logic Analyzer PDMCLK / TDM edges tap
Reading tip: correlate three traces before changing DSP: (1) AFE output in silence, (2) AFE-rail ripple (TP_RAIL), (3) RF duty/retry counters. If noise time-aligns with ripple or RF bursts, fix rails/routing first.
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Figure F3 — “Mic Array → AFE → TDM/I2S Plumbing” (ICNavigator)
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H2-4 — Playback Path: Temple Speakers / Open-Ear Amps, Click/Pop, and Hearing Safety

Playback chain focus (open-ear constraints)

Temple speakers are physically close to microphones and antennas. The playback path must be designed as a controlled power + EMI + protection system: amplifier class choice, rail strategy, and hardware protections determine click/pop, audible hiss during RF bursts, and safety under fault conditions.

This section stays hardware-first: it covers amplifier behaviors, protection flags, and measurement taps—not DSP feature tutorials.

Card 1 — Amplifier selection: Class-D vs Class-AB (glasses reality)
  • Class-D (often filterless): high efficiency for wearables, but switching edges raise EMI risk. Evidence: hiss/glitches appear with RF bursts or charger activity even when audio content is constant.
  • Class-AB / linear: easier low-noise/low-EMI behavior but poorer efficiency and higher heat. Evidence: loudness drops gradually after minutes (thermal foldback) rather than instantaneous dropouts.
  • PSRR matters either way: open-ear amps often sit on rails that also feed RF/PMIC. Evidence: audible artifacts correlate with AMP rail ripple.
  • Routing priority: keep the amp output loop compact; control return path to avoid injecting current spikes into mic/AFE ground references.
If EMI is the top risk prefer cleaner switching behavior, controlled edge rates, and robust output loop layout
If battery is the top risk favor efficient amps but plan for rail isolation and measured coexistence evidence
Card 2 — Protections + limiter (use flags as debug evidence)
  • Short / over-current (OC): sweat/contamination or wiring faults can trigger protection. Evidence: output collapses while the amp flag asserts; rail current spikes.
  • Thermal foldback (TH): enclosed temple volume traps heat. Evidence: gradual loudness reduction under constant content; temperature rise precedes behavior.
  • DC detect (DC): prevents sustained offset at the speaker. Evidence: pop events may align with bias transitions; check output offset around events.
  • Limiter (LIM): hardware-domain peak control to avoid sudden SPL spikes (alerts/tones). Evidence: peaks are clipped/limited without wideband distortion growth.
  • Click/pop control: sequencing of rails, mute timing, and bias ramps is the first layer; do not treat pop as a “codec bug” until rails and flags are confirmed.

Minimum measurement set: (1) AMP rail ripple, (2) amp protection flags, (3) speaker output (TP_OUT) around event edges (connect/disconnect, wake, charge attach).

Figure F4 — Playback chain + protection points (with taps)
Audio AR Glasses — Playback Chain and Protection Points Block diagram showing codec/DAC to amplifier to temple speakers with protection functions (limiter, DC detect, short protect, thermal foldback) and measurement taps for amp rail and output. Codec/DAC → Amp → Temple Speakers Mark protections + taps: TP_AMP_RAIL and TP_OUT for click/pop and hiss correlation Codec / DAC I2S • MCLK • mute TP_DAC Open-Ear Amplifier PSRR • EMI • protections LIM DC OC TH LIM: limiter DC: DC detect OC: short/over-current TH: thermal foldback TP_RAIL TP_OUT Temple Speaker L open-ear Temple Speaker R open-ear Coupling risks (glasses form factor) RF bursts & charger switching can inject ripple into AMP rail → audible hiss / click-pop. Confirm with TP_RAIL + TP_OUT correlation. evidence
Debug tip: if a “pop” aligns with rail enable, fix sequencing/mute ramps and rail isolation first. If hiss aligns with RF retries or charging bursts, treat it as a power/coexistence coupling problem before changing EQ/NR.
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Figure F4 — “Playback Chain + Protection Points” (ICNavigator)
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H2-5 — IMU for Spatial Audio: Head-Tracking Data Path and Latency Budget

Why this is the “depth moat”

Spatial audio in AR glasses fails most often due to timing integrity, not “DSP quality”: IMU noise/bias drift drives wobble and slow yaw drift, while timestamp jitter and frame alignment create unnatural latency variance. This section turns head-tracking into a measurable pipeline with clear latency/jitter budgets.

Slow drift (minutes) yaw slowly walks even at rest → bias drift / temp drift / timebase mismatch
Wobble (seconds) sound image shakes on small motions → IMU noise density or timestamp jitter
Lag / “late” sound head turns first, audio follows → budget too large or frame quantization
Mode-dependent latency music vs call feels different → buffer depth changes / DVFS / scheduling
Card 1 — IMU selection checklist (spec → symptom → evidence)
  • Noise density: governs short-term wobble. Evidence: at-rest angle/gyro variance (short windows) is high; spectrum shows a raised noise floor.
  • Bias drift (and temp drift): governs slow yaw drift. Evidence: constant-pose log shows monotonic walk; drift worsens with temperature change.
  • Bandwidth & sample rate: governs fast head-turn phase lag. Evidence: repeat fast turn produces consistent lag/overshoot vs reference timing markers.
  • Power modes & wake latency: governs “first seconds feel wrong” after wake. Evidence: first N frames after wake show unstable heading or latency jumps.
  • Timestamp support: determines alignment quality. Evidence: sample interval jitter distribution (min/typ/max) indicates how stable the timebase is.

Design rule: treat the IMU as a timing source, not only a sensor. If sample timing is unstable, spatial audio will feel unstable even with perfect math.

Card 2 — Latency budget (end-to-end, with jitter-sensitive segments)
  • IMU sampling + timestamp generation: jitter here directly becomes render jitter. Evidence: sample interval histogram; watch for long-tail gaps around sleep/radio bursts.
  • Fusion / sensor hub compute: scheduling and DVFS create variance. Evidence: compute time min/typ/max per update cycle; spikes correlate with RF activity or power-state transitions.
  • Audio frame boundary alignment: frame-based pipelines quantize timing. Evidence: consistent “step-like” lag equal to frame duration or buffer boundary.
  • Render → codec/output buffering: buffer depth stabilizes underflow but increases delay. Evidence: mode changes (music/call/update) shift total delay noticeably.

Target: keep total latency in a practical tens-of-milliseconds range and prioritize low variance. A stable fixed offset is easier to compensate than jitter.

Card 3 — Timestamp integrity & alignment strategies
  • Strategy A — common hardware timebase: IMU timestamps map cleanly to the audio timebase. Best for low jitter. Failure signature: fixed offset if mapping is wrong; periodic wobble if drift is uncorrected.
  • Strategy B — software-mapped timebase: periodic calibration maps IMU time to SoC time. Failure signature: latency variance increases under CPU load; drift changes across power states.
  • Strategy C — frame-edge sampling (simplest): sample only at audio frame boundaries. Failure signature: fast head turns “trail” with a step-like lag; small motions feel quantized.
  • Minimum evidence set: (1) IMU sample interval jitter, (2) IMU→audio frame alignment error, (3) end-to-end latency variance across modes.

Debug heuristic: if wobble appears without rail ripple, suspect timestamp jitter. If drift grows with temperature, suspect bias/temp drift and timebase mapping stability.

Figure F5 — IMU samples ↔ audio frames sync (timestamp align + jitter points)
Audio AR Glasses — IMU to Audio Frame Synchronization Two time lines showing IMU samples and audio frames, a timestamp alignment block, jitter-sensitive points, and measurement taps for IMU timestamp, audio frame boundary, and render output. IMU Samples ↔ Audio Frames: Timestamp Align Goal: total latency in tens-of-ms range, with low variance (jitter is critical) IMU Timeline samples + timestamps IMU samples TP_IMU_TS timestamp tap Jitter-sensitive point sample interval jitter → render wobble watch long-tail gaps near sleep / RF bursts Timestamp Align map • interpolate • gate Audio Frames frame boundaries + buffers frames TP_AUDIO_FRAME Jitter-sensitive point alignment window → step-like lag buffer depth changes → mode-dependent latency TP_RENDER_OUT codec/output marker marker
Use it: measure (1) IMU sample interval jitter, (2) alignment error at frame boundaries, and (3) end-to-end latency variance. A stable constant offset is less harmful than jitter that changes with RF/charge/power states.
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Figure F5 — “IMU ↔ Audio Frame Timestamp Align” (ICNavigator)
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H2-6 — Wireless Links: BT/LE Audio + Optional Wi-Fi, and Coexistence Evidence

Coexistence, not Bluetooth 101

In AR glasses, “wireless issues” often show up as audio hiss, glitches, and dropouts. Treat coexistence as three measurable coupling paths: power ripple, ground return (bounce), and antenna near-field coupling. The goal is to correlate artifacts to rails + counters before changing audio processing.

Card 1 — RF/antenna layout basics (temple form factor)
  • Antenna placement: temple ends are common, but human absorption and head pose create strong left/right asymmetry; plan for orientation-sensitive margins.
  • Ground reference continuity: long, narrow frames make return paths fragile; discontinuities increase both RF loss and coupling into audio references.
  • Keep-out from audio traces: avoid running PDM/TDM and amp output loops parallel to antenna feed/PA regions; near-field coupling can mimic “bad AFE.”
  • Coexistence by evidence: when retries rise, RF duty cycle rises, and current spikes get larger—making power/ground coupling worse even if RF “works.”

Minimum observability: log RSSI and retry counters, and measure ripple on the AFE/AMP rails during RF bursts.

Card 2 — Symptoms → evidence → isolate (two signals first)
  • Hiss increases when link is active: first check AFE/AMP rail ripple and retry duty. If hiss aligns with bursts, fix rail isolation/return path first.
  • Dropouts + hiss together: check packet retry counter and system current spikes. Poor antenna efficiency increases duty cycle → worsens coupling.
  • Only bad while charging: check VBUS/SYS ripple and audio glitch markers; PD/charger switching can create beat notes and ground path shifts.
  • Only certain phones show it: compare retry rates and RF duty patterns; higher occupancy patterns stress power/ground coupling even with similar RSSI.

Rule of thumb: if artifacts correlate with rails/counters, treat it as a coupling problem. If artifacts do not correlate, then investigate timing/mapping (H2-3) or timestamp jitter (H2-5).

Figure F6 — Coexistence coupling paths + measurable evidence
Audio AR Glasses — Coexistence Coupling Paths and Evidence Diagram showing RF transmitter coupling into audio AFE, amplifier, and sensitive rails through power ripple, ground return, and antenna near-field paths, with evidence panel for ripple, retry counters, and glitch markers. RF Tx → Coupling → Audio/Power Three paths: power ripple • ground return • near-field (prove by correlation) RF Tx / PA BT / LE Audio Retry Cnt Antenna temple near-field Coupling Paths show what to measure Power Ripple RF duty → rail ripple Ground Return PA current → bounce Near-Field antenna → traces Sensitive Blocks audio + rails Mic AFE EIN/PSRR Speaker Amp PSRR/EMI Evidence Panel correlate before “tuning” Rail Ripple Retry Counter Glitch Marker near-field If artifacts correlate with rail ripple or retry duty, fix rails/returns/keep-outs before changing audio DSP.
Use it: prove the coupling path with correlation: rail ripple (TP), retry counters, and timestamped audio glitch markers. Coexistence becomes an engineering problem once the evidence lines up.
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Figure F6 — “Coexistence Coupling Paths + Evidence” (ICNavigator)
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H2-7 — USB-C PD Power Path: Sink, Protect, Charge, and Play-While-Charging

Engineering intent

USB-C PD on AR audio glasses is a power-path system, not just “charging.” The design must survive attach/contract events, prevent fault energy at the port, and keep audio stable during play-while-charging. This section decomposes the Sink path into measurable nodes: VBUS → SYS → BAT → rails.

Attach causes reboot/pop inrush or SYS collapse during mux/contract transitions
Charging adds hiss/whine ripple/beat-note coupling into AFE/AMP rails
Only bad on some adapters different PD contracts & burst load responses
“Dead battery” unstable power-path priorities + current limit/thermal foldback
Card 1 — Power path decomposition (where problems actually live)
  • Type-C port front-end: ESD and VBUS OVP are the first gate. Evidence: VBUS attach transient, OVP status, port temperature rise under abnormal adapters.
  • PD Sink control (mention-only): CC detect and contract events can create step changes. Evidence: PD event timestamps aligned to SYS dips or audio pops.
  • Power-path mux / NVDC SYS rail: the critical stability node for play-while-charging. Evidence: SYS droop or current limit flags during attach or load steps.
  • Charger + battery: switching mode changes (PFM/PWM) can move ripple/beat notes. Evidence: BAT current ripple and noise peaks shift with charge state.
  • PMIC rails: isolate sensitive rails (AFE/clock) from SYS ripple, and constrain high di/dt rails (AMP/RF). Evidence: AFE/AMP rail ripple correlation to hiss/glitch markers.

Minimum taps: TP_VBUS, TP_SYS, TP_BAT, TP_AON, TP_AMP (optionally TP_AFE).

Card 2 — “Play-while-charging” noise triad (symptom → evidence → first fix)
  • Ground return shift: charging currents change return paths and inject ground bounce into audio references. Evidence: hiss/pop aligns with charge current steps; ground bounce grows at shared return segments. First fix: reroute returns, reduce shared impedance, enforce keep-outs for audio reference.
  • Switching beat notes: charger/buck switching interacts with class-D, PDM clocks, or load cadence and creates audible whine/modulation. Evidence: stable spectral lines/sidebands that move with charge mode or load. First fix: adjust switching regimes (avoid sensitive bands), add filtering or post-LDO isolation for sensitive rails.
  • Insufficient isolation (PSRR window): LDO/filters fail to attenuate the dominant ripple band. Evidence: SYS ripple passes into AFE/PLL rails with weak attenuation. First fix: allocate LDOs/RC filters for AFE/PLL rails, tighten decoupling/return loops.

Correlation-first rule: prove coupling by logging audio glitch markers and measuring rail ripple at the same timestamps (attach, mode change, or RF burst).

Figure F7 — USB-C PD sink power tree + measurement taps
Audio AR Glasses — USB-C PD Sink Power Tree Block diagram from Type-C port protection to PD sink controller, power-path mux, charger, battery, gauge, and PMIC rails. Shows measurement taps: VBUS, SYS, BAT, AON rail, AMP rail. USB-C PD (Sink) Power Path Decompose: VBUS → SYS → BAT → rails (attach stability + play-while-charging noise) Type-C Port ESD / OVP PD Sink Ctrl CC • contract Power Mux NVDC / SYS rail Inrush / ILIM Charger PWM/PFM Battery Li-ion Fuel Gauge SOC / alerts PMIC Rails AON / AFE / AMP / RF Isolation TP_VBUS TP_SYS TP_BAT TP_AON TP_AMP Play-while-charging debug: correlate TP_SYS/TP_AMP ripple with audio noise and PD/charge mode events.
Use it: attach events and charge-mode transitions should be time-aligned with VBUS/SYS/BAT waveforms and audio markers. If SYS ripple passes into AMP/AFE rails, prioritize isolation and return-path control.
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Figure F7 — “USB-C PD Sink Power Tree + Taps” (ICNavigator)
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H2-8 — Power Integrity & Audio Noise: Rail Strategy, PSRR, and Grounding for Glasses Form Factor

Hardcore chapter: make noise measurable

“Audio noise” in glasses is usually a rail + return-path problem. The goal is to map hiss/whine/pop to specific sensitive rails (AFE/clock/AMP/RF), then choose a rail strategy (buck vs LDO isolation) and a grounding plan that prevents RF and AMP di/dt currents from contaminating audio references.

Card 1 — Sensitive rails (what breaks first, and why)
  • AFE AVDD / mic bias: most sensitive to ripple and ground bounce; directly raises noise floor. Evidence: hiss correlates with TP_AFE ripple or ground bounce markers.
  • DAC/PLL / audio clock rail: sensitive to jitter; rail noise becomes skirts/spurs. Evidence: spectral “skirts” or spurs increase under RF/charge activity.
  • AMP PVDD: large pulsed currents; easiest to pollute SYS/ground. Evidence: noise/glitches scale with volume and load steps; TP_SYS droop increases.
  • RF rail: Tx bursts create current steps that excite SYS impedance. Evidence: artifacts align with retry duty / burst cadence even when RSSI looks fine.

Measurement rule: always capture two traces together: one sensitive rail (AFE/clock/AMP) and one system stress indicator (SYS ripple or retry duty).

Card 2 — Rail strategy (buck vs LDO) with frequency awareness
  • Use buck for heavy rails: SYS/AMP/RF want efficiency, but they generate ripple and di/dt stress.
  • Use LDO/RC for sensitive rails: AFE and clock rails need isolation from SYS ripple bands. Evidence: measure attenuation across LDO (pre vs post ripple).
  • PSRR is frequency-dependent: isolation may fail at the dominant ripple band (charger switching, RF burst envelope). Evidence: weak attenuation at the noise band explains “hiss only during X”.
  • Keep the isolation local: place decoupling and reference returns close to the consumer block, not only near the PMIC.

Practical A/B tests: (1) battery-only vs charging, (2) low vs high volume, (3) RF idle vs high retry duty. The pattern classifies the root cause quickly.

Card 3 — Grounding & return-path rules (temple + flex constraints)
  • Close high-current loops locally: amp output and supply returns must not travel across AFE reference regions.
  • Keep RF returns out of audio reference corridors: avoid shared impedance segments that convert PA di/dt into ground bounce at AFE.
  • Partition by return corridors, not by “cut grounds”: define allowed return paths (short, low-Z) and enforce keep-outs for sensitive references.
  • Flex/connector continuity: ensure reference ground does not become a long inductive bridge; watch for common-mode excursions when charging or transmitting.

Debug cue: if noise changes with touch, suspect mechanical coupling or reference instability; if it changes with retry duty, suspect RF-induced rail/return coupling.

Card 4 — Fault signatures (what it “looks like” in evidence)
  • Touch/handling noise: impulsive broadband spikes or low-frequency thumps. Evidence: correlates with touch timestamps; SYS ripple may not change.
  • Charging noise: stable lines/sidebands in spectrum; may drift with charge mode. Evidence: correlates with TP_SYS/TP_BAT ripple and mode transitions.
  • Tx burst noise: hiss/pop aligned with RF cadence. Evidence: correlates with retry counter/duty, SYS ripple, and ground bounce markers.

Action: classify first by correlation (rails/counters), then apply isolation/return fixes before tuning audio processing.

Figure F8 — Simplified zones + return corridors (do-not-cross paths)
Audio AR Glasses — Power/Ground Return Zoning Simplified PCB zoning diagram with RF, Audio, and Power areas, plus amp load region. Shows thick return corridors, sensitive reference returns, and do-not-cross paths for RF/amp/charger currents across audio reference. Ground & Return Corridors (Glasses Form Factor) Partition by allowed return paths; keep RF/AMP/charger returns out of audio reference RF Zone PA • feed • antenna Audio Zone AFE • codec • clock Power Zone PD • charger • bucks PMIC rail fan-out AMP + Load speaker loop High di/dt return corridor Audio ref return Do-not-cross: AMP/RF/charger returns through Audio reference No RF return across Audio No AMP loop crossing AFE ref No charger return into mic ref TP_SYS TP_AFE TP_AMP TP_GND_BNC Goal: constrain high-current returns to corridors and protect audio references with isolation + local decoupling.
Use it: define return corridors for RF/AMP/charger currents and keep them out of the audio reference region. Measure SYS/AFE/AMP rails and ground-bounce markers to prove correlation before changing audio processing.
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Figure F8 — “Zones + Return Corridors (Do-not-cross)” (ICNavigator)
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H2-9 — Clocks & Sync: Low-Jitter Audio, PLL Isolation, and Timestamp Integrity

Engineering intent

Spatial audio and wireless stability depend on a clean clock tree and trustworthy timestamps. Jitter and drift become audible as noise floor rise, spurs/roughness, and time-alignment errors between IMU samples and audio frames. This section maps: XO → PLL → MCLK/BCLK/LRCK and IMU timebase, then shows where buck/charger ripple and RF bursts inject noise—and how to prove it with evidence.

THD+N degrades in some modes spurs/skirts increase during charging or RF bursts
Periodic whine / modulation beat notes from switching ripple into PLL/codec clocks
Random clicks/pops lock/unlock or clock-domain transitions
Spatial “wobble / drift” timestamp mapping jitter or slow drift
Card 1 — Clock tree: sources, shaping, distribution, timebase
  • Reference source (XO/TCXO): the root of system timing. If reference quality or supply isolation is weak, downstream PLL outputs inherit or amplify jitter.
  • PLL / clock generator: creates MCLK and domain clocks. Noise on the PLL rail or reference node becomes output phase noise (audible as spurs/roughness).
  • Audio clock distribution: MCLK/BCLK/LRCK routing and loading should avoid noisy return corridors (AMP/RF/charger). Long temple routing increases sensitivity.
  • IMU timebase: must map into the same timing frame as audio frames. Timestamp integrity is as important as the IMU itself; drift/jitter becomes spatial mismatch.

Minimum observables: PLL lock flags/events, frame/glitch markers, and IMU sample interval jitter statistics under mode changes.

Card 2 — Typical issues & evidence (symptom → discriminator → first fix)
  • THD+N worsens / “rough” sound: audio FFT shows raised skirts or new spurs under charging/RF activity. Discriminator: correlates with SYS/PLL rail ripple or retry duty. First fix: isolate PLL/codec rails and constrain noisy returns.
  • Periodic whine/modulation: stable spectral lines that shift with charger/buck mode. Discriminator: spurs move with switching regime. First fix: change switching regime away from sensitive bands, add filtering/post-LDO isolation.
  • Random clicks/pops: align with lock/unlock/relock events or clock-domain transitions. Discriminator: lock status event timestamps match pop markers. First fix: stabilize PLL rail and avoid abrupt domain switches.
  • Spatial drift/wobble: IMU-to-audio alignment error grows or jitters with time/temperature/load. Discriminator: alignment error tracks timebase drift rather than IMU noise. First fix: tighten timestamp mapping and reduce scheduling/clock jitter.
  • Drop/glitch only during high RF duty: glitch markers correlate with retry counter and SYS ripple. Discriminator: bursts coincide with PLL rail perturbation. First fix: improve RF rail decoupling/return corridor, and protect clock domain rails.

Rule: always capture a clock-domain proxy (lock/status or jitter proxy) together with a stressor trace (SYS ripple or RF duty) to prove causality.

Figure F9 — Clock tree + noise injection points + evidence panel
Audio AR Glasses — Clock Tree, Injection Points, and Evidence Clock tree from XO to PLL to MCLK/BCLK/LRCK feeding codec and amp, plus IMU timebase mapped to audio frames. Shows noise injection from buck/charger ripple and RF bursts into PLL rail and ground return. Evidence panel lists jitter proxy, audio FFT, and lock status. Clocks & Sync: Clock Tree + Noise Injection Prove jitter/drift via lock status, audio FFT shifts, and timestamp alignment errors XO / TCXO Reference PLL / Clock Gen MCLK domain Lock status MCLK audio master BCLK / LRCK I2S/TDM Codec / DAC THD+N sensitive Amp / Output load return IMU Timebase samples + TS TS Align / Map IMU ↔ audio frame Drift / jitter Audio Frames markers Evidence Panel • Jitter proxy • Audio FFT / THD+N shift • PLL lock status Noise injection: Buck/Charger ripple → PLL rail RF burst envelope → reference/return Ground bounce → frame timing Debug: align PLL lock events + audio FFT changes + IMU↔frame drift under charging and RF high duty.
Use it: if audio FFT spurs/skirts appear only during charging or RF bursts, suspect PLL rail/reference injection. If spatial drift grows over time, suspect timestamp mapping integrity (IMU timebase ↔ audio frame).
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Figure F9 — “Clock Tree + Injection Points + Evidence” (ICNavigator)
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H2-10 — EMC/ESD & Mechanical Reality: What breaks in the field (and how to harden)

Engineering intent

Glasses form factor means human contact + long narrow routing + exposed openings + Type-C. Most field failures are caused by entry points (USB-C, touch, mic ports, speaker vents, antenna near-field, flex/hinge) and return-path mistakes. This section hardens the design by entry point using a repeatable loop: risk → mitigation → verification evidence.

Card 1 — Entry-point hardening map (risk → mitigation → verify)
  • USB-C port: ESD + attach transients + contract changes. Mitigation: port TVS/OVP, CC ESD arrays, short return to ground corridor. Verify: PD event log aligned with TP_VBUS/TP_SYS, audio pop/glitch markers.
  • Buttons / touch strip: direct human ESD injection, false triggers, resets. Mitigation: series R/RC, ESD device placement, route away from mic/clock refs. Verify: touch timestamp vs reset/noise correlation.
  • Mic openings / PDM lines: high-impedance nodes, long routing, flex coupling. Mitigation: series R, local filtering, reference stability, keep-out from RF feed. Verify: PDM error counters + silence noise floor under stress.
  • Speaker vents / AMP outputs: strong EMI source + large loop currents. Mitigation: minimize loop area, filter/FB where needed, keep returns local. Verify: high volume vs retry duty vs SYS ripple correlation.
  • Antenna near-field: coupling into audio/clock/power and forces high retry duty. Mitigation: keep-out, feed isolation, RF return corridor, rail decoupling. Verify: retry counter vs audio glitch/noise markers.
  • Flex/hinge discontinuities: reference breaks and common-mode excursions. Mitigation: ground pin strategy, corridor continuity, avoid “charging return into mic ref.” Verify: posture/hold tests with TP_GND_BNC proxy.
Card 2 — Verification evidence checklist (what to log/measure)
Reset / brownout markers timestamped, mode-tagged
PD/attach events contract change, detach/attach
Retry / duty counters RF stress indicator
Audio glitch markers drop/click timestamps
TP_SYS ripple mVpp under stress
TP_GND_BNC proxy ground bounce indicator

Pass logic: after hardening, the same stress should show reduced ripple/markers, not just “subjective improvement.”

Figure F10 — ESD/EMI entry-point map (glasses silhouette + protection/return)
Audio AR Glasses — ESD/EMI Entry-Point Map Glasses silhouette with marked entry points: USB-C, touch/buttons, mic ports, speaker vents, antenna near-field, flex/hinge. Each entry points to a protection and return-path note. Evidence panel lists logs and measurement taps. ESD/EMI Entry Map (Field Reality) Mark entry points → place protection → enforce short return paths → verify with logs/taps Bridge / Nose Left temple Right temple USB-C TVS/OVP + short return Touch/Keys Series R/RC + ESD device Mic Ports PDM series R + ref corridor Speaker Vents Min loop + output filtering Antenna Tip Keep-out + RF return corridor Flex/Hinge Ground continuity + CM control Verification Evidence • Reset / brownout markers • PD attach/contract events • Retry counter / duty • Audio glitch markers • TP_SYS ripple • TP_GND_BNC proxy Harden by entry point; prove fixes by correlation of logs and taps under repeatable stress.
Use it: treat every physical opening and contact surface as an entry point. Place protection near the entry, and guarantee a short return path to the intended corridor. Validate by logging events and measuring SYS ripple and ground-bounce proxies.
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Figure F10 — “ESD/EMI Entry-Point Map” (ICNavigator)
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H2-11 — Validation & Field Debug Playbook: Symptom → Evidence → Isolate → Fix

How to use (minimal tools)

Pick a symptom card, run First 2 checks only, then follow the Discriminator to isolate the domain: Power, RF/Coexistence, Clock/PLL, IMU timebase, or Amp protection/returns. Each card ends with a first fix that can be implemented without re-architecting the product.

TP_SYS ripple TP_AFE / TP_AMP Retry/Duty counter PLL lock flag IMU TS / align error AMP protect flag PD attach/contract
Evidence rule: always capture one stressor (charging / RF high duty / volume step) together with one proxy (ripple / retry / lock / align) in the same time window.
Figure F11 — Two-layer decision tree (symptoms → evidence nodes → isolate domain)
Audio AR Glasses — Two-layer Debug Decision Tree First layer symptom groups: Noise, Drop/Glitch, Reboot/Reset, Spatial Drift, Charging/USB-C. Second layer evidence nodes: rail ripple, retry counter, PLL lock, IMU timestamp align, amp protect flags, PD events. Final isolate domains: Power integrity, RF coexistence, Clock/PLL isolation, IMU timebase integrity, Amp protection/returns, Port protection/return path. Debug Tree: Symptom → Evidence → Isolate Run only two checks first, then route by discriminators to the likely domain Layer 1 — Symptoms Noise Drop / Glitch Reboot / Reset Spatial Drift Charging / USB-C Layer 2 — Evidence Nodes Rail Ripple (TP_SYS / TP_AFE / TP_AMP) Retry / Duty Counter PLL Lock / Frame Marker IMU TS / Align Error AMP Protect Flag (OC/OT/DC) PD Attach / Contract Event Isolate Domain Power Integrity / Rail Isolation RF / Antenna / Coexistence Clock / PLL Isolation IMU Timebase Integrity AMP Protection / Returns Port Protection / Return Path
Shortcut: if a symptom coincides with TP_SYS ripple spikes, start at Power/Returns. If it coincides with retry/duty peaks, start at RF/Coexistence. If it coincides with PLL unlock, start at Clock/PLL. If align error grows, start at IMU timebase.
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Figure F11 — “Two-layer Debug Decision Tree” (ICNavigator)
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Symptom cards (expand)

Each card uses the same four-line structure: First 2 checks / Discriminator / Likely root cause / First fix. BOM/MPN examples are provided as references, not requirements.

Noise (hiss/whine/touch noise/RF noise)
Target: isolate AFE/AMP/PLL/returns in ≤10 minutes
Symptom: “Charging adds a steady whine / modulation” First 2 checks: (1) TP_SYS ripple + TP_AFE ripple (same time window). (2) Audio FFT snapshot (look for stable lines/sidebands). Discriminator: if FFT lines shift with charger/buck mode and TP_AFE tracks TP_SYS → power/rail isolation issue; if TP rails are clean but whine correlates with AMP duty → output/return coupling. Likely root cause: charger switching ripple beats into AFE/PLL; return path shared between charger and audio reference; insufficient post-reg filtering. First fix: force charger to fixed-frequency PWM (or avoid sensitive band), add post-LDO/RC isolation for AFE/PLL, reroute charger return away from AFE reference corridor.
MPN examples (power-path/charger + quiet post-reg)
  • USB-C PD Sink Ctrl: TI TPS25750, STUSB4500
  • Power-path / charger: TI BQ25895, TI BQ25601
  • Low-noise LDO for AFE/PLL: TI TPS7A20, ADI ADP150
  • Ferrite bead (rail isolation): Murata BLM18 series (choose by impedance/current)
Symptom: “Hiss appears only when RF is active (high retry / busy 2.4GHz)” First 2 checks: (1) Retry/Duty counter vs time. (2) TP_SYS or TP_AMP ripple during the same period. Discriminator: if hiss aligns with retry peaks and TP_SYS/TP_AMP ripple spikes → RF current step couples via rails/returns; if rails are stable but hiss still aligns → antenna near-field coupling into audio/clock lines. Likely root cause: RF burst envelope injects into SYS, PLL rail or amp rail; return corridor crosses audio reference; antenna feed too close to mic/clock routing. First fix: strengthen RF rail decoupling near PA/SoC, isolate AFE/PLL rails with bead+LDO, enforce keep-out between antenna feed and mic/clock, re-define return corridor.
MPN examples (RF coexistence & protection)
  • ESD for RF/hi-speed (low C): Semtech RClamp family, TI TPD low-cap ESD families
  • Common-mode choke (2.4G not typical; for USB2/CC lines): Murata DLW21, TDK ACM families
  • Audio amp (high PSRR / low EMI): TI TPA2016D2 (Class-D), TI TPA6132A2 (HP amp)
Symptom: “Touch/handling causes bursts of noise” First 2 checks: (1) Compare noise with touch vs hands-off while logging touch events. (2) Probe TP_AFE ground-bounce proxy near AFE reference. Discriminator: if noise follows touch event edges and ground bounce rises → return-path/reference issue; if noise follows microphone mechanical contact only → mechanical coupling dominates. Likely root cause: touch ESD/current couples into AFE ref; long temple ground impedance; mic mounting picks up handling vibration. First fix: add series-R/RC at touch lines + ESD close to entry, keep touch routing away from mic/clock, reinforce AFE reference corridor continuity across flex/hinge.
MPN examples (touch protection)
  • ESD array for low-speed lines: TI TPD4E05U06, Nexperia PESD families
  • Touch controller examples: Microchip ATMXT family, Synaptics (vendor-specific)
Drop / Glitch (audio gaps, clicks, pops)
Target: separate RF vs power vs clock-domain transitions
Symptom: “Random click/pop during mode transitions” First 2 checks: (1) PLL lock/unlock/relock timestamps. (2) Audio glitch marker time. Discriminator: if clicks align with PLL events → clock/PLL isolation; if clicks align with PD contract changes or SYS dips → power-path switching. Likely root cause: PLL rail perturbation; abrupt clock-domain change; power-path mux transition without ramp control. First fix: isolate PLL/codec rails (post-LDO), log and avoid abrupt clock switching, add/ramp control on power-path transitions.
MPN examples (clock isolation + power-path control)
  • Low-noise LDO: TI TPS7A20, ADI ADP150
  • Load switch (controlled ramp): TI TPS229xx family
  • Clock buffer/jitter cleaner (if needed in complex designs): Silicon Labs Si53xx families
Symptom: “Dropouts only when Wi-Fi/BT traffic is heavy” First 2 checks: (1) Retry/Duty counter + throughput time series. (2) TP_SYS ripple during the same interval. Discriminator: if retry peaks come with SYS ripple spikes → rail/return coupling; if SYS is stable but retries spike → antenna/coexistence/routing issue. Likely root cause: high RF duty causes current steps; antenna near-field coupling; shared 2.4 GHz coexistence conflict (manifested as retries). First fix: improve RF rail decoupling, enforce keep-out, isolate sensitive audio rails, and reduce coupling in temple routing.
Symptom: “Pop when plugging/unplugging USB-C” First 2 checks: (1) TP_VBUS and TP_SYS during attach/detach. (2) PD attach/contract event timestamps. Discriminator: if TP_SYS droops/overshoots at attach → power-path transition; if TP_SYS is stable but pop persists → amp mute/unmute sequencing. Likely root cause: inrush/OVP event or mux switch transient; amp enable timing not coordinated with rails. First fix: tune inrush/soft-start and power-path handoff; gate amp enable with rail-good and add pop suppression.
MPN examples (USB-C front-end protection)
  • VBUS OVP/eFuse: TI TPS25947, ADI LTC4365
  • USB2/CC ESD: TI TPD2EUSB30, Nexperia PESD families
Reboot / Reset (random resets, brownouts)
Target: catch the first rail that moves
Symptom: “Random reboot during calls / spatial mode” First 2 checks: (1) TP_SYS min voltage at reboot moment. (2) Battery current peak or gauge log (if available). Discriminator: if TP_SYS dips below UVLO → power integrity; if TP_SYS is stable but reset occurs → ESD/EMI entry or watchdog. Likely root cause: load step from RF + amp exceeds source impedance; battery internal resistance; insufficient bulk/decoupling; UVLO threshold too high. First fix: add bulk near SYS, reduce rail impedance, adjust UVLO/soft-start strategy, isolate amp rail to reduce SYS bounce.
MPN examples (brownout hardening)
  • Supervisor / reset IC: TI TPS3839, Maxim MAX16054
  • Ideal diode / power mux: TI TPS2121
  • Battery gauge: TI BQ27441, Maxim MAX17048
Symptom: “Reboot happens when touching frame / during dry weather” First 2 checks: (1) Record reset marker time vs touch events. (2) Inspect which entry point lacks ESD return near the connector/opening. Discriminator: if resets cluster with touch/port interaction → ESD entry; if resets occur under RF duty only → rail/return coupling. Likely root cause: missing/poorly placed ESD device; long return to chassis/ground corridor; flex/hinge reference break. First fix: add ESD arrays at the entry point with shortest return, ensure ground continuity across flex/hinge, protect touch lines with RC/series R.
Spatial Drift / Wobble (pose mismatch, latency instability)
Target: prove timebase integrity before tuning fusion
Symptom: “Spatial image slowly drifts while head is still” First 2 checks: (1) IMU timestamp drift / align error vs time. (2) Temperature or mode tags (charging/RF duty) in the same log. Discriminator: if align error grows with time or changes at mode boundaries → timebase mapping integrity; if align error stable but drift persists → IMU bias/placement. Likely root cause: timebase mapping drift; jitter in scheduling; IMU clock vs audio clock mismatch; IMU bias drift. First fix: tighten timestamp alignment (hardware timebase or calibrated mapping), reduce jitter sources (PLL rail isolation), and validate with fixed-pose tests.
MPN examples (IMU options)
  • 6-axis IMU: TDK InvenSense ICM-42688-P, Bosch BMI270
  • Low-power IMU: ST LSM6DSO family
Symptom: “Wobble appears only when RF is busy or charging” First 2 checks: (1) Retry/Duty counter or PD event log. (2) IMU align error spikes at the same time. Discriminator: if align error spikes coincide with RF/charging → clock/rail jitter injection; if align error stable → IMU mechanics/placement. Likely root cause: RF burst injects into PLL/timebase; charger ripple modulates clock; ground bounce impacts timestamp path. First fix: isolate PLL/IMU rails, improve return corridor, and re-run fixed-pose validation with stress toggles.
Charging / USB-C (PD loops, play-while-charging noise, heat)
Target: stabilize power-path and reduce injected noise
Symptom: “PD keeps renegotiating / charge starts then stops” First 2 checks: (1) PD attach/contract events timeline. (2) TP_VBUS and TP_SYS stability during events. Discriminator: if VBUS droops at renegotiation → source or inrush/OVP; if VBUS stable but SYS dips → power-path/charger limits or thermal throttling. Likely root cause: inrush too aggressive; OVP/eFuse triggering; charger thermal loop or input current limit oscillation. First fix: tune inrush/ILIM, verify OVP/eFuse thresholds, improve thermal path or set stable input current limit strategy.
MPN examples (OVP/eFuse, PD sink, charger)
  • OVP/eFuse: TI TPS25947, ADI LTC4365
  • PD sink controller: TI TPS25750, STUSB4500
  • Charger: TI BQ25895, TI BQ25601
Symptom: “Play-while-charging adds hiss even at low volume” First 2 checks: (1) TP_AFE ripple vs battery-only baseline. (2) FFT snapshot to see switching-related lines. Discriminator: if TP_AFE ripple rises with charging and FFT shows lines → injected switching noise; if ripple is unchanged → return-path contamination or RF duty coupling. Likely root cause: insufficient AFE/PLL rail isolation; charger switching regime too close to audio-sensitive bands; shared return with amp or port. First fix: add bead+LDO/RC isolation for AFE/PLL, constrain charger mode to fixed-frequency, reroute returns to prevent charger currents crossing audio reference.
BOM/MPN reference table (quick list)
  • USB-C PD Sink: TI TPS25750; ST STUSB4500
  • OVP/eFuse (VBUS/SYS): TI TPS25947; ADI LTC4365
  • Li-ion Charger (power-path): TI BQ25895; TI BQ25601
  • Fuel Gauge: TI BQ27441; Maxim MAX17048
  • Supervisor/Reset: TI TPS3839; Maxim MAX16054
  • Low-noise LDO: TI TPS7A20; ADI ADP150
  • Load Switch: TI TPS229xx family
  • IMU: TDK ICM-42688-P; Bosch BMI270; ST LSM6DSO family
  • Audio Amp examples: TI TPA2016D2; TI TPA6132A2
  • ESD Arrays (low-speed/USB2): TI TPD4E05U06; TI TPD2EUSB30; Nexperia PESD families
  • Ferrite Beads: Murata BLM18 series; TDK MPZ series (choose by Z/I)

Note: MPNs are examples to anchor selection. Final choice depends on voltage/current, footprint, ESD level, and noise targets.

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H2-12 — FAQs (Evidence-based) + FAQPage JSON-LD

FAQ rule (no scope creep)

Each answer is constrained to this page’s evidence chain: power domains, mic AFE, IMU sync, RF coexistence, USB-C PD power path, clocks, EMC/ESD, and validation. Every answer provides two evidence checks, a binary discriminator, and a first fix.

Figure F12 — FAQ → Evidence → Chapter map
Audio AR Glasses — FAQ to Evidence Map A three-column map connecting the twelve FAQ questions to evidence nodes (TP rails, counters, flags, timestamps) and to the chapter anchors H2-2 through H2-11. FAQ → Evidence → Chapter Map Each FAQ routes to two evidence checks, then maps back to the owning chapter FAQs Evidence Nodes Chapters Q1 Standby drain overnight Q2 Always-on hiss after wear Q3 Call hiss (BT active) Q4 Noisy while charging Q5 Spatial drift over time Q6 Wobble on head turns Q7 Click/pop (intermittent) Q8 Some phones drop more Q9 Touch temple causes noise Q10 Type-C sometimes won’t charge Q11 Wi-Fi increases latency Q12 After ESD: dropouts begin TP_SYS ripple TP_AFE ripple TP_AMP ripple Retry / Duty counter PLL lock / frame marker IMU TS / align error AMP protect flag PD attach / contract ESD entry marker H2-2 Power domains H2-3 Mic AFE H2-4 Playback path H2-5 IMU latency H2-6 Wireless coexist H2-7 USB-C PD path H2-8 PI & noise H2-9 Clocks & sync H2-10 EMC/ESD H2-11 Debug playbook
F12 is a navigation aid: each FAQ routes to two evidence checks (TP rails / counters / flags / timestamps), then points back to the owning chapter for deeper design and isolation steps.
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Figure F12 — “FAQ → Evidence → Chapter Map” (ICNavigator)
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Standby drains fast overnight — what to check first?
Maps to: H2-2 (power domains)
Answer First 2 checks: log AON current in Ship/Standby and compare to spec; then measure BAT-side quiescent draw with the system “off.” Discriminator: high AON current implies an always-on rail or wake source is not gated; normal AON but high BAT draw points to power-path leakage or backfeed. First fix: tighten rail gating and verify charger/power-mux reverse blocking (e.g., TPS2121-class behavior).
Hiss appears immediately after wearing — gain or rail noise?
Maps to: H2-3 (mic AFE), H2-8 (PI & noise)
Answer First 2 checks: capture TP_AFE ripple/noise while hiss is present; then lock mic gain/bias to a known-safe setting and re-test. Discriminator: hiss tracking TP_AFE/TP_SYS ripple indicates rail injection or return-path contamination; hiss changing mainly with gain/bias indicates front-end headroom or input coupling. First fix: add post-reg isolation (bead + low-noise LDO such as TPS7A20/ADP150) and keep AFE return local.
During BT calls it “sizzles” — RF burst coupling or amp PSRR?
Maps to: H2-6 (wireless coexist), H2-8 (PI & noise)
Answer First 2 checks: record retry/duty counters during the call; probe TP_SYS or TP_AMP ripple in the same window. Discriminator: sizzle aligned with retry peaks and ripple spikes suggests RF burst current injecting through rails/returns; stable rails but RF-correlated noise suggests near-field antenna coupling into audio/clock routing. First fix: strengthen RF/AMP decoupling, isolate AFE/PLL rails, and enforce keep-out between antenna feed and mic/clock traces.
Noise is worse while charging — VBUS ripple or ground return?
Maps to: H2-7 (USB-C PD path), H2-8 (PI & noise)
Answer First 2 checks: probe TP_VBUS and TP_SYS ripple while charging; correlate with PD/charger mode events (attach/contract or mode change). Discriminator: noise lines shifting with switching mode and higher ripple indicates switching injection/beat; low ripple but worse noise points to shared return paths (charger currents crossing audio reference). First fix: constrain charger to a stable switching regime and move charger return away from AFE/AMP reference; add AFE/PLL post-LDO isolation.
Spatial direction slowly drifts — IMU bias or timestamp alignment?
Maps to: H2-5 (IMU latency), H2-9 (clocks & sync)
Answer First 2 checks: log IMU align error versus audio frame time over minutes; track PLL lock/frame markers (and temperature tag if available). Discriminator: align error growing or jumping at mode boundaries indicates timebase mapping/sync integrity; stable alignment but drift indicates IMU bias drift or mechanical placement sensitivity. First fix: tighten timestamp alignment (hardware timebase or calibrated mapping) and isolate PLL rail from bursty loads; then validate IMU bias under fixed-pose tests.
Sound image wobbles when turning head — IMU jitter or audio frame delay?
Maps to: H2-5 (IMU latency)
Answer First 2 checks: measure IMU sample-interval jitter (or timestamp jitter) during turns; capture audio frame delay markers or buffer underflow indicators. Discriminator: wobble coincident with IMU jitter spikes suggests sampling/scheduling instability; wobble tracking frame delay variation suggests audio pipeline buffering/clock-domain boundary issues. First fix: stabilize IMU sampling cadence and pin alignment to frame boundaries; remove mode-driven jitter sources (DVFS/PLL perturbations) during spatial render.
Intermittent click/pop — amp protection or clock lock jitter?
Maps to: H2-4 (playback), H2-9 (clocks & sync)
Answer First 2 checks: read AMP protect flags (OC/OT/DC) around the event; correlate with PLL unlock/relock or TP_SYS dips. Discriminator: protect flags leading the click point to load/thermal/return issues; PLL events or SYS transients leading point to clock/rail perturbation or mute/unmute timing. First fix: verify output return loop and protection thresholds, then gate amp enable with rail-good and harden PLL/codec rails using low-noise post-reg isolation.
Some phones disconnect more often — retry rate or RSSI first?
Maps to: H2-6 (wireless coexist)
Answer First 2 checks: compare retry/duty counters across phones in the same pose; then compare RSSI as a secondary indicator. Discriminator: poor RSSI with modest retries suggests antenna efficiency/body absorption; acceptable RSSI but high retries suggests coexistence interference, near-field coupling, or RF scheduling contention. First fix: optimize antenna keep-out and ground reference for the temple layout, then reduce coupling into sensitive rails/returns so RF bursts do not destabilize audio and timing domains.
Touching the temple creates noise — touch return or mic-line coupling/ESD?
Maps to: H2-3 (mic AFE), H2-10 (EMC/ESD)
Answer First 2 checks: align touch-event timestamps with audio noise bursts; probe AFE reference/ground-bounce proxy near the mic front-end. Discriminator: noise aligned with touch edges and ground bounce indicates return-path contamination (touch currents crossing audio reference); noise localized to mic activity indicates mic-line coupling or entry-point ESD injection. First fix: add series-R/RC and ESD arrays at touch entry (TPD4E05U06-class), and keep mic lines away from touch routing with a continuous reference corridor across flex/hinge.
Type-C sometimes won’t charge — CC/PD issue or protection drop?
Maps to: H2-7 (USB-C PD), H2-10 (EMC/ESD)
Answer First 2 checks: inspect CC/PD attach and contract events; measure VBUS-to-SYS drop across the front-end protection during attach. Discriminator: unstable PD events suggest CC integrity/ESD placement/EMI; stable PD but large drop or collapse suggests OVP/eFuse/ILIM or inrush behavior. First fix: move CC/USB ESD close to the port with shortest return, then tune inrush/ILIM and verify OVP/eFuse thresholds (e.g., TPS25947/LTC4365-class protection behavior).
Enabling Wi-Fi increases audio latency — power-domain switching or coexist scheduling?
Maps to: H2-2 (power domains), H2-6 (wireless coexist)
Answer First 2 checks: log domain/state transitions (AON→Active, RF/CPU DVFS) when Wi-Fi turns on; track retry/duty or link busy indicators in the same interval. Discriminator: latency steps aligned with domain/DVFS transitions indicate power-domain policy causing timing shifts; latency aligned with high duty/retries indicates coexist scheduling contention and resource pressure. First fix: stabilize audio-critical clocks/rails during Wi-Fi activity and reduce coupling (rails/returns) so RF bursts do not perturb timing and buffering.
After an ESD event, dropouts start — which return path to suspect first?
Maps to: H2-10 (EMC/ESD), H2-11 (debug playbook)
Answer First 2 checks: identify the ESD entry (USB-C, touch, mic opening, antenna tip) and log what counter/flag changed first (retry spikes, PLL unlock, rail ripple, or amp protect). Discriminator: immediate domain-specific anomalies indicate the damaged/weak return path at that entry; issues only under RF/charging stress suggest coupling paths exposed by ESD. First fix: harden the entry-point ESD device placement and shortest return to ground corridor, then re-run the H2-11 two-check isolation under stress toggles.
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