Introduction & Scope
Rad-Tolerant / Space LDO focuses on LDOs hardened for TID and SEE, with latch-up/SEU protection, wide-temperature packaging (−55…+125/150 °C), and documented process control. For small-batch procurement and engineering validation in space/high-radiation missions.
Included
- TID target (e.g., 10–100 krad(Si)) and SEE risk assessed
- −55…+125/150 °C; ceramic/metal packages; lot control
- CoC/CoA and test reports; small-batch & cross-brand path
Excluded
- Generic low-noise or ultralow-IQ tuning guides
- Unverified radiation claims or invented certificates
- Certification deep-dives (handled on compliance pages)
Radiation Fundamentals
TID (dose-driven drift) and SEE (single-event effects) determine selection and validation. Key SEE types: SEL, SEB, SEGR, SET, SEU. Dose-rate modes: HDR vs LDR.
What to ask vendors
- TID curves (not single points), failure criteria
- SEE report: spectra, fluence, bias, SEL handling
- Lot-to-lot variation evidence
Design reminders
- Post-TID stability & PSRR/Noise re-check
- RC/π filters and proper decoupling
- Current limit & power-cycle for SEL
Selection Criteria
Pick LDOs by radiation targets first (TID, LET), then trade Iq / PSRR / noise / dropout, verify SOA & thermal, and finalize package & compliance.
1) Radiation
- TID budget × ≥1.5–2× margin
- LET_th / LET_max defined
- HDR/LDR context noted
2) Electrical
- Iq (modes), PSRR@100 Hz/10 k/1 MHz
- Noise (µV_rms, 10–100 k)
- Dropout @ I_out target
3) SOA & Thermal
- Load step / overload limits
- RθJA & temperature derating
- SEE stress vs SOA
4) Package & Compliance
- −55…+125/150 °C, ceramic/metal
- QML-V / ESCC (or reports)
- Lot-to-lot evidence
Stability & Layout for SEE
Keep loop stable under radiation and tame SET by correct compensation & decoupling, minimal loop area, proper AGND/PGND partition, and near-source TVS/RC.
Compensation & Caps
- ESR window; X7R C_in/C_out
- FB/RC reference to AGND
- Post-TID phase margin check
Loop & Grounding
- Minimize input-output-GND loop
- Kelvin sense to load
- AGND–PGND single-point tie
SET Mitigation
- TVS near connector/source
- RC/π filters on output path
- PG/RESET on clean routes
Qualification & Test
Prove usability under your mission’s dose and particle spectrum: record TID curves, run SEE bench, and verify lot consistency via LAT. Curves > single points; include spectra, fluence, bias, temperature, and acceptance criteria.
TID Curves
- 5–7 dose points from 0→target
- Record Vout, Iq, Dropout, PSRR
- HDR & LDR runs; −55/25/+125/150 °C
SEE Bench
- SEL: LET_th / LET_max, limit & power-cycle
- SEB/SEGR: derating + clamp A/B
- SET/SEU: Vout pulse & register upset
Lot Acceptance (LAT)
- Traceable lot IDs (wafer/pack)
- Reduced TID points + key SEE
- CSV logs, waveforms, SOP files
Mini IC Matrix (Real Parts)
Real PNs only; fill mission-specific numbers from vendor datasheets/irradiation reports. Keep rows lean; one CTA at the end.
| Brand / PN (Package) | Radiation (TID / LET) | Electrical (Vin/Vout/Iout) | Dropout / Iq / PSRR / Noise | Package / Temp | Compliance / Notes | Action |
|---|---|---|---|---|---|---|
| TI — TPS7H1101A-SP (ceramic) | TID target per DS; LET_th/LET_max (vendor data) — fill from report | Vin 1.5–7 V; Vout adj; Iout up to 3 A | Dropout/ Iq/ PSRR@100 Hz/10 k/1 MHz/ Noise — fill | −55…+125/150 °C; bottom thermal pad | Radiation-Hard/Space; reports available | Submit BOM (48h) |
| Renesas — ISL75051SEH (ceramic) | TID curve; LET data — fill | Vin 2.2–6.0 V; Vout adj; Iout 3 A | Dropout/ Iq/ PSRR/ Noise — fill | −55…+125 °C; ceramic | Rad-Hard line; screening grades | Submit BOM (48h) |
| Renesas — ISL75051SRH (ceramic) | TID/LET — fill | Vin 2.2–6.0 V; Vout adj; Iout 3 A | Dropout/ Iq/ PSRR/ Noise — fill | −55…+125 °C | Screened variant | Submit BOM (48h) |
| Renesas — ISL75051ASEH / ISL73051ASEH | TID/LET — fill | Vin 2.2–6.0 V; Vout adj; Iout 3 A | Dropout/ Iq/ PSRR/ Noise — fill | −55…+125 °C | Alternate screening options | Submit BOM (48h) |
| ST — RHFL4913A (ceramic, QML-V) | TID/SEL published — fill values | Vin ~3–12 V; Vout adj; Iout 2–3 A | Dropout/ Iq/ PSRR/ Noise — fill | −55…+125 °C; QML-V | ESCC/QML-V line | Submit BOM (48h) |
| Microchip — MIC69303RT (radiation-tolerant) | TID/SEE per vendor — fill values | Vin 1.65–5.5 V; Vout adj; Iout 3 A | Dropout/ Iq/ PSRR/ Noise — fill | −55…+125 °C; ceramic/metal option | Radiation-Tolerant program; reports available | Submit BOM (48h) |
Note: Fill TID (krad(Si)), LET_th / LET_max (MeV·cm²/mg), PSRR points, and noise (µVrms, 10–100 kHz) from official datasheets/reports before release.
Application Notes
Apply space LDOs with correct power-up/down sequencing, robust upstream redundancy, and clear monitoring/latching rules. Use the cards below as an engineering checklist before flight-like testing.
Power-Up/Down Sequencing
- Define PG threshold & min/max delay
- Choose coincident vs ratiometric
- Handle pre-bias; avoid back-feed
- Enable controlled discharge path
Upstream Redundancy
- A/B sources with ideal-diode OR-ing
- Place TVS/clamp at connector
- Decouple SEL recovery from switchover
- Define current limit & timing window
Monitoring & Latching
- Minimal V/I/T telemetry set
- Match filter BW to SET pulse width
- Pre-trigger buffer for brown-outs
- Event codes and watchdog policy
FAQs (PAA + Social)
Engineer-tone answers (45–60 words each). Social micro-answers follow after the FAQ list.
How much TID margin should I plan for a space LDO?
Budget mission dose realistically and apply 1.5× to 2× design margin. Verify with curves, not single points, across temperature and bias. Acceptable drift bands must be defined for Vout, Iq, dropout, and PSRR. If data only exists at HDR, add extra conservatism for long LDR exposure.
What do LET_th and LET_max mean for SEL immunity?
LET_th is the threshold where latch-up stops occurring; LET_max is the highest tested level without destructive effects. Choose devices whose LET_th exceeds your environment and confirm protection: current limit, power-cycle timing, and thermal margins. If only LET_max is stated, treat immunity as uncertain.
HDR vs LDR: which better predicts on-orbit performance?
LDR testing usually reflects long mission exposure more closely, but you still need HDR data to de-risk process sensitivity. Compare both sets for parameter drift trends. If only HDR is available, increase margin and plan an engineering test campaign with representative temperature and bias conditions.
How do I accept PSRR and noise after TID?
Define frequency points (100 Hz, 10 kHz, 1 MHz) and a noise bandwidth (e.g., 10–100 kHz). Require drift curves at each dose step. Re-measure stability and phase margin with post-TID capacitors. If noise rises into ADC bands, add a secondary low-noise stage or RC/π filtering.
How do I handle pre-bias and prevent back-feed at start-up?
Use a start-up profile tolerant of pre-biased outputs and place ideal-diode OR-ing or reverse blocking where rails can interact. Confirm discharge paths and soft-start ramp avoid reverse current. Validate with scoped transients under worst-case cable resistance and temperature corners.
How can RC/π filters tame SET without destabilizing the loop?
Place the filter after the regulator where load sensitivity is highest and size the cutoff above the control loop bandwidth but below expected SET energy. Reference feedback RC to AGND and re-check phase margin with injection. Tune snubbers only with measured waveforms, not estimates.
How should I set current limit and power-cycle timing for SEL?
Limit quickly to protect silicon and thermals, then enforce a power-off interval long enough to clear parasitic conduction. Re-enable with an idempotent boot sequence. Keep SEL recovery independent from A/B source switchover to avoid tug-of-war between redundant rails.
Where should I tie AGND and PGND in a space LDO design?
Partition analog and power grounds and make a single-point tie near the regulator ground pin or sense return. Keep feedback, reference, and sense networks in the AGND island. Route high di/dt returns in PGND and avoid cross-currents through sensitive nodes.
What are common mistakes with Kelvin sensing to the load?
Don’t share sense traces with power currents or route them near switching edges. Keep the pair tightly coupled and equal length to the load pads. Place the sense RC at the amplifier side and reference it to AGND. Validate with load-step measurements at temperature extremes.
When do I need a two-stage rail (rad-tolerant pre-reg + low-noise post-reg)?
Use two stages when radiation limits noise/PSRR performance, or when a sensitive ADC/RF block needs a quieter local domain. Make the outer stage space-qualified and the inner stage focused on noise. Ensure start-up ordering and drop-out stacking remain valid across temperature.
What is a minimal Lot Acceptance (LAT) plan for LDOs?
Sample each lot with reduced TID dose points and at least one SEE condition covering SEL susceptibility. Compare against development reference curves with predefined drift windows. Deliver raw CSV logs, waveforms, setup photos, and a signed acceptance form with lot IDs and screening grades.
How do I turn V/I/T logs into a single state-of-health score?
Normalize each metric versus nominal and weight by mission criticality. Penalize drift beyond acceptance bands and count event density for SEL/SET. Use a rolling window to smooth noise and store pre-trigger history for context. Score ranges should map to action: observe, retest, or replace.
Which fails first after radiation: low noise or high PSRR?
It depends on the architecture, but reference drift and loop gain reduction often degrade PSRR before noise hits user limits. Always compare curves at defined frequency points and re-validate stability. If PSRR is marginal, add post-filtering or a cascaded low-noise regulator.
QML-V/ESCC device vs “Rad-Tolerant + reports”: how to choose?
Choose QML-V/ESCC when mission risk and process assurance dominate or your customer mandates it. Choose Rad-Tolerant with third-party reports for cost- or schedule-driven prototypes, but document limitations, add larger margins, and perform your own validation to mission-like conditions.
How do I preserve event logs across brown-out gaps?
Use pre-trigger RAM, periodic snapshots, and wear-aware storage. On PG drop, write a compact record with timestamps and last-known states, then shut down. On restart, merge records and increment a monotonic boot counter. Keep logging firmware idempotent and test under worst-case transients.
Social Micro-Answers
- TID margin: plan 1.5–2×; verify with curves across temperature. #SpaceLDO
- LET_th is immunity threshold; LET_max is the proven upper bound. #SpaceLDO
- LDR mirrors long missions; keep HDR data for process checks. #SpaceLDO
- Post-TID: re-measure PSRR/noise and phase margin before flight. #SpaceLDO
Submit BOM (48h)
Small-batch space builds need fast, reliable substitutions. Send your BOM for 48-hour feedback on cross-brand alternatives, pin-compatible options, and data-backed checks (TID/LET, PSRR, dropout, temperature grade). We keep NDAs and traceability to vendor reports.
- Space-grade & rad-tolerant LDO sourcing across TI / ST / Renesas / Microchip / onsemi / NXP / Melexis
- Pin-to-Pin or near-equivalent mapping, with derating notes
- Datasheet & irradiation report verification (where available)
- Low MOQs and quick prototype support
Same package & pinout. Validate TID/SEL claims and thermal pad rules.
Electrical equivalence + derating. Check dropout, Iq, PSRR points and LET.
Two-stage rail (rad-tolerant pre-reg + low-noise post-reg). Verify sequencing.
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