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Introduction & Scope

Rad-Tolerant / Space LDO focuses on LDOs hardened for TID and SEE, with latch-up/SEU protection, wide-temperature packaging (−55…+125/150 °C), and documented process control. For small-batch procurement and engineering validation in space/high-radiation missions.

Included

  • TID target (e.g., 10–100 krad(Si)) and SEE risk assessed
  • −55…+125/150 °C; ceramic/metal packages; lot control
  • CoC/CoA and test reports; small-batch & cross-brand path

Excluded

  • Generic low-noise or ultralow-IQ tuning guides
  • Unverified radiation claims or invented certificates
  • Certification deep-dives (handled on compliance pages)
Included — Space LDO Applicability TID/SEE requirements • −55…+125/150 °C • Ceramic/metal pkg • Test evidence TID target set SEE risk assessed Wide-temp package Lot/test records Excluded — Out of Scope Generic low-noise tuning Unverified claims Deep certification topics Legend: green cards = allowed scope; red/gray cards = excluded topics.
Scope at a glance — what this page covers for space LDO procurement and what it does not.

Radiation Fundamentals

TID (dose-driven drift) and SEE (single-event effects) determine selection and validation. Key SEE types: SEL, SEB, SEGR, SET, SEU. Dose-rate modes: HDR vs LDR.

TID — Total Ionizing Dose Drift: Vref, PSRR, Iq, dropout, bias currents Plan margin (≥1.5×) Request curves, not points Lot-to-lot check Stability after drift SEE — Single-Event Effects SEL — Latch-up Mitigation: current limit, power-cycle SEB / SEGR Mitigation: derating, clamp SET — Transient Mitigation: RC/π filtering SEU — Upset Mitigation: watchdog, lock-bits LET_th → immunity threshold; LET_max → survivability HDR vs LDR LDR often better matches long-term on-orbit behavior Tie selections to dose/LET targets; verify test spectra and bias conditions match application.
TID causes parameter drift; SEE includes SEL/SEB/SEGR/SET/SEU — with quick mitigation hints. LET strip and HDR/LDR reminder included.

What to ask vendors

  • TID curves (not single points), failure criteria
  • SEE report: spectra, fluence, bias, SEL handling
  • Lot-to-lot variation evidence

Design reminders

  • Post-TID stability & PSRR/Noise re-check
  • RC/π filters and proper decoupling
  • Current limit & power-cycle for SEL

Selection Criteria

Pick LDOs by radiation targets first (TID, LET), then trade Iq / PSRR / noise / dropout, verify SOA & thermal, and finalize package & compliance.

1) Radiation

  • TID budget × ≥1.5–2× margin
  • LET_th / LET_max defined
  • HDR/LDR context noted

2) Electrical

  • Iq (modes), PSRR@100 Hz/10 k/1 MHz
  • Noise (µV_rms, 10–100 k)
  • Dropout @ I_out target

3) SOA & Thermal

  • Load step / overload limits
  • RθJA & temperature derating
  • SEE stress vs SOA

4) Package & Compliance

  • −55…+125/150 °C, ceramic/metal
  • QML-V / ESCC (or reports)
  • Lot-to-lot evidence
Radiation TID margin ≥1.5–2× LET_th / LET_max HDR / LDR Electrical Iq • PSRR • Noise Dropout @ I_out V_in/V_out range SOA & Thermal RθJA • derating Overload margins SEE stress Package & Compliance −55…+125/150 °C • ceramic/metal • bottom-thermal pad QML-V / ESCC or verified reports • Lot consistency Legend: green = radiation • blue = electrical • orange = SOA/thermal • gray = compliance.
Selection flow — start with radiation targets, then electrical trades, then SOA/thermal, and finish with package/compliance checks.

Stability & Layout for SEE

Keep loop stable under radiation and tame SET by correct compensation & decoupling, minimal loop area, proper AGND/PGND partition, and near-source TVS/RC.

Compensation & Caps

  • ESR window; X7R C_in/C_out
  • FB/RC reference to AGND
  • Post-TID phase margin check

Loop & Grounding

  • Minimize input-output-GND loop
  • Kelvin sense to load
  • AGND–PGND single-point tie

SET Mitigation

  • TVS near connector/source
  • RC/π filters on output path
  • PG/RESET on clean routes
LDO TVS near source Short, wide input path RC/π filter Short output loop AGND PGND Single-point tie FB/RC to AGND Kelvin sense at load PG/RESET on clean track Keep high di/dt loops small, reference FB/RC to AGND, place TVS close to connector, and tune RC/π to tame SET without hurting phase margin.
Layout hotspots — where to place TVS, RC/π filters, AGND–PGND tie, FB/RC to AGND, and Kelvin sense to the load to keep the loop stable under SEE.

Qualification & Test

Prove usability under your mission’s dose and particle spectrum: record TID curves, run SEE bench, and verify lot consistency via LAT. Curves > single points; include spectra, fluence, bias, temperature, and acceptance criteria.

TID Curves

  • 5–7 dose points from 0→target
  • Record Vout, Iq, Dropout, PSRR
  • HDR & LDR runs; −55/25/+125/150 °C

SEE Bench

  • SEL: LET_th / LET_max, limit & power-cycle
  • SEB/SEGR: derating + clamp A/B
  • SET/SEU: Vout pulse & register upset

Lot Acceptance (LAT)

  • Traceable lot IDs (wafer/pack)
  • Reduced TID points + key SEE
  • CSV logs, waveforms, SOP files
Dose (krad(Si)) Δ Parameter (Vout/Iq) Acceptable drift band Watch band (re-test) Reject band Target ≈1.5–2× margin Legend Green band = pass · Yellow = retest · Red = fail
TID curves over dose points with acceptance bands and target/margin markers. Record Vout, Iq, Dropout, PSRR at each point.
Beam & Spectrum LET, fluence, angle DUT Bias Vin, load, temp SEL Limit & power-cycle (ms–s) SEB/SEGR Derating + clamp SET / SEU Vout pulse, register upset Log width/amp/recovery Include raw logs (CSV), waveforms, test SOP, and acceptance criteria for LAT.
SEE bench essentials — capture spectra/fluence, bias & temperature, and SEL/SEB/SEGR/SET/SEU responses with recovery strategies.

Mini IC Matrix (Real Parts)

Real PNs only; fill mission-specific numbers from vendor datasheets/irradiation reports. Keep rows lean; one CTA at the end.

Brand / PN (Package) Radiation (TID / LET) Electrical (Vin/Vout/Iout) Dropout / Iq / PSRR / Noise Package / Temp Compliance / Notes Action
TI — TPS7H1101A-SP (ceramic) TID target per DS; LET_th/LET_max (vendor data) — fill from report Vin 1.5–7 V; Vout adj; Iout up to 3 A Dropout/ Iq/ PSRR@100 Hz/10 k/1 MHz/ Noise — fill −55…+125/150 °C; bottom thermal pad Radiation-Hard/Space; reports available Submit BOM (48h)
Renesas — ISL75051SEH (ceramic) TID curve; LET data — fill Vin 2.2–6.0 V; Vout adj; Iout 3 A Dropout/ Iq/ PSRR/ Noise — fill −55…+125 °C; ceramic Rad-Hard line; screening grades Submit BOM (48h)
Renesas — ISL75051SRH (ceramic) TID/LET — fill Vin 2.2–6.0 V; Vout adj; Iout 3 A Dropout/ Iq/ PSRR/ Noise — fill −55…+125 °C Screened variant Submit BOM (48h)
Renesas — ISL75051ASEH / ISL73051ASEH TID/LET — fill Vin 2.2–6.0 V; Vout adj; Iout 3 A Dropout/ Iq/ PSRR/ Noise — fill −55…+125 °C Alternate screening options Submit BOM (48h)
ST — RHFL4913A (ceramic, QML-V) TID/SEL published — fill values Vin ~3–12 V; Vout adj; Iout 2–3 A Dropout/ Iq/ PSRR/ Noise — fill −55…+125 °C; QML-V ESCC/QML-V line Submit BOM (48h)
Microchip — MIC69303RT (radiation-tolerant) TID/SEE per vendor — fill values Vin 1.65–5.5 V; Vout adj; Iout 3 A Dropout/ Iq/ PSRR/ Noise — fill −55…+125 °C; ceramic/metal option Radiation-Tolerant program; reports available Submit BOM (48h)

Note: Fill TID (krad(Si)), LET_th / LET_max (MeV·cm²/mg), PSRR points, and noise (µVrms, 10–100 kHz) from official datasheets/reports before release.

Application Notes

Apply space LDOs with correct power-up/down sequencing, robust upstream redundancy, and clear monitoring/latching rules. Use the cards below as an engineering checklist before flight-like testing.

Power-Up/Down Sequencing

  • Define PG threshold & min/max delay
  • Choose coincident vs ratiometric
  • Handle pre-bias; avoid back-feed
  • Enable controlled discharge path

Upstream Redundancy

  • A/B sources with ideal-diode OR-ing
  • Place TVS/clamp at connector
  • Decouple SEL recovery from switchover
  • Define current limit & timing window

Monitoring & Latching

  • Minimal V/I/T telemetry set
  • Match filter BW to SET pulse width
  • Pre-trigger buffer for brown-outs
  • Event codes and watchdog policy
Sequencing Rail A (PG) Rail B (delay) Discharge Coincident vs ratiometric; verify PG drift after TID. Redundancy Source A Source B Ideal-OR LDO Input TVS Place TVS at connector; decouple SEL recovery from OR-ing logic. SEL Latching Current Limit Power-Cycle Timer Event Log (PG/SEU) Record timestamp, duration, and cause; restart must be idempotent.
Timing, redundancy, and SEL latching at a glance — label PG windows, place TVS and OR-ing correctly, and define current limit with power-cycle and logging.

Submit BOM (48h)

FAQs (PAA + Social)

Engineer-tone answers (45–60 words each). Social micro-answers follow after the FAQ list.

How much TID margin should I plan for a space LDO?

Budget mission dose realistically and apply 1.5× to 2× design margin. Verify with curves, not single points, across temperature and bias. Acceptable drift bands must be defined for Vout, Iq, dropout, and PSRR. If data only exists at HDR, add extra conservatism for long LDR exposure.

What do LET_th and LET_max mean for SEL immunity?

LET_th is the threshold where latch-up stops occurring; LET_max is the highest tested level without destructive effects. Choose devices whose LET_th exceeds your environment and confirm protection: current limit, power-cycle timing, and thermal margins. If only LET_max is stated, treat immunity as uncertain.

HDR vs LDR: which better predicts on-orbit performance?

LDR testing usually reflects long mission exposure more closely, but you still need HDR data to de-risk process sensitivity. Compare both sets for parameter drift trends. If only HDR is available, increase margin and plan an engineering test campaign with representative temperature and bias conditions.

How do I accept PSRR and noise after TID?

Define frequency points (100 Hz, 10 kHz, 1 MHz) and a noise bandwidth (e.g., 10–100 kHz). Require drift curves at each dose step. Re-measure stability and phase margin with post-TID capacitors. If noise rises into ADC bands, add a secondary low-noise stage or RC/π filtering.

How do I handle pre-bias and prevent back-feed at start-up?

Use a start-up profile tolerant of pre-biased outputs and place ideal-diode OR-ing or reverse blocking where rails can interact. Confirm discharge paths and soft-start ramp avoid reverse current. Validate with scoped transients under worst-case cable resistance and temperature corners.

How can RC/π filters tame SET without destabilizing the loop?

Place the filter after the regulator where load sensitivity is highest and size the cutoff above the control loop bandwidth but below expected SET energy. Reference feedback RC to AGND and re-check phase margin with injection. Tune snubbers only with measured waveforms, not estimates.

How should I set current limit and power-cycle timing for SEL?

Limit quickly to protect silicon and thermals, then enforce a power-off interval long enough to clear parasitic conduction. Re-enable with an idempotent boot sequence. Keep SEL recovery independent from A/B source switchover to avoid tug-of-war between redundant rails.

Where should I tie AGND and PGND in a space LDO design?

Partition analog and power grounds and make a single-point tie near the regulator ground pin or sense return. Keep feedback, reference, and sense networks in the AGND island. Route high di/dt returns in PGND and avoid cross-currents through sensitive nodes.

What are common mistakes with Kelvin sensing to the load?

Don’t share sense traces with power currents or route them near switching edges. Keep the pair tightly coupled and equal length to the load pads. Place the sense RC at the amplifier side and reference it to AGND. Validate with load-step measurements at temperature extremes.

When do I need a two-stage rail (rad-tolerant pre-reg + low-noise post-reg)?

Use two stages when radiation limits noise/PSRR performance, or when a sensitive ADC/RF block needs a quieter local domain. Make the outer stage space-qualified and the inner stage focused on noise. Ensure start-up ordering and drop-out stacking remain valid across temperature.

What is a minimal Lot Acceptance (LAT) plan for LDOs?

Sample each lot with reduced TID dose points and at least one SEE condition covering SEL susceptibility. Compare against development reference curves with predefined drift windows. Deliver raw CSV logs, waveforms, setup photos, and a signed acceptance form with lot IDs and screening grades.

How do I turn V/I/T logs into a single state-of-health score?

Normalize each metric versus nominal and weight by mission criticality. Penalize drift beyond acceptance bands and count event density for SEL/SET. Use a rolling window to smooth noise and store pre-trigger history for context. Score ranges should map to action: observe, retest, or replace.

Which fails first after radiation: low noise or high PSRR?

It depends on the architecture, but reference drift and loop gain reduction often degrade PSRR before noise hits user limits. Always compare curves at defined frequency points and re-validate stability. If PSRR is marginal, add post-filtering or a cascaded low-noise regulator.

QML-V/ESCC device vs “Rad-Tolerant + reports”: how to choose?

Choose QML-V/ESCC when mission risk and process assurance dominate or your customer mandates it. Choose Rad-Tolerant with third-party reports for cost- or schedule-driven prototypes, but document limitations, add larger margins, and perform your own validation to mission-like conditions.

How do I preserve event logs across brown-out gaps?

Use pre-trigger RAM, periodic snapshots, and wear-aware storage. On PG drop, write a compact record with timestamps and last-known states, then shut down. On restart, merge records and increment a monotonic boot counter. Keep logging firmware idempotent and test under worst-case transients.

Social Micro-Answers

  • TID margin: plan 1.5–2×; verify with curves across temperature. #SpaceLDO
  • LET_th is immunity threshold; LET_max is the proven upper bound. #SpaceLDO
  • LDR mirrors long missions; keep HDR data for process checks. #SpaceLDO
  • Post-TID: re-measure PSRR/noise and phase margin before flight. #SpaceLDO

Submit BOM (48h)

Submit BOM (48h)

Small-batch space builds need fast, reliable substitutions. Send your BOM for 48-hour feedback on cross-brand alternatives, pin-compatible options, and data-backed checks (TID/LET, PSRR, dropout, temperature grade). We keep NDAs and traceability to vendor reports.

  • Space-grade & rad-tolerant LDO sourcing across TI / ST / Renesas / Microchip / onsemi / NXP / Melexis
  • Pin-to-Pin or near-equivalent mapping, with derating notes
  • Datasheet & irradiation report verification (where available)
  • Low MOQs and quick prototype support
Submit BOM (48h) We reply with substitutions, risks, and lead-time notes.
Exact

Same package & pinout. Validate TID/SEL claims and thermal pad rules.

Close

Electrical equivalence + derating. Check dropout, Iq, PSRR points and LET.

Bridge

Two-stage rail (rad-tolerant pre-reg + low-noise post-reg). Verify sequencing.

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