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← Back to: Supervisors & Reset

What It Solves in Vehicles

Map vehicle electrical events—cold crank, load dump, and ISO-7637-2 3a/3b spikes—to supervisor/reset IC duties: precise thresholds, adequate hysteresis, robust deglitch (tDEB), and safe RESET semantics (tRST). Prefer monitoring on post-regulation rails; VBAT-side sensing is for coarse under-voltage alerts only.

Vehicle Events

Cold-crank valley and recovery ripple; load-dump high-energy pulse; ISO-7637-2 fast transients (3a/3b).

Effects on Rails

VBAT sag/overshoot, slow ramps, coupled spikes → risk of false resets or missing resets.

Supervisor Role

Detect → filter/deglich + hysteresis → assert/reset semantics → log to upper layer.

Mapping ISO-7637/load-dump events to thresholds, hysteresis, debounce, and reset delay Left: cold-crank valley/recovery, load-dump hump, ISO-7637 3a/3b spikes. Right: mapping cards Vth, ΔHyst, tDEB, tRST. Cranking / Load Dump · ISO-7637 Immunity · Reset Timing Vehicle Events Cold Crank valley + recovery ripple Load Dump long, high-energy hump ISO-7637 3a/3b fast transient spikes Map to Supervisor Parameters Threshold (Vth) choose Vth for minimum operating voltage under crank Hysteresis (ΔHyst) mute ripple and measurement noise; avoid chatter Deglitch (tDEB) windowed filter for 3a/3b; tDEB ≥ 2×burst spacing Reset Delay (tRST) tRST ≥ PLL lock + N×clock domain settle (N≈3–5)
Scenario Primary Effect Supervisor Function Note
Cold crank VBAT valley + slow recovery Vth, ΔHyst, tDEB, tRST monitor post-reg rails
Load dump long high-energy hump ΔHyst, tDEB post-protection residuals
ISO-7637 3a/3b fast transient spikes windowed deglitch tDEB ≥ 2×burst spacing

Rail Checklist

List Vnom, Vmin,crank, Noisepk-pk, trise,slow, Reset(Y/N) for VBAT / 5V / 3.3V / AUX.

Quick Recipes

  • tRST ≥ tPLL_lock + N×tCLK_DOM (N≈3–5)
  • tDEB ≥ max(ripple half-period, DC/DC soft-start glitch)
  • Monitor post-reg rails for accurate decisions

ISO-7637 / Load-Dump → Electrical Requirements

Translate automotive pulses into supervisor-side parameters: Vth, ΔHyst, tDEB, tRST, and dV/dt immunity. Consider the difference between pre-protection and post-protection residuals, and choose the sampling point wisely (VBAT side vs post-regulated rails).

From ISO-7637 and load-dump pulses to supervisor parameters Left: pulse family thumbnails with pre/post protection; right: parameter cards Vth, ΔHyst, tDEB, tRST, dV/dt immunity. Pulse family → residuals → parameter choices Pulses & Residuals Pulse 1 (neg.) pre vs post protection Pulse 2a/2b (pos.) residual capped by clamps Pulse 3a/3b (fast) windowed deglitch needed Load Dump long energy; check tRST window Supervisor Parameters Threshold (Vth) pick for minimum operating voltage under crank Hysteresis (ΔHyst) ≥ 1.5×(ripple pk-pk + measurement noise) Deglitch (tDEB) prefer windowed filter for 3a/3b; tDEB ≥ 2×burst spacing Reset Delay (tRST) tRST ≥ PLL lock + N×clock domain settle (N≈3–5) dV/dt immunity · choose sampling point to avoid false trips
Event Residual (post-protection) Vth (min/max) ΔHyst (est.) tDEB (window/single) tRST hint Notes
Pulse 1 (neg.) limited dip after clamp set for minimum operating voltage ≥1.5×(ripple+noise) short; single-pole OK ensure release margin avoid chatter near Vth
Pulse 2a/2b (pos.) capped positive surge no trip; check comparator headroom small to moderate short; single or window none or short stretch watch dV/dt coupling
Pulse 3a/3b (fast) narrow spikes remain unchanged low; rely on window filter windowed; ≥2×burst spacing no extra unless MCU needs primary mitigation via tDEB
Load dump long hump; reduced by clamps no trip; design headroom moderate longer; single or window ensure tRST covers settle check regulator settle time
Sampling Point Benefit Risk When to Use Notes
VBAT side sees raw events; early coarse alert false trips; needs larger ΔHyst rough undervoltage detection log only; avoid direct reset decision
Post-regulated rail accurate decision near MCU domain may miss raw VBAT events primary reset decision point pair with VBAT tag if needed

Quick Parameter Recipes

ΔHyst ≥ 1.5×(Ripplepk-pk + MeasNoiseeq) · tDEB ≥ 2×burst spacing for 3a/3b · Vth_tol ≤ 0.5×usable headroom · tREL ≥ tReg_settle + tMCU_bootstrap.

Thresholds, Windows & Delays under Cranking

Use window thresholds with hysteresis and well-chosen assert/release/stretch delays to avoid reboot storms during slow ramps and recovery ripple. Prefer windowed sampling for slow slopes.

Single vs Window

Window adds Vlow/Vhigh limits with hysteresis; better immunity to slow ramps and ripple than a single threshold.

Dynamic Hysteresis

Cold start: ΔHystcold = k×ΔVcrank (k≈0.3–0.5), decay to nominal within tdecay.

Delay Family

assert / release / stretch windows; set tREL ≥ tReg_settle + tMCU_bootstrap.

Reset semantics matrix and crank-time delays Top timing rail shows assert, stretch, and release windows with a note on dynamic hysteresis; below is a 2×3 matrix for OD/PP vs Hold/Stretch/Latch. Crank-time timing · assert / stretch / release · dynamic ΔHyst Timing Rail assert delay stretch window release delay ΔHyst₍cold₎ → ΔHyst₍nom₎ over t₍decay₎ Reset Semantics Matrix Open-Drain (OD) Push-Pull (PP) Hold Use wire-OR multi-domain; tolerant to level mix shared RPU Anti-pattern: huge RPU → slow edges / EMI Use single domain; clean edges PP same-V Anti-pattern: cross-domain back-power Stretch Use cover PLL lock / slow settle t ≥ tPLL Anti-pattern: indefinite stretch → boot hang Use tight timing + clean edges PP one-shot Anti-pattern: cross-V PP w/o clamp Latch require explicit clear (PG ∧ MCU_OK) label reset source; avoid unlabeled OR tree
Rail Vnom Vmin,crank / ΔVcrank ΔHystcold(k,tdecay) Vlow / Vhigh tDEB(assert/release) tRST(assert/release/stretch) Sampling Notes
3.3 V 3.3 — / — k=0.4, tdecay=100–300 ms Vlow≥Vmin,oper+M; Vhigh≤Vabs,max−M — / — assert≥min; release≥tReg+tMCU; stretch as needed window fill per design
5 V 5.0 — / — k=0.3, tdecay=150–400 ms Vlow/Vhigh with margin — / — stretch covers PLL lock window fill per design
AUX var — / — k=0.5, tdecay=50–200 ms limit for sensor/camera domain — / — stretch for long settle rails window fill per design

Reset Semantics (OD/PP, Hold, Stretch, Latch)

Design RESET as a cross-domain interface: choose OD vs PP, calculate RPU vs bus capacitance for edge targets, avoid back-power, and use hold/stretch/latch windows to prevent chain resets.

OD vs PP selection, wire-OR fanout, and back-power mitigation Left shows OD wire-OR tree with shared pull-up; right shows PP into same domain with clamp to prevent back-power; bottom strips illustrate hold, stretch, and latch semantics. OD wire-OR vs PP single-domain · fanout · back-power guard Open-Drain (OD) · Wire-OR RPU Pros: multi-V friendly, easy fanout · Cons: large RPU → slow edges/EMI Push-Pull (PP) · Same Domain PP Driver Clamp Guard to avoid back-power Pros: fast, clean edges · Risk: cross-domain overdrive → add series / clamp Hold / Stretch / Latch Hold: maintain until rail stable Stretch: extend ≥ tPLL_lock for clean boot Latch: require explicit clear (PG ∧ MCU_OK)
Domain (V) Edge Target (ns) RPU (kΩ) Cbus (pF) tRC (ns) OD/PP Risk Mitigation
3.3 ≤ 200 4.7–22 calc RPU×Cbus OD slow edge / EMI tune RPU, segment/buffer
5.0 ≤ 150 2.2–10 calc RPU×Cbus PP back-power series/clamp/level shift
AUX spec spec spec calc OD/PP fanout overload segment lines, add buffer

ASIL-Friendly Interfaces & Diagnostics

Build supervisors as measurable, diagnosable, and traceable safety interfaces: redundant thresholds, explicit PG/FAULT semantics, and power-fail time tags. Keep a clean boundary with upper-layer ASIL mechanisms (signals and timing only).

Dual-Channel Consistency

Monitor Vth_A/B mismatch. Trigger FAULT when |Vth_A−Vth_B| > min(εabs, εrel·Vnom) sustained for tconfirm.

Power-Fail Tag

On brown-out, write a minimal set: rail_id, seq/ts, state, reason, CRC. Ensure twrite ≤ tholdup.

Self-Test Hooks

Power-on self-test bit; periodic test via forced RESET low or virtual UV injection. Schedule with Tselftest within service strategy.

Redundant thresholds, PG/FAULT timing tags, and self-test hooks Probe points for A/B thresholds, PG/FAULT aggregation with source tags, power-fail record card, and self-test injection timeline. ASIL probes · PG/FAULT semantics · Power-fail tagging Redundant Thresholds Vth_A · Vth_B · Δ = |A−B| Mismatch Rule Δ ≤ min(εabs, εrel·Vnom) for tconfirm PG/FAULT Aggregation PG_agg = AND(PG_i) FAULT with Source Tag source_id · reason · seq/ts Power-Fail Tag Record Fields rail_id · seq/ts · state · reason · CRC twrite ≤ tholdup Self-Test Timeline Power-On Self-Test Periodic Injection (RESET low / UV simulate) Power-Fail Tag Window Tselftest within service policy · avoid critical workload windows
Signal Level Domain (V) Timing (assert/release) Self-Test Method Fault-Tag Fields Notes
RESET_OUT 3.3 / 5.0 tassert/trelease/stretch force low window source_id · seq/ts · reason log last_assertor
PG_rail_i per rail qualify window UV simulate rail_id · state AND into PG_agg
FAULT host domain latched until clear reason inject reason · seq/ts · CRC explicit clear policy

PCB/Layout Rules for Immunity

Route supervisors to be hard-to-spook and decision-accurate under ISO-7637 noise: minimize loop area, place sampling near regulated outputs, protect RESET/PG lines, and use Kelvin sense with proper ground returns.

Shortest return, probe locations, and filtering for ISO-7637 spikes Top view: VBAT→Protection→Regulator→Monitored rail; shows sampling point, RC/series R/TVS placement, return path arrows, and Kelvin sense dos/don’ts. Placement · Returns · Filtering for Supervisor Immunity Top View · Monitored Rail VBAT → Protection → Regulator → Load TVS/Clamp Regulator Sense (post-reg) RESET/PG line Rseries RC TVS Shortest return along ground plane Kelvin (Do) separate sense; close to output Kelvin (Don’t) long shared path, noisy return Rules & Checks Loop Area Reset/PG parallel to return; single-point ground Series-R / RC 10–100 Ω; RC ≤ tDEB/10 Placement Sense near regulator; avoid SW nodes Vias & Grounds few vias; return-close via fence
Risk Symptom Layout Action Check Notes
Coupling from SW node false reset spikes reroute away; add series-R / RC / TVS probe at RESET line; ISO-7637-3 inject RC time ≤ tDEB/10
Large loop area chatter, EMI pickup parallel return; ground fence vias current-return visualization single-point ground
Over/undershoot at input window trip errors RC snub; move sense post-filter scope residuals pre/post filter keep sensor path short

Cross-Brand Selection Matrix

Multi-voltage / cross-domain boards → prefer OD output and pull up to the target I/O domain.

Heavy cranking ripple → increase ΔHyst and extend tDEB / tRST.

Camera/SoC domains → consider SBC/PMIC families with multi-rail supervision.

Brand Family / Representative PN VIN Range Vth Typ / Acc Window (Y/N) tRST Options Output (OD/PP) AEC-Q100 Temp Grade Pkg Height ASIL Hooks Notes (why pick)
TI TPS3702-Q1 (dual-threshold/window supervisor) 2.2–18 V (per variant) UV/OV typ; ± acc (code-select) Y (independent UV/OV) Fixed/Selectable delays OD or PP options Yes (per suffix) -40~125 °C SOT/TSSOP low-profile PG/RESET split, easy tag Window + separate outputs simplify source tagging aggregation.
ST STM706/708 (check automotive ordering) Up to 5.5 V domain Fixed Vth variants N (single threshold) Fixed pulse widths OD / PP variants Varies by option -40~125 °C (typ.) SOT-23 low-height Basic RESET/PG Cost-effective baseline reset for simple rails.
NXP FS65 SBC (e.g., MC33FS6523) VBAT domain + multiple rails (PMIC) Config via SPI/I²C (family-specific) Y (multi-rail) Programmable / integrated OD/PP per pin spec Yes (SBC grade) -40~125 °C / wider QFN/PowerQFN WDT/RESET/Diag ready All-in-one for SoC/camera power trees with ASIL-friendly hooks.
Renesas ISL88014 (adj. threshold) / ISL88031 (multi-rail) 3.0–6 V (typ. family ranges) Adjustable / fixed options Y/N (per device) Fixed / selectable OD / PP variants Varies by option -40~125 °C (typ.) SOT/QFN low-profile PG/RESET split Good coverage for adjustable/window use with light BOMs.
onsemi NCV809 (MAX809-class, automotive) 3.0/3.3/5.0 V variants Fixed Vth options N (single threshold) Fixed pulse width(s) OD / PP variants Yes (NCV prefix) -40~125 °C (typ.) SOT-23 low-height Basic RESET Low-cost edge-domain reset; robust supply chain.
Microchip MCP1316/MCP1317 (check AEC-Q100 codes) Up to 5.5 V domain Fixed / selectable codes N (single threshold) Short/med/long pulses PP options for clean edges Varies by option -40~125 °C (typ.) SOT-23 low-height Basic RESET/PG Push-pull versions suit fast-edge / higher fan-out needs.
Melexis N/A (use external supervisor) — sensors/actuators integrate POR/BOD internally Use with TI/ST/NXP/etc. Pair with a discrete supervisor for system-level RESET/PG.

Validation & Corner Cases (Env / Line / Func)

Env (Temperature)

-40 / 25 / 85 / 125 °C: sweep threshold drift and tRST variation; record seq/ts and CRC tag.

Line (Power Profiles)

Cold-crank replay, slow ramps, steps, ripple overlay, load transients; verify ΔHyst and tDEB rules.

Func (Behavior)

False-reset storms, late reset, PG chatter, window mis-trip; ensure logging and clear criteria.

Case Setup (waveform / amplitude / source-Z) Expect (threshold / timing) Pass / Fail Criteria Log (event code / ts / temp)
ENV-T-Sweep Chamber −40→125 °C; rail at Vnom Vth drift ≤ spec; tRST within spec window No false RESET; PG stable rail_id, seq/ts, state, reason=ENV, CRC
ENV-Hold-Up Power fail; verify write within t_hold_up Tag recorded before collapse Log contains seq/ts; CRC valid rail_id, seq/ts, state=PF, CRC
LINE-Crank-Replay VBAT low-valley + rebound ripple profile No reset storm; tDEB filters ripple ≤1 reset per event; PG converges event=CRANK, ts, temp
LINE-Slow-Ramp dV/dt = low; ripple overlay 50–200 mVpp Window + ΔHyst avoid chatter; single RESET No PG chatter > tDEB event=SLOW_RAMP, ts
FUNC-False-Storm Inject burst spikes (3a/3b residual) tDEB prevents multi-fires; tag reasons Assert ≤1; tag contains source_id reason=SPIKE, seq/ts, CRC
FUNC-Late-Reset Step droop near Vmin_oper; observe delay tRST meets release spec; MCU cold start ok PLL lock margin met; no brown-out relapse state=RESET, ts, temp

Coverage Checklist

  • Env: thresholds and tRST across −40/25/85/125 °C.
  • Line: crank profile, slow ramp, steps, ripple overlay, load switching.
  • Func: false-reset storms, late reset, PG chatter, window mis-trip.
  • Logging: minimal set = rail_id, seq/ts, state, reason, CRC.

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Frequently Asked Questions

How do I translate ISO-7637 pulses into threshold, hysteresis, and delay specs?

Start from post-protection residuals: peak, duration, and slew. Map minimum operating voltage to Vth_low, add hysteresis sized to ripple plus measurement noise, and choose a deglitch window that exceeds the inter-spike spacing. For load dump, ensure reset delay covers regulator recovery. Prefer window supervisors when both undervoltage and overvoltage can appear during transients.

What reset pulse width guarantees a clean MCU clock domain after cold-crank?

Use a budget that exceeds clock and power settling: tRST >= tPLL_lock + 3 to 5 times the clock-domain start time, plus regulator settling margin. Include any boot ROM or supervisor release delay. If the power tree reorders during cranking, gate release on both stable voltage and a valid clock-good indicator to avoid partial starts.

When should RESET be open-drain instead of push-pull on mixed-voltage rails?

Choose open-drain when multiple domains or devices must share one reset line or when the receiving logic runs at a higher or different voltage. Pull up to the target I/O rail to ensure level compatibility. Prefer push-pull for single-domain, fast edges, and tight EMI control, but avoid back-powering and overvoltage on cross-domain paths.

How do I avoid chatter during slow ramps and alternator ripple?

Increase hysteresis to exceed ripple plus measurement noise, then apply a deglitch window longer than half the ripple period. Prefer integrating or K-of-M sampling rather than instantaneous comparison on slow slopes. During cranking, temporarily widen thresholds or extend delay, and release reset only after the regulator output is within margin and stable.

How much hysteresis is safe without masking real brown-outs?

Size hysteresis to at least one and a half times the expected ripple plus noise bandwidth, yet keep it below roughly half of the available voltage margin above the true minimum operating level. Validate at temperature corners and under ripple-injected tests. If nuisance trips persist, combine moderate hysteresis with a short deglitch window rather than huge hysteresis.

How do I log power-fail timing when VBAT collapses before the write?

Define a minimal record set and guarantee a hold-up window: rail_id, monotonic sequence or timestamp, state, reason, and CRC. Use a small buffer or capacitor-backed domain to complete the write. Without a secure real-time clock, rely on monotonic counters and rollover handling to maintain ordering and detect tamper or incomplete records.

What’s a robust deglitch filter for fast 3a/3b spikes?

Use a windowed digital filter or K-of-M sampling so isolated spikes do not trigger reset. Set the deglitch time longer than the inter-spike spacing observed after protection. Add a small series resistor and modest input capacitance to limit dV/dt injection, and confirm that the RC time constant remains well below functional delays.

How do I validate threshold accuracy across -40 to +125/150 °C?

Measure at -40, 25, 85, and 125 or 150 degrees Celsius using calibrated sources and the intended wiring harness. Record both threshold and reset timing drift, including pull-up effects on open-drain outputs. Accept parts only if worst-case results stay within data sheet limits and the aggregate margin still protects downstream clock and logic domains.

Can I share a supervisor across two rails without coupling fault domains?

Only if the device provides independent sense inputs and distinct outputs or tags per rail. Avoid tying rails through a single reset where one domain’s noise induces false trips on the other. Prefer multi-channel window supervisors or separate devices, and aggregate power-good signals with explicit source labels to preserve diagnostic clarity.

What’s the safest way to aggregate PG with other ASIL-relevant signals?

Use a directed wired-AND or logic gate so power-good requires all contributing rails to be valid. Attach a source_tag to any fault path and record reason and sequence. Time-align signals with small delays to avoid race conditions, and avoid anonymous OR networks that make root-cause analysis hard during field returns or audits.

How do I choose OD pull-up value to balance speed vs EMI?

Estimate rise time from RPU times bus capacitance and target an RC that meets edge-speed and EMI goals. Typical 3.3 volt domains start between 4.7 and 22 kiloohms and tune by measurement. For long lines or larger fan-out, split the net or buffer the reset to control capacitance rather than forcing very small pull-up resistors.

What procurement red flags indicate a risky “almost-equivalent” part?

Watch for looser threshold accuracy codes, missing AEC-Q100 references, different temperature grades, or taller packages that violate enclosure clearances. Scrutinize fixed delay codes, output type differences, and undocumented hysteresis. Unusual lead times, vague cross references, or relabeled lots are warning signs; demand traceable data sheets and parametric evidence before approval.