Audio AR Glasses: Low-Power SoC, Mic AFE, IMU & USB-C PD
Audio AR Glasses succeed when the system is engineered as a verifiable chain: ultra-low-power audio capture/playback, IMU head-tracking with tight timestamp alignment, robust 2.4 GHz coexistence, and a quiet USB-C PD power path. This page shows how to partition domains, choose key IC blocks, and debug real-field symptoms using evidence (rails, counters, flags, timestamps) instead of guesswork.
H2-1 — Page “Answer” + What this page covers
Audio AR glasses succeed when five hardware chains are engineered as a single, testable system: ultra-low power domains, mic-array AFE, IMU head-tracking timing, BT/Wi-Fi coexistence, and a USB-C PD power path that does not inject audible noise.
This page is built for selection (key specs per block), architecture (domain + interface partitioning), and field debug (symptom → evidence → isolate → fix) using measurable points on rails, counters, and timestamps.
- Block-level architecture with named interfaces (PDM/TDM/I2S, I²C/SPI) and first measurement taps (VBUS/SYS/BAT/AON/AMP).
- Always-on vs active partition rules to prevent overnight drain and “won’t stay asleep” failures.
- Evidence-first debug hooks: rail ripple signatures, RF retry counters, IMU timestamp drift, amp protection flags.
- Hard boundaries that prevent scope creep into cloud/app/OS topics.
Allowed (this page):
audio AR glasses, low-power audio SoC/DSP, mic-array AFE, IMU timing/sync, temple speakers/amps, BT/LE Audio + Wi-Fi coexistence (device-side), USB-C PD sink power path, charger/fuel gauge/PMIC rails, EMC/ESD, validation evidence.
Banned (do not cover):
cloud voice platforms, mobile app UX, router/mesh tuning, generic Bluetooth tutorials, OS audio stack deep dives, camera/ISP, optics/display deep dives, unrelated wearables.
H2-2 — System Partitioning: Always-on vs Active Domains
Audio AR glasses fail silently when “standby” is not truly low-power. The fix is not a bigger battery first—it’s a clean partition: Always-on (AON) handles only detection and logging, while Active domains (SoC cores, RF, amps) wake on explicit events.
This section defines a partition that is measurable (rail-level current and wake reasons), debuggable (domain-by-domain isolation), and audio-safe (no RF/charger bursts injected into mic/amp rails during sensitive states).
- AON domain is allowed to: wear detect, button/gesture IRQ, minimal IMU sampling, wake reason logging, timekeeping.
- AON domain is NOT allowed to: keep main RF active, poll sensors continuously, run audio DSP frames, or hold high-speed clocks.
- Active domain wakes only on events: wear + user intent, wake word trigger, link request, or USB attach (debounced).
- Every domain must be observable: rail enable state, wake source, average current, and at least one “health flag”.
- Audio/IMU sync must be planned: IMU samples need timestamp alignment to audio frames (or drift appears as spatial instability).
Use ranges and deltas. The exact number depends on battery size and feature set; what matters is which domain causes the step.
- Ship / storage: “almost off” — only ship-mode logic. If drain exists, suspect leakage paths (port protection, charger, gauge).
- Standby (AON only): µA to sub-mA class. If higher, suspect IMU not in low-power mode, noisy wake loops, or rail never disabling.
- Listen / trigger-ready: low-mA class. If too high, suspect mic bias/AFE never gating, or “AON” accidentally pulling high-speed clocks.
- Call / music: tens-to-hundreds mA. If unexpectedly high, suspect RF retries (poor link), amp efficiency/rail choice, or charger burst coupling.
Debug principle: reduce the system to one powered domain at a time (AON only → AON+IMU → add RF → add amp) and record the current delta after each enable.
- Rail current steps: log AON/CORE/RF/AMP enable states and measure step size per transition.
- Wake reasons: count wake IRQ types (wear, button, timer, USB attach, RF event). “Too many wakes” is often the root cause.
- RF retry counter: a link issue can double RF duty cycle and make “battery drain” look like a power-design problem.
- Charger burst marker: correlate audible artifacts with charger switching bursts during play-while-charging states.
H2-3 — Audio Capture Front-End: Mic Array, AFE, and PDM/TDM Plumbing
In audio AR glasses, microphone performance is limited by three coupled chains: mechanical coupling (wind/handling), front-end noise & PSRR (rail/RF/charger bursts), and multi-mic timing (PDM clock distribution and TDM slot mapping). This section locks each chain to measurable evidence so “algorithm blame” can be avoided.
- Temple mics (near hinges): best mouth proximity but highest exposure to finger contact and wind shear; treat as “high-SNR, high-disturbance” inputs.
- Bridge mic (nose/center): lower handling/wind sensitivity but often needs higher gain; AFE EIN and bias stability become first-order.
- Reference/environment mic (rear/outer): more likely to see near-field RF coupling (antenna adjacency + long routing); keep PDM routing short and return path controlled.
- Mechanical isolation priority: seating compliance (grommet/foam), controlled port geometry, and a clear “no-touch zone” are often higher ROI than DSP tuning.
Minimum evidence: record a short clip per channel during (1) quiet room, (2) temple touch, (3) head turn in airflow. Compare the channel-to-channel amplitude ratios and the spectrum “shape” before any algorithm changes.
- EIN (input-referred noise): dominates when bridge mic gain is high or when acoustic ports attenuate speech. Evidence: noise floor rises roughly with gain; compare quiet-room clips across gain steps.
- PSRR (rail-to-audio rejection): critical for glasses because RF bursts and charger switching are frequent. Evidence: audio hiss/glitches time-align with AFE rail ripple.
- Input range & bias stability: prevents clipping on loud speech and handling impulses. Evidence: flat-top waveforms or sudden “crack” aligned with bias settling.
- Dynamic range / THD+N: keeps loud speech + ambient from pushing nonlinearity. Evidence: harmonic rise during high SPL without a corresponding rail disturbance.
- Start-up / gating behavior: enables listen-trigger states without pops or missed frames. Evidence: first 100–300 ms after wake shows transients or missing channel data.
Design check: treat AFE as both an analog block and a “rail sensor.” If BT/charging changes the AFE output in silence, the first fix is usually rail isolation + routing/return, not algorithm.
- PDM clock distribution: use a single low-jitter source and keep clock/data edge integrity consistent; routing asymmetry shows up as channel phase mismatch.
- TDM slot mapping: wrong slot/word-width/sign extension can mimic “bad mic.” Evidence: a single-tone input appears on the wrong channel or with unexpected amplitude scaling.
- I²S/TDM timing integrity: BCLK/LRCLK jitter or bursts can raise the noise skirt. Evidence: spectral “hash” that correlates with RF activity even when rails look clean.
- Debug taps are mandatory: include at least one PDMCLK tap, one TDM/I²S tap, and one AFE-rail ripple tap for correlation.
Minimum test method: inject a consistent acoustic source (beep/whistle) and verify channel order, polarity, and relative phase before attempting beamforming tuning.
H2-4 — Playback Path: Temple Speakers / Open-Ear Amps, Click/Pop, and Hearing Safety
Temple speakers are physically close to microphones and antennas. The playback path must be designed as a controlled power + EMI + protection system: amplifier class choice, rail strategy, and hardware protections determine click/pop, audible hiss during RF bursts, and safety under fault conditions.
This section stays hardware-first: it covers amplifier behaviors, protection flags, and measurement taps—not DSP feature tutorials.
- Class-D (often filterless): high efficiency for wearables, but switching edges raise EMI risk. Evidence: hiss/glitches appear with RF bursts or charger activity even when audio content is constant.
- Class-AB / linear: easier low-noise/low-EMI behavior but poorer efficiency and higher heat. Evidence: loudness drops gradually after minutes (thermal foldback) rather than instantaneous dropouts.
- PSRR matters either way: open-ear amps often sit on rails that also feed RF/PMIC. Evidence: audible artifacts correlate with AMP rail ripple.
- Routing priority: keep the amp output loop compact; control return path to avoid injecting current spikes into mic/AFE ground references.
- Short / over-current (OC): sweat/contamination or wiring faults can trigger protection. Evidence: output collapses while the amp flag asserts; rail current spikes.
- Thermal foldback (TH): enclosed temple volume traps heat. Evidence: gradual loudness reduction under constant content; temperature rise precedes behavior.
- DC detect (DC): prevents sustained offset at the speaker. Evidence: pop events may align with bias transitions; check output offset around events.
- Limiter (LIM): hardware-domain peak control to avoid sudden SPL spikes (alerts/tones). Evidence: peaks are clipped/limited without wideband distortion growth.
- Click/pop control: sequencing of rails, mute timing, and bias ramps is the first layer; do not treat pop as a “codec bug” until rails and flags are confirmed.
Minimum measurement set: (1) AMP rail ripple, (2) amp protection flags, (3) speaker output (TP_OUT) around event edges (connect/disconnect, wake, charge attach).
H2-5 — IMU for Spatial Audio: Head-Tracking Data Path and Latency Budget
Spatial audio in AR glasses fails most often due to timing integrity, not “DSP quality”: IMU noise/bias drift drives wobble and slow yaw drift, while timestamp jitter and frame alignment create unnatural latency variance. This section turns head-tracking into a measurable pipeline with clear latency/jitter budgets.
- Noise density: governs short-term wobble. Evidence: at-rest angle/gyro variance (short windows) is high; spectrum shows a raised noise floor.
- Bias drift (and temp drift): governs slow yaw drift. Evidence: constant-pose log shows monotonic walk; drift worsens with temperature change.
- Bandwidth & sample rate: governs fast head-turn phase lag. Evidence: repeat fast turn produces consistent lag/overshoot vs reference timing markers.
- Power modes & wake latency: governs “first seconds feel wrong” after wake. Evidence: first N frames after wake show unstable heading or latency jumps.
- Timestamp support: determines alignment quality. Evidence: sample interval jitter distribution (min/typ/max) indicates how stable the timebase is.
Design rule: treat the IMU as a timing source, not only a sensor. If sample timing is unstable, spatial audio will feel unstable even with perfect math.
- IMU sampling + timestamp generation: jitter here directly becomes render jitter. Evidence: sample interval histogram; watch for long-tail gaps around sleep/radio bursts.
- Fusion / sensor hub compute: scheduling and DVFS create variance. Evidence: compute time min/typ/max per update cycle; spikes correlate with RF activity or power-state transitions.
- Audio frame boundary alignment: frame-based pipelines quantize timing. Evidence: consistent “step-like” lag equal to frame duration or buffer boundary.
- Render → codec/output buffering: buffer depth stabilizes underflow but increases delay. Evidence: mode changes (music/call/update) shift total delay noticeably.
Target: keep total latency in a practical tens-of-milliseconds range and prioritize low variance. A stable fixed offset is easier to compensate than jitter.
- Strategy A — common hardware timebase: IMU timestamps map cleanly to the audio timebase. Best for low jitter. Failure signature: fixed offset if mapping is wrong; periodic wobble if drift is uncorrected.
- Strategy B — software-mapped timebase: periodic calibration maps IMU time to SoC time. Failure signature: latency variance increases under CPU load; drift changes across power states.
- Strategy C — frame-edge sampling (simplest): sample only at audio frame boundaries. Failure signature: fast head turns “trail” with a step-like lag; small motions feel quantized.
- Minimum evidence set: (1) IMU sample interval jitter, (2) IMU→audio frame alignment error, (3) end-to-end latency variance across modes.
Debug heuristic: if wobble appears without rail ripple, suspect timestamp jitter. If drift grows with temperature, suspect bias/temp drift and timebase mapping stability.
H2-6 — Wireless Links: BT/LE Audio + Optional Wi-Fi, and Coexistence Evidence
In AR glasses, “wireless issues” often show up as audio hiss, glitches, and dropouts. Treat coexistence as three measurable coupling paths: power ripple, ground return (bounce), and antenna near-field coupling. The goal is to correlate artifacts to rails + counters before changing audio processing.
- Antenna placement: temple ends are common, but human absorption and head pose create strong left/right asymmetry; plan for orientation-sensitive margins.
- Ground reference continuity: long, narrow frames make return paths fragile; discontinuities increase both RF loss and coupling into audio references.
- Keep-out from audio traces: avoid running PDM/TDM and amp output loops parallel to antenna feed/PA regions; near-field coupling can mimic “bad AFE.”
- Coexistence by evidence: when retries rise, RF duty cycle rises, and current spikes get larger—making power/ground coupling worse even if RF “works.”
Minimum observability: log RSSI and retry counters, and measure ripple on the AFE/AMP rails during RF bursts.
- Hiss increases when link is active: first check AFE/AMP rail ripple and retry duty. If hiss aligns with bursts, fix rail isolation/return path first.
- Dropouts + hiss together: check packet retry counter and system current spikes. Poor antenna efficiency increases duty cycle → worsens coupling.
- Only bad while charging: check VBUS/SYS ripple and audio glitch markers; PD/charger switching can create beat notes and ground path shifts.
- Only certain phones show it: compare retry rates and RF duty patterns; higher occupancy patterns stress power/ground coupling even with similar RSSI.
Rule of thumb: if artifacts correlate with rails/counters, treat it as a coupling problem. If artifacts do not correlate, then investigate timing/mapping (H2-3) or timestamp jitter (H2-5).
H2-7 — USB-C PD Power Path: Sink, Protect, Charge, and Play-While-Charging
USB-C PD on AR audio glasses is a power-path system, not just “charging.” The design must survive attach/contract events, prevent fault energy at the port, and keep audio stable during play-while-charging. This section decomposes the Sink path into measurable nodes: VBUS → SYS → BAT → rails.
- Type-C port front-end: ESD and VBUS OVP are the first gate. Evidence: VBUS attach transient, OVP status, port temperature rise under abnormal adapters.
- PD Sink control (mention-only): CC detect and contract events can create step changes. Evidence: PD event timestamps aligned to SYS dips or audio pops.
- Power-path mux / NVDC SYS rail: the critical stability node for play-while-charging. Evidence: SYS droop or current limit flags during attach or load steps.
- Charger + battery: switching mode changes (PFM/PWM) can move ripple/beat notes. Evidence: BAT current ripple and noise peaks shift with charge state.
- PMIC rails: isolate sensitive rails (AFE/clock) from SYS ripple, and constrain high di/dt rails (AMP/RF). Evidence: AFE/AMP rail ripple correlation to hiss/glitch markers.
Minimum taps: TP_VBUS, TP_SYS, TP_BAT, TP_AON, TP_AMP (optionally TP_AFE).
- Ground return shift: charging currents change return paths and inject ground bounce into audio references. Evidence: hiss/pop aligns with charge current steps; ground bounce grows at shared return segments. First fix: reroute returns, reduce shared impedance, enforce keep-outs for audio reference.
- Switching beat notes: charger/buck switching interacts with class-D, PDM clocks, or load cadence and creates audible whine/modulation. Evidence: stable spectral lines/sidebands that move with charge mode or load. First fix: adjust switching regimes (avoid sensitive bands), add filtering or post-LDO isolation for sensitive rails.
- Insufficient isolation (PSRR window): LDO/filters fail to attenuate the dominant ripple band. Evidence: SYS ripple passes into AFE/PLL rails with weak attenuation. First fix: allocate LDOs/RC filters for AFE/PLL rails, tighten decoupling/return loops.
Correlation-first rule: prove coupling by logging audio glitch markers and measuring rail ripple at the same timestamps (attach, mode change, or RF burst).
H2-8 — Power Integrity & Audio Noise: Rail Strategy, PSRR, and Grounding for Glasses Form Factor
“Audio noise” in glasses is usually a rail + return-path problem. The goal is to map hiss/whine/pop to specific sensitive rails (AFE/clock/AMP/RF), then choose a rail strategy (buck vs LDO isolation) and a grounding plan that prevents RF and AMP di/dt currents from contaminating audio references.
- AFE AVDD / mic bias: most sensitive to ripple and ground bounce; directly raises noise floor. Evidence: hiss correlates with TP_AFE ripple or ground bounce markers.
- DAC/PLL / audio clock rail: sensitive to jitter; rail noise becomes skirts/spurs. Evidence: spectral “skirts” or spurs increase under RF/charge activity.
- AMP PVDD: large pulsed currents; easiest to pollute SYS/ground. Evidence: noise/glitches scale with volume and load steps; TP_SYS droop increases.
- RF rail: Tx bursts create current steps that excite SYS impedance. Evidence: artifacts align with retry duty / burst cadence even when RSSI looks fine.
Measurement rule: always capture two traces together: one sensitive rail (AFE/clock/AMP) and one system stress indicator (SYS ripple or retry duty).
- Use buck for heavy rails: SYS/AMP/RF want efficiency, but they generate ripple and di/dt stress.
- Use LDO/RC for sensitive rails: AFE and clock rails need isolation from SYS ripple bands. Evidence: measure attenuation across LDO (pre vs post ripple).
- PSRR is frequency-dependent: isolation may fail at the dominant ripple band (charger switching, RF burst envelope). Evidence: weak attenuation at the noise band explains “hiss only during X”.
- Keep the isolation local: place decoupling and reference returns close to the consumer block, not only near the PMIC.
Practical A/B tests: (1) battery-only vs charging, (2) low vs high volume, (3) RF idle vs high retry duty. The pattern classifies the root cause quickly.
- Close high-current loops locally: amp output and supply returns must not travel across AFE reference regions.
- Keep RF returns out of audio reference corridors: avoid shared impedance segments that convert PA di/dt into ground bounce at AFE.
- Partition by return corridors, not by “cut grounds”: define allowed return paths (short, low-Z) and enforce keep-outs for sensitive references.
- Flex/connector continuity: ensure reference ground does not become a long inductive bridge; watch for common-mode excursions when charging or transmitting.
Debug cue: if noise changes with touch, suspect mechanical coupling or reference instability; if it changes with retry duty, suspect RF-induced rail/return coupling.
- Touch/handling noise: impulsive broadband spikes or low-frequency thumps. Evidence: correlates with touch timestamps; SYS ripple may not change.
- Charging noise: stable lines/sidebands in spectrum; may drift with charge mode. Evidence: correlates with TP_SYS/TP_BAT ripple and mode transitions.
- Tx burst noise: hiss/pop aligned with RF cadence. Evidence: correlates with retry counter/duty, SYS ripple, and ground bounce markers.
Action: classify first by correlation (rails/counters), then apply isolation/return fixes before tuning audio processing.
H2-9 — Clocks & Sync: Low-Jitter Audio, PLL Isolation, and Timestamp Integrity
Spatial audio and wireless stability depend on a clean clock tree and trustworthy timestamps. Jitter and drift become audible as noise floor rise, spurs/roughness, and time-alignment errors between IMU samples and audio frames. This section maps: XO → PLL → MCLK/BCLK/LRCK and IMU timebase, then shows where buck/charger ripple and RF bursts inject noise—and how to prove it with evidence.
- Reference source (XO/TCXO): the root of system timing. If reference quality or supply isolation is weak, downstream PLL outputs inherit or amplify jitter.
- PLL / clock generator: creates MCLK and domain clocks. Noise on the PLL rail or reference node becomes output phase noise (audible as spurs/roughness).
- Audio clock distribution: MCLK/BCLK/LRCK routing and loading should avoid noisy return corridors (AMP/RF/charger). Long temple routing increases sensitivity.
- IMU timebase: must map into the same timing frame as audio frames. Timestamp integrity is as important as the IMU itself; drift/jitter becomes spatial mismatch.
Minimum observables: PLL lock flags/events, frame/glitch markers, and IMU sample interval jitter statistics under mode changes.
- THD+N worsens / “rough” sound: audio FFT shows raised skirts or new spurs under charging/RF activity. Discriminator: correlates with SYS/PLL rail ripple or retry duty. First fix: isolate PLL/codec rails and constrain noisy returns.
- Periodic whine/modulation: stable spectral lines that shift with charger/buck mode. Discriminator: spurs move with switching regime. First fix: change switching regime away from sensitive bands, add filtering/post-LDO isolation.
- Random clicks/pops: align with lock/unlock/relock events or clock-domain transitions. Discriminator: lock status event timestamps match pop markers. First fix: stabilize PLL rail and avoid abrupt domain switches.
- Spatial drift/wobble: IMU-to-audio alignment error grows or jitters with time/temperature/load. Discriminator: alignment error tracks timebase drift rather than IMU noise. First fix: tighten timestamp mapping and reduce scheduling/clock jitter.
- Drop/glitch only during high RF duty: glitch markers correlate with retry counter and SYS ripple. Discriminator: bursts coincide with PLL rail perturbation. First fix: improve RF rail decoupling/return corridor, and protect clock domain rails.
Rule: always capture a clock-domain proxy (lock/status or jitter proxy) together with a stressor trace (SYS ripple or RF duty) to prove causality.
H2-10 — EMC/ESD & Mechanical Reality: What breaks in the field (and how to harden)
Glasses form factor means human contact + long narrow routing + exposed openings + Type-C. Most field failures are caused by entry points (USB-C, touch, mic ports, speaker vents, antenna near-field, flex/hinge) and return-path mistakes. This section hardens the design by entry point using a repeatable loop: risk → mitigation → verification evidence.
- USB-C port: ESD + attach transients + contract changes. Mitigation: port TVS/OVP, CC ESD arrays, short return to ground corridor. Verify: PD event log aligned with TP_VBUS/TP_SYS, audio pop/glitch markers.
- Buttons / touch strip: direct human ESD injection, false triggers, resets. Mitigation: series R/RC, ESD device placement, route away from mic/clock refs. Verify: touch timestamp vs reset/noise correlation.
- Mic openings / PDM lines: high-impedance nodes, long routing, flex coupling. Mitigation: series R, local filtering, reference stability, keep-out from RF feed. Verify: PDM error counters + silence noise floor under stress.
- Speaker vents / AMP outputs: strong EMI source + large loop currents. Mitigation: minimize loop area, filter/FB where needed, keep returns local. Verify: high volume vs retry duty vs SYS ripple correlation.
- Antenna near-field: coupling into audio/clock/power and forces high retry duty. Mitigation: keep-out, feed isolation, RF return corridor, rail decoupling. Verify: retry counter vs audio glitch/noise markers.
- Flex/hinge discontinuities: reference breaks and common-mode excursions. Mitigation: ground pin strategy, corridor continuity, avoid “charging return into mic ref.” Verify: posture/hold tests with TP_GND_BNC proxy.
Pass logic: after hardening, the same stress should show reduced ripple/markers, not just “subjective improvement.”
H2-11 — Validation & Field Debug Playbook: Symptom → Evidence → Isolate → Fix
Pick a symptom card, run First 2 checks only, then follow the Discriminator to isolate the domain: Power, RF/Coexistence, Clock/PLL, IMU timebase, or Amp protection/returns. Each card ends with a first fix that can be implemented without re-architecting the product.
Each card uses the same four-line structure: First 2 checks / Discriminator / Likely root cause / First fix. BOM/MPN examples are provided as references, not requirements.
Noise (hiss/whine/touch noise/RF noise)
Target: isolate AFE/AMP/PLL/returns in ≤10 minutes
- USB-C PD Sink Ctrl: TI TPS25750, STUSB4500
- Power-path / charger: TI BQ25895, TI BQ25601
- Low-noise LDO for AFE/PLL: TI TPS7A20, ADI ADP150
- Ferrite bead (rail isolation): Murata BLM18 series (choose by impedance/current)
- ESD for RF/hi-speed (low C): Semtech RClamp family, TI TPD low-cap ESD families
- Common-mode choke (2.4G not typical; for USB2/CC lines): Murata DLW21, TDK ACM families
- Audio amp (high PSRR / low EMI): TI TPA2016D2 (Class-D), TI TPA6132A2 (HP amp)
- ESD array for low-speed lines: TI TPD4E05U06, Nexperia PESD families
- Touch controller examples: Microchip ATMXT family, Synaptics (vendor-specific)
Drop / Glitch (audio gaps, clicks, pops)
Target: separate RF vs power vs clock-domain transitions
- Low-noise LDO: TI TPS7A20, ADI ADP150
- Load switch (controlled ramp): TI TPS229xx family
- Clock buffer/jitter cleaner (if needed in complex designs): Silicon Labs Si53xx families
- VBUS OVP/eFuse: TI TPS25947, ADI LTC4365
- USB2/CC ESD: TI TPD2EUSB30, Nexperia PESD families
Reboot / Reset (random resets, brownouts)
Target: catch the first rail that moves
- Supervisor / reset IC: TI TPS3839, Maxim MAX16054
- Ideal diode / power mux: TI TPS2121
- Battery gauge: TI BQ27441, Maxim MAX17048
Spatial Drift / Wobble (pose mismatch, latency instability)
Target: prove timebase integrity before tuning fusion
- 6-axis IMU: TDK InvenSense ICM-42688-P, Bosch BMI270
- Low-power IMU: ST LSM6DSO family
Charging / USB-C (PD loops, play-while-charging noise, heat)
Target: stabilize power-path and reduce injected noise
- OVP/eFuse: TI TPS25947, ADI LTC4365
- PD sink controller: TI TPS25750, STUSB4500
- Charger: TI BQ25895, TI BQ25601
- USB-C PD Sink: TI TPS25750; ST STUSB4500
- OVP/eFuse (VBUS/SYS): TI TPS25947; ADI LTC4365
- Li-ion Charger (power-path): TI BQ25895; TI BQ25601
- Fuel Gauge: TI BQ27441; Maxim MAX17048
- Supervisor/Reset: TI TPS3839; Maxim MAX16054
- Low-noise LDO: TI TPS7A20; ADI ADP150
- Load Switch: TI TPS229xx family
- IMU: TDK ICM-42688-P; Bosch BMI270; ST LSM6DSO family
- Audio Amp examples: TI TPA2016D2; TI TPA6132A2
- ESD Arrays (low-speed/USB2): TI TPD4E05U06; TI TPD2EUSB30; Nexperia PESD families
- Ferrite Beads: Murata BLM18 series; TDK MPZ series (choose by Z/I)
Note: MPNs are examples to anchor selection. Final choice depends on voltage/current, footprint, ESD level, and noise targets.
H2-12 — FAQs (Evidence-based) + FAQPage JSON-LD
Each answer is constrained to this page’s evidence chain: power domains, mic AFE, IMU sync, RF coexistence, USB-C PD power path, clocks, EMC/ESD, and validation. Every answer provides two evidence checks, a binary discriminator, and a first fix.
Standby drains fast overnight — what to check first?
Maps to: H2-2 (power domains)
Hiss appears immediately after wearing — gain or rail noise?
Maps to: H2-3 (mic AFE), H2-8 (PI & noise)
During BT calls it “sizzles” — RF burst coupling or amp PSRR?
Maps to: H2-6 (wireless coexist), H2-8 (PI & noise)
Noise is worse while charging — VBUS ripple or ground return?
Maps to: H2-7 (USB-C PD path), H2-8 (PI & noise)
Spatial direction slowly drifts — IMU bias or timestamp alignment?
Maps to: H2-5 (IMU latency), H2-9 (clocks & sync)
Sound image wobbles when turning head — IMU jitter or audio frame delay?
Maps to: H2-5 (IMU latency)
Intermittent click/pop — amp protection or clock lock jitter?
Maps to: H2-4 (playback), H2-9 (clocks & sync)
Some phones disconnect more often — retry rate or RSSI first?
Maps to: H2-6 (wireless coexist)
Touching the temple creates noise — touch return or mic-line coupling/ESD?
Maps to: H2-3 (mic AFE), H2-10 (EMC/ESD)
Type-C sometimes won’t charge — CC/PD issue or protection drop?
Maps to: H2-7 (USB-C PD), H2-10 (EMC/ESD)
Enabling Wi-Fi increases audio latency — power-domain switching or coexist scheduling?
Maps to: H2-2 (power domains), H2-6 (wireless coexist)
After an ESD event, dropouts start — which return path to suspect first?
Maps to: H2-10 (EMC/ESD), H2-11 (debug playbook)
Place the FAQPage JSON-LD script (provided below) anywhere on the page (recommended: right after this H2-12 section).