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Sample-&-Hold / Track-&-Hold (S/H, T/H) Design Guide

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Sample-&-Hold / Track-&-Hold stages “freeze” a fast-changing analog signal at a defined instant, so downstream circuits can measure a stable voltage without timing ambiguity. In real hardware, accuracy is limited by acquisition settling, pedestal/injection, droop/leakage (including DA), aperture jitter, and layout-coupled feedthrough—so success depends on proving each error term with repeatable tests and controlling the design knobs that drive them.

What S/H and T/H really do (and where they sit)

Scope: S/H (sample-and-hold) and T/H (track-and-hold) as analog signal-conditioning blocks that freeze a voltage at a defined instant so downstream measurement can finish with predictable timing and error.

A sample-and-hold family block has one core job: turn a continuous-time input into a short-time stable value. That stability window is not “free”; it is created by a switch, a hold capacitor, and a buffer, and it carries characteristic error terms (settling residue, pedestal, droop, and timing uncertainty).

S/H vs T/H is not just naming:

  • S/H (Sample → Hold): the input is connected during a sampling window; at the sampling edge the circuit switches to hold. The critical requirement is that the held value must be settled to the target accuracy by the end of the acquisition interval.
  • T/H (Track → Hold): the output actively follows the input during track, then freezes at the hold event. This is preferred when the system must define a precise sampling instant and keep the output consistent right up to that moment (common in fast pulse/step capture and tightly timed multi-channel sampling).

Where it sits (boundary kept intentionally clean): a practical chain places S/H or T/H after front-end gain/buffering and before the downstream decision/measurement engine. The block is often inserted because downstream needs time to settle, integrate, compare, or serialize the measurement—but the input may not wait.

Pulse amplitude capture Step measurement at a defined time DAQ / sampling scope front-end Multiplexed channels (scan-and-hold)
Key takeaway: this page treats S/H and T/H as an “error-and-timing” problem: the held value must be accurate after large steps, stable during hold, and tied to a well-defined sampling instant. Downstream (ADC architecture, filter synthesis, clock-tree design) is referenced only at interface level.
Figure F1 — Where S/H and T/H sit, and what they must guarantee
Input → Front-End → S/H / T/H → Stable Output Window Sensor / Source finite source-Z Front-End Buffer drive + isolate S/H · T/H Core C_hold Track window Hold window injection / feedthru droop / leakage Downstream Measurement ADC / comparator / capture engine reads during hold window Guarantee #1: settle within acquisition time (large steps) · Guarantee #2: stable hold (droop) · Guarantee #3: defined sampling instant (aperture)
A clean boundary view: the S/H or T/H creates a stable readout window. The hard problems are (1) fast settling after large steps, (2) hold stability (droop/leakage/DA), and (3) sampling instant definition (aperture delay/jitter).

Timing model: track window, aperture, and hold event

Purpose: align all later specs to one time-axis language. Without a shared timing model, “acquisition time,” “aperture,” and “hold step” become ambiguous and design decisions drift.

The timing model defines when the circuit is allowed to follow the input and when the output must remain stable. The boundary between these states is the sampling event. In real circuits, the switching event produces a short transient (pedestal/glitch) that must be separated from the usable hold interval.

Core terms (execution-level definitions):

  • Track time: interval where the switch is on and the hold node follows the input.
  • Acquisition time: time required after an input change for the hold node to reach the target accuracy (e.g., ≤0.01%FS).
  • Hold time: interval after the hold event where the output must remain within the allowed droop/error budget.
  • Aperture delay: delay from the control edge to the effective sampling instant at the hold node.
  • Aperture jitter (σt): time uncertainty of the effective sampling instant; converts input slope into voltage noise.
Engineering consequence: the effective sampling instant is tied to the track→hold transition, but the downstream readout window should avoid the immediate switching transient (pedestal/glitch) and focus on the settled portion of hold.
Figure F2 — Timing vocabulary: aperture, pedestal, settling window, and droop
Track → Hold transition defines the sampling event time hold event aperture Input Control Hold node Output track hold pedestal / glitch settling window droop track window hold window
Later specs map onto this diagram: acquisition time is the pre-hold settling requirement; aperture/jitter is the sampling-instant uncertainty; pedestal/glitch is the immediate switching artifact; droop is the slow hold drift during the usable readout window.

Key specs map (what to read on datasheets & how they translate to errors)

Purpose: turn datasheet terms into predictable failure modes. Each spec below is mapped to the error it creates and the use cases where it becomes the dominant limit.

S/H and T/H parts are often compared by “typical specs” without checking the conditions. The same headline metric can mean different real behavior depending on step size (ΔV), source impedance, hold capacitor, and timing window. A practical selection starts from error budget + timing window, then verifies which spec controls that budget.

Datasheet spec What goes wrong (error signature) When it matters most (typical triggers)
Acquisition time Step not fully captured → settling residue at the sampling instant (missed step amplitude). Always interpret as tacq@accuracy (e.g., 0.1% vs 0.01%FS). Short track windows, multiplexed scanning, large ΔV steps, high source-Z. Watch test conditions: Chold, Rsource, temperature.
Aperture jitter Time uncertainty becomes voltage noise (and phase noise) proportional to input slope. SNR degrades rapidly as input frequency increases. High-frequency sine amplitude capture, fast edges sampled at a precise instant, tight time-alignment across channels.
Droop rate Hold value drifts over time → long-hold error set by leakage and Chold. Often worsened by board leakage and humidity. Long hold intervals, slow readout/integration, high-impedance hold nodes, precision DC/low-frequency measurements.
Hold step / pedestal A step at the hold event caused by charge injection / feedthrough. Key split: repeatable (calibratable) vs signal-dependent (harder to remove). Absolute accuracy at the sampling instant, channel-to-channel consistency, step/pulse capture where switching transient overlaps the readout window.
Feedthrough / isolation Hold output is still modulated by input/clock → leak-tracking or ripple during hold. Appears as coupling-related error even when “hold” is asserted. Large input swing continuing during hold, high clock edges nearby, poor layout isolation, high-sensitivity measurements.
THD / large-step linearity Nonlinearity under large ΔV → distortion, gain error, or non-monotonic behavior. Often linked to Ron modulation and driver recovery limits. Single-supply near rails, wide dynamic range pulses, high-slew steps, high-accuracy capture across full input swing.
Fast decision rule: if the application is defined by a short sampling window, acquisition time dominates. If it is defined by a precise sampling instant at high frequency, aperture jitter dominates. If it is defined by a long hold interval, droop dominates. If accuracy is assessed at the hold edge, pedestal/glitch dominates.
Figure F3a — Specs → error entry points (a practical reading map)
Datasheet terms are shorthand for specific error signatures DATASHEET SPECS Acquisition time Aperture jitter Droop rate Hold step (pedestal) Feedthrough / isolation THD / large-step linearity S/H · T/H C_hold ERROR SIGNATURES Settling residue Timing-noise (jitter) Hold drift (droop) Pedestal / glitch Coupling during hold Distortion / non-monotonic Dominant limits: short window → acquisition · high-freq → jitter · long hold → droop · edge accuracy → pedestal
Use the map to decide what to prioritize: short track windows push acquisition; high-frequency precision pushes jitter; long holds push droop; edge-time accuracy pushes pedestal/glitch and isolation.

Acquisition & settling: the RC + driver story (why large steps are hard)

Purpose: explain why large steps are the hardest case and provide a calculation framework to back-solve acquisition time or Chold from an accuracy target.

During track, the hold capacitor must be charged (or discharged) toward the new input value. The dominant first-order path is an equivalent resistance feeding Chold: Req ≈ Rsource + Ron + Rdriver. For many systems, the “headline” acquisition time is simply the time needed for this network to reduce the step error below a target.

A practical approximation for the remaining error after track time t is: residue ≈ exp(−t / (Req · Chold)). This turns acquisition into a back-solvable constraint:

  • Pick target error ε (e.g., 0.1%FS = 1e-3, 0.01%FS = 1e-4).
  • Required time-constants N ≈ ln(1/ε) → about ~7τ for 0.1% and ~9–10τ for 0.01%.
  • Enforce ttrack ≥ N · Req · Chold (or back-solve Chold / Req).
Why large steps are harder than small steps: beyond the RC limit, large ΔV can push the driver into slew-rate limitation, output current limiting, or recovery from clipping. In those cases the settling shape may become a ramp (slew-limited) or a long tail (recovery-limited), and the simple exponential model underestimates the required track time.

Common large-step failure signatures (and what they imply):

  • Ramp-like approach to final value → driver is slew-rate limited (track window must increase or driver must be upgraded).
  • Long tail after an initial jump → driver recovery dominates (headroom, output swing, or recovery behavior is limiting).
  • Overshoot / bounce around the hold node → parasitics and drive impedance interact (layout and isolation become first-order).
Figure F3b — Equivalent acquisition path and “how many τ” for 0.1% vs 0.01%
Acquisition is a time-constant budget: t_track ≥ N · R_eq · C_hold EQUIVALENT ACQUISITION PATH V_in step ΔV R_source R_on R_driver V_hold C_hold t_track window NORMALIZED SETTLING RESIDUE error t / τ 0.1% (1e-3) 0.01% (1e-4) ~7τ for 0.1% ~9–10τ for 0.01% t_track ≥ N · R_eq · C_hold N ≈ ln(1/ε) (ε = target residue)
The top panel shows the first-order acquisition path. The bottom panel turns “accuracy” into “how many τ.” Use it to back-solve track time, Chold, or required drive impedance.

Hold errors: droop, leakage paths, and dielectric absorption (DA)

Purpose: split “hold drift” into controllable terms. Hold accuracy is a charge budget problem: leakage removes charge linearly with time, while dielectric absorption adds memory-like recovery tails.

During the usable hold window, the held value changes mainly because a net leakage current discharges (or charges) the hold capacitor. A first-order droop estimate is: ΔV ≈ Ileak · thold / Chold. This makes hold design back-solvable: for a given drift limit and hold time, the maximum allowed leakage can be derived.

Lower I_leak Shorter t_hold Larger C_hold Lower DA dielectric

Where leakage comes from (dominant paths):

  • Switch off-leakage: device leakage through the sampling switch when open; rises strongly with temperature.
  • Buffer/input bias paths: input bias currents and ESD/protection leakage connected to the hold node.
  • PCB surface leakage: contamination/humidity create parallel leakage; often dominates in high-impedance nodes.
Practical check: if drift varies widely board-to-board or improves after cleaning/guarding, PCB surface leakage is likely dominant. If drift tracks temperature tightly, switch or input leakage is likely dominant.

Dielectric absorption (DA) is different from droop. DA behaves like a “memory tail”: after track-to-hold transitions and voltage steps, trapped polarization relaxes slowly and can cause rebound / slow recovery. DA can corrupt precision sampling sequences even when droop looks small over the same time window.

Chold selection (decision-grade conclusion):

  • C0G/NP0: low DA and stable behavior → preferred for precision hold and repeatable sampling sequences.
  • X7R (high-K): higher volumetric efficiency but typically higher DA and stronger voltage/temperature dependence → more “memory tail” risk.
Observed symptom Likely dominant cause Best first knob
Linear drift with time Leakage current dominates droop (switch/input/PCB paths). Increase C_hold or reduce t_hold; then attack leakage (guard ring, cleanliness, lower-leak parts).
Rebound / slow recovery DA memory tail in capacitor dielectric. Switch to low-DA dielectric (C0G/NP0) and verify with step-and-hold sequence tests.
Strong humidity sensitivity PCB surface leakage on high-impedance node. Guard ring + clean + conformal coat; shorten exposed high-Z trace length.
Strong temperature sensitivity Switch off-leakage / input leakage dominates. Choose lower-leakage device grade; reduce hold node voltage stress; validate across temperature corners.
Figure F4 — Hold droop vs DA: different error shapes under the same hold window
Droop is (mostly) linear drift; DA is a memory-like recovery tail A) DROOP (LEAKAGE-DOMINATED) V_hold time same t_hold window lower leakage higher leakage ΔV ≈ I_leak · t_hold / C_hold B) DIELECTRIC ABSORPTION (DA) V_hold time low DA (C0G) higher DA (X7R) DA “memory tail”
Droop is governed by net leakage over time (linear slope), while DA adds a slow recovery component that can look like rebound or history dependence. Both must fit within the hold error budget.

Switching artifacts: charge injection, clock feedthrough, pedestal & glitch energy

Purpose: treat pedestal/glitch as controllable engineering terms, not vague “switch noise.” The hold edge can create an instantaneous step (pedestal) plus a transient (glitch) that must be reduced or time-gated.

Two dominant mechanisms create a hold-edge step: charge injection (channel charge released when the switch turns off) and clock feedthrough (capacitive coupling from the clock gate into the hold node). Both appear as a pedestal error that scales against the hold capacitance: ΔV ≈ Qinj / Chold (injection-dominated), and ΔV ≈ (Ccpl/Ctot) · ΔVclk (feedthrough-dominated).

Why “repeatable vs non-repeatable” matters:

  • Repeatable pedestal (stable offset): can be calibrated or subtracted if it is consistent over PVT and signal conditions.
  • Signal-dependent pedestal (varies with V_in / common-mode): harder to calibrate; structural suppression is preferred.
System implication: even a small pedestal can be fatal if the readout occurs too close to the hold edge. Timing should reserve a short “settling window” after hold, or architecture should reduce pedestal/glitch so the window can shrink.

Common suppression toolbox (with what each one mainly attacks):

  • Bottom-plate sampling: reduces charge injection into the hold node by turning off plates in a controlled order.
  • Dummy switch: injects compensating charge to cancel part of Qinj.
  • Complementary switch / transmission gate: improves linearity and reduces signal-dependent artifacts.
  • Differential sampling: cancels common-mode feedthrough and improves rejection of clock coupling.
  • Clock shaping: reduces ΔVclk and coupling energy (must not compromise sampling instant definition).
Observed behavior Most likely dominant mechanism Best first knob
Fixed step each hold edge Feedthrough or repeatable injection component. Clock amplitude/edge shaping; differential cancellation; verify repeatability for calibration.
Step varies with V_in Signal-dependent charge injection and R_on modulation effects. Bottom-plate sampling; complementary switch; reduce signal swing at the switch (buffering/ranging).
Short spike then settles Glitch energy coupling into node + bandwidth-limited settling. Reserve a settling window; reduce coupling; minimize parasitics at hold node.
Figure F5 — Bottom-plate sampling: switching order that reduces pedestal
Turn off the “top” plate first, then isolate the hold node (bottom plate) second A) STRUCTURE (TWO SWITCHES) V_in S_top C_hold top plate bottom plate S_bot Hold buffer / output V_hold B) SWITCHING ORDER time S_top S_bot t1 t2 C) PEDESTAL REDUCTION V_hold time larger pedestal reduced pedestal
Bottom-plate sampling reduces how much switch-related charge and clock coupling land on the hold node by controlling which plate is isolated first. The goal is a smaller pedestal and less glitch energy at the hold edge.

Aperture jitter: when timing uncertainty dominates your SNR

Purpose: set a clear threshold for when jitter is the limit. If SNR degrades mainly with input frequency (f_in), timing uncertainty is converting slope into voltage noise.

Aperture jitter (σt) is uncertainty in the effective sampling instant. For a changing input, that time error becomes a voltage error proportional to the signal slope. As fin increases, slope increases, and the same σt produces more noise.

A common engineering estimate of the jitter-limited SNR for a sinusoidal input is: SNRjitter ≈ −20·log10(2π·fin·σt). This formula is most useful for back-solving a maximum allowable σt given a target SNR at fin,max.

SNR falls with f_in High-slope signals Tight time alignment Clean amplitude still noisy

What tends to worsen σt (high-level drivers):

  • Control edge noise: noise on the sampling control edge shifts threshold crossing time.
  • Threshold drift: comparator/logic threshold variation translates into timing uncertainty.
  • Supply disturbance: supply/ground noise modulates edge speed and thresholds.
  • Comparator jitter: when the sampling moment is derived from a comparator event, its internal noise becomes σt.
Practical crossover rule: below a certain fin, noise sources like kT/C and analog noise dominate. Past a crossover, the jitter-limited SNR line drops with fin, and timing cleanliness becomes the primary lever.
Figure F6 — Error budget crossover: jitter limit vs noise floor
Jitter-limited SNR falls with frequency; noise floor stays roughly flat SNR (dB) f_in noise floor (kT/C, analog) jitter-limited SNR crossover: jitter becomes dominant below: noise-limited above: jitter-limited SNRj ≈ −20·log10(2π·f_in·σt)
Use the crossover idea to decide what to optimize: when the jitter line is below the noise floor at the band edge, timing cleanliness dominates achievable SNR.

Large-step linearity: bootstrapped switches, Ron modulation, and distortion

Purpose: turn “large-step linearity” into actionable knobs. Many S/H/T/H paths look fine for small signals, but distort or miss-settle under large steps because the sampling impedance changes with input level.

A key nonlinearity driver is Ron modulation: the sampling switch on-resistance varies with input voltage, especially on single-supply systems or near the rails where available VGS margin shrinks. When Ron depends on Vin, the effective acquisition time-constant changes with amplitude, turning a fixed time window into an amplitude-dependent residue.

Bootstrapped switches address this by keeping the switch VGS approximately constant during tracking. A flatter VGS produces a flatter Ron vs Vin, improving large-swing THD and reducing “some amplitudes settle worse than others.” However, bootstrap techniques introduce risks that must be checked at the architecture level.

Bootstrap caveats (must be bounded): VGS/VGD over-stress and reliability limits, clock feedthrough and switching energy coupling, and noise from bootstrap drive structures. These effects can show up as additional spur-like artifacts or pedestal/glitch growth if isolation is not managed.

Actionable knobs (what to change first):

  • Improve headroom: avoid near-rail operation or range the signal before the sampling switch.
  • Flatten R_on: bootstrapped or complementary switch structures to reduce V_in dependence.
  • Strengthen drive: reduce R_driver and ensure the driver does not slew-limit on large steps.
  • Reduce coupling: minimize parasitics at the hold node and isolate clock/drive return paths.
Figure F7 — Why small-signal looks OK but large-signal breaks: R_on modulation → amplitude-dependent residue
R_on changes with V_in → time constant changes → distortion under large steps A) R_on vs V_in R_on V_in non-bootstrapped: R_on modulates bootstrapped: flatter R_on B) Distortion / residue path Large step / large swing at input V_GS margin changes near rails R_on varies with V_in (nonlinear τ) Amplitude-dependent residue → THD Knobs: bootstrap / headroom / drive strength / isolation
When R_on depends on input level, acquisition becomes amplitude-dependent. Flattening R_on (and ensuring the driver stays linear under steps) reduces large-swing distortion and improves repeatability across the full input range.

Architectures you can actually choose (open-loop, buffered, differential, multiplexed)

Purpose: make architecture selection concrete without leaving the S/H / T/H scope. Each choice shifts which error term dominates: node vulnerability, isolation, common-mode control, or memory/crosstalk penalties.

Architecture is not about “best”; it is about putting the dominant error term into a controllable place. A direct hold capacitor is simple, but the hold node is exposed. Adding a hold buffer isolates the node from load variability. A differential T/H structure improves common-mode behavior and can cancel some clock-related artifacts when symmetry is maintained. Multiplexed sampling trades cost/area for isolation and memory effects.

Load may vary → buffer Clock feedthrough sensitive → differential Many channels → MUX tradeoffs Long/dirty routing → isolate node

What changes between architectures (decision-grade summary):

  • Direct (unbuffered) hold: simplest; hold node is fragile. Any load, leakage path, or coupling directly corrupts the held value.
  • Buffered hold: isolates the hold capacitor from external loading; shifts hold accuracy toward buffer input leakage/bias and recovery behavior.
  • Fully-differential T/H: improves common-mode control and can reduce apparent pedestal by symmetry; requires matched parasitics and routing.
  • MUXed S/H: enables many channels; adds isolation limits, charge sharing, and “memory” between channels if the hold element is shared.
Fast selection rule: if output loading is unknown, cable/fixture changes are expected, or the hold node must travel any distance on PCB, buffered (or buffered-per-channel) architectures reduce “random” behavior and make errors repeatable and verifiable.
Architecture Main strength Dominant risk / cost When it is the right pick
Direct / open-loop Minimum parts, minimum power, lowest complexity. Hold node is exposed: load sensitivity, coupling, leakage and humidity issues show up immediately. Short hold times, stable high-impedance load, tight physical placement, low coupling environment.
Buffered hold Isolation from load; repeatable behavior across fixtures and ranges. Buffer bias/leakage and recovery behavior become part of the error; extra power and area. Unknown or varying load, longer hold windows, routing constraints, measurement repeatability required.
Differential T/H Better common-mode handling; symmetry can cancel clock-related artifacts. Matching and symmetry requirements; doubled components and routing constraints. Differential signal chains, spur/pedestal sensitivity, demanding distortion/common-mode budgets.
MUXed sampling Scales channel count efficiently (cost/area). Isolation limits, charge sharing, and channel “memory” unless reset/settling windows are budgeted. Many channels with moderate per-channel bandwidth; acceptance of per-channel timing/settling overhead.
Figure F8 — Topology compare panel: direct, buffered, differential, MUXed S/H
Architecture changes what the hold node “sees”: load, coupling, symmetry, and memory A) DIRECT (UNBUFFERED) B) BUFFERED HOLD C) DIFFERENTIAL T/H D) MUXED S/H Input S C_hold Hold node Load risk: load + coupling Input S C_hold Buffer Load benefit: isolation +In −In S+ S− C_hold+ C_hold− Diff buffer benefit: CM control / cancel CH1 CH2 CH3 MUX S/H core Out cost: memory / crosstalk / time
Direct hold exposes the node; buffered hold isolates it. Differential structures rely on symmetry to suppress common-mode artifacts. MUXed sampling scales channels but adds isolation and memory penalties unless timing and reset/settle windows are budgeted.

Layout & parasitics: what ruins S/H in real hardware

Purpose: convert “works in theory, fails on PCB” into actionable layout rules. The hold node is often high-impedance and extremely sensitive to leakage, coupling, and reference movement (ground bounce).

1) Leakage and contamination (hold drift becomes random):

  • Guard ring and cleanliness: humidity, flux residue, and contamination create surface leakage that directly increases droop.
  • Shortest possible high-Z routing: keep the hold node compact and shielded; avoid long exposed traces and vias.
  • Material and coating decisions: if the environment is humid or variable, protective measures can make drift repeatable.

2) Coupling and loop area (pedestal/glitch grows):

  • Clock isolation: the sampling clock edge is a strong aggressor. Keep it physically separated from the hold node and input network.
  • Minimize the C_hold loop: place C_hold close to the switch/buffer; reduce loop area to reduce pickup and return-path injection.
  • Control the return path: avoid routing digital return currents through the analog reference region near the hold node.

3) Symmetry and grounding discipline (differential cancellation only works if parasitics match):

  • Symmetric differential routing: keep both halves in similar environments so common-mode coupling does not become differential error.
  • Kelvin ground for sensitive references: separate high-current returns from the hold reference node.
  • Local decoupling: place decoupling close to the switch driver and buffer supply pins to reduce edge-induced supply modulation.
Quick layout audit: the hold node should be short, guarded, and distant from clocks; C_hold should form a tight loop with the switch/buffer; return currents should not share the same path as sensitive analog references.
Figure F9 — PCB do/don’t sketch: guard, clock isolation, tight loop, and return paths
Small layout mistakes look like “mystery drift” and “random pedestal” on S/H nodes DON’T (Bad) DO (Good) S/H core C_hold long hold node clock too close C_cpl return path crosses analog S/H core C_hold Buffer short hold node guard ring clock isolated + ground strip tight loop return kept outside analog
Layout makes S/H errors repeatable (good) or “random” (bad). Keep the hold node short and guarded, isolate clocks, minimize the C_hold loop area, and control return paths to avoid injecting edge energy into sensitive references.

Validation & production checklist: how to prove it works (and keep it consistent)

Purpose: turn “it seems to work” into a repeatable proof flow. Each test maps to a specific error mechanism (acquisition, pedestal, droop/leakage, jitter, coupling/memory) and produces pass/fail criteria that can be re-run in production and service.

Test philosophy (keep results comparable):

  • Define the sampling instant (the effective hold event). All numbers must reference the same timing point.
  • Separate “mean” vs “spread”: mean pedestal can often be calibrated; random spread sets the hard limit.
  • Measure trends, not only single points: droop vs time, SNR vs fin, and step error vs time reveal root causes faster.
t_acq @ X% pedestal mean + σ ΔV vs t_hold SNR slope vs f_in layout/fixture screen
Note on part numbers: the example material numbers below are common building blocks (switches, muxes, buffers, relays, EEPROM). Final selection must be verified against the latest datasheet for leakage, bandwidth, charge injection, supply range, and ESD limits.
Test item Stimulus & setup Record Pass criteria (template) Common failure signatures Example material numbers (fixtures / blocks)
Acquisition time
t_acq@0.1% / 0.01%
Fast step (small + full-scale). Low source Z. Fixed track window. Trigger on hold edge. Error vs time curve after hold. Extract time-to-threshold. At max step, t_acq@X% ≤ budget. No abnormal amplitude-dependent “knee”. Long tail → driver recovery / current limit. Strong amplitude dependence → R_on modulation / near-rail headroom loss. Switch: ADG1211 / ADG1219, TMUX1101
Buffer op-amp: OPA356, ADA4807-1
Hold cap (C0G): Murata GRM series (C0G/NP0)
Pedestal / hold step
mean + σ
Input shorted or fixed DC. Repeat N cycles across multiple DC levels. Same clock edge each run. Histogram of held value. Mean step and standard deviation. |mean| ≤ limit (or calibratable). σ ≤ noise budget. Mean stable but σ large → coupling/clock noise. Mean varies with DC level → charge injection dependence on V_in. “Short input” hook: ADG1419 / ADG1409, TMUX1136
Relay (low leakage option): SIP reed relay families (pick per voltage)
EEPROM (cal storage): 24LC02 / 24AA02, AT24C02
Droop / leakage screen
ΔV vs t_hold
Fixed DC → hold for multiple t_hold values. Sweep temperature and humidity (or “clean vs contaminated”). Slope of droop; drift vs environment; channel-to-channel variance. ΔV(t_hold) stays within limit across corners; droop slope variation bounded. Large humidity sensitivity → board surface leakage / cleanliness. One channel worse → local routing/contamination. Guard strategy helper (layout): driven guard ring + keepout
Ultra-low leakage switch option: ADG1201 / ADG1204 class
Hold cap: C0G/NP0 MLCC families (avoid high-DA dielectrics)
Jitter back-solve
σt estimate
High-frequency sine at fixed amplitude. Measure SNR/amp noise across multiple f_in points. SNR vs f_in plot; fit high-f region slope. Estimate σt using jitter-SNR relation. In jitter-limited region, SNR trend meets target at f_in,max. No unexpected spurs dominating. No 20 dB/dec trend → not jitter-limited (noise floor or distortion dominates). Random spurs → clock feedthrough/layout. Clock buffer options (low additive jitter class): vendor-specific (verify)
Comparator (if used for timing): high-speed low-jitter families (verify)
Isolation aids: series-R + controlled edge shaping (layout + driver)
MUX memory / crosstalk
channel-to-channel
Alternate channels with two DC levels (A then B). Control dwell time and track window; measure residue. Held value error on channel B vs previous channel A level. Settling vs time budget. Residue below limit after defined settle/reset window. Isolation meets system requirement. Strong dependence on previous channel → charge sharing / shared C_hold memory. Edge-synchronous spikes → clock coupling. MUX: ADG1208 / ADG1608 class, TMUX1208 class
“Reset/discharge” switch: ADG1419 / TMUX1101
Per-channel buffer option: OPA356 / ADA4807-1
Production hooks
self-test + calibration
Dedicated short/loopback path; known reference injection; periodic pedestal check at boot or temperature delta. Self-test signature, stored calibration constants, re-check logs (pass/fail counters). Self-test repeats across units; calibration reduces mean pedestal without inflating σ; re-check triggers defined. Self-test unstable → fixture coupling / grounding. Calibration drift → temp-dependent pedestal or leakage changes. EEPROM: AT24C02 / 24LC02 / 24AA02
Short/loopback switch: ADG1419 / ADG1409 / TMUX1136
Reference (if needed): precision reference families (verify per rails)
Figure F10 — Validation flow: test → dominant error term → where to fix
A repeatable proof loop: measure → classify → map to the knob that fixes it Tests Step → error vs time t_acq@X% Fixed DC → histogram pedestal mean + σ Hold time sweep ΔV vs t_hold (T/H/RH) Sine sweep (multi f_in) SNR slope → σt Channel toggle (A→B) MUX residue / crosstalk Dominant error term settling / drive limits charge injection / feedthrough leakage / DA / contamination aperture jitter / clock noise memory / isolation (MUX) Fix knobs (chapter map) H2-4 / H2-8 H2-6 / H2-10 H2-5 / H2-10 H2-7 / H2-10 H2-9 / H2-10
A production-ready proof flow links each measurement to a dominant mechanism and a concrete fix knob. This prevents “tuning by guesswork” and supports stable calibration and service re-check strategies.

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FAQs (answers + structured data)

These FAQs target common field failures in Sample-&-Hold / Track-&-Hold stages: settling, pedestal, droop/leakage, jitter, MUX memory, and layout-driven coupling. Answers stay within the S/H / T/H scope and map back to the related sections for fast troubleshooting.

Parts note: example material numbers (e.g., ADG/TMUX switches, OPA/ADA buffers, 24xx I²C EEPROM) are illustrative. Final selection must be validated against the latest datasheet for leakage, charge injection, bandwidth, supply range, and ESD limits.
1Should acquisition time be specified at 0.1% or 0.01%—and how to back-solve from an error target?
Acquisition time must match the allowed settling residue. Start from the maximum allowable voltage error (as %FS or absolute), then choose the settling threshold (0.1% for many measurements; 0.01% when INL/precision budgets demand it). Use the RC settling model to convert that threshold into required time constants, then verify large-step behavior (slew/recovery can dominate).
See: H2-4, H2-3
2Why can small-signal linearity look great, yet THD/INL degrades sharply for large steps?
Large steps push the switch and driver into regimes where parameters move with voltage: switch Ron modulates with Vin, VGS headroom shrinks near rails, buffers hit output current limits, and recovery from saturation becomes non-linear. The result is distortion that does not appear in small-signal tests. Bootstrapped switches reduce Ron modulation but introduce reliability and clock-coupling risks.
See: H2-8, H2-4
3Can pedestal (hold step) be fixed by calibration? When does calibration fail?
Calibration can remove the repeatable mean pedestal (e.g., store an offset in EEPROM) when the step is stable across cycles. Calibration fails when the pedestal is dominated by random spread (large σ), or when it varies strongly with input level, temperature, supply noise, or layout coupling. In that case, the unrepeatable component sets the floor, and the fix must target injection/feedthrough and hardware noise.
See: H2-6, H2-11
4Is droop mainly from IC leakage or PCB leakage—and how to tell the difference?
IC leakage typically shows strong temperature dependence and repeatable unit-to-unit trends, while PCB leakage is often humidity/contamination sensitive, time-varying, and channel-local. A practical discriminator is an environmental sweep: measure ΔV vs thold across temperature and humidity (or “clean vs not-clean”) and compare channels. Large humidity sensitivity or sporadic behavior points to board surface leakage and layout/cleanliness issues.
5How is dielectric absorption (DA) “rebound” measured, and how can capacitor choice avoid it?
DA is revealed by a slow “memory” recovery after a charge/discharge event. A simple method is: drive a known DC level, switch to hold, then apply a controlled discharge/step and observe the held node’s slow return toward the previous state. DA looks like a long tail that is not explained by leakage alone. To minimize DA, use low-absorption dielectrics (commonly C0G/NP0) and keep the hold node protected from parasitic soak paths.
See: H2-5
6Why does bottom-plate sampling reduce injection error, and what is the tradeoff?
Bottom-plate sampling times the switch-off sequence so that charge injection is steered into a node that is less signal-dependent, reducing pedestal sensitivity to Vin. The main tradeoffs are timing complexity, added switch devices, and higher sensitivity to mismatch and layout symmetry; if parasitics differ, the intended cancellation collapses. It also increases the need to isolate clock edges from the hold capacitor loop to prevent feedthrough.
See: H2-6
7At what frequency does aperture jitter become the #1 SNR killer?
Jitter converts timing uncertainty into voltage noise proportional to input slope, so the impact rises with fin. A common engineering bound is: SNRjitter ≈ −20·log10(2π·fin·σt). The “jitter-dominant” region starts where this limit crosses the combined analog noise floor (including kT/C and front-end noise). If the crossing occurs below the max signal frequency, jitter must be treated as the primary constraint.
See: H2-7, H2-3
8Why doesn’t a faster clock edge always improve jitter—could the root cause be threshold, supply, or ground bounce?
Jitter is not only “edge speed.” If the switching threshold is noisy (comparator/logic threshold modulation), or if supply/ground moves during the edge (ground bounce), the effective sampling instant wanders even with a fast edge. In such cases, edge sharpening can worsen coupling and inject more switching energy into references. Fixes usually live in power integrity, return-path control, clock routing isolation, and symmetric layout—so the timing event is stable at the device pins.
See: H2-7, H2-10
9Why does multiplexed S/H suffer more crosstalk and “memory effect”?
MUXed sampling reuses nodes and parasitic capacitances, so charge from the previous channel can share into the next channel’s hold network. This creates a residue that depends on channel order, dwell time, and the size of parasitics relative to Chold. Preventive knobs include: dedicated per-channel buffers, a reset/discharge switch, larger settle windows, and strict clock/hold-node isolation. Without these, the behavior looks random but is often deterministic.
See: H2-9, H2-10
10Direct Chold vs adding a buffer—how to decide when a buffer is mandatory?
A buffer is mandatory when the load is unknown or time-varying, when the held value must survive longer hold windows, or when routing/cabling exposes the hold node to coupling and leakage. Direct hold assumes a stable high-impedance load and extremely short, clean routing. If a specification must hold across fixtures, cables, temperature/humidity, or multiple measurement ranges, buffering isolates the hold capacitor so the error budget is dominated by controlled device parameters instead of external loading.
See: H2-9, H2-4
11Why are high source-impedance signals hard to sample accurately—should Chold or the driver be changed first?
High source impedance increases Req, which slows acquisition exponentially and makes the held value more sensitive to injection and coupling. Increasing Chold can reduce kT/C noise and droop, but it further increases acquisition time unless the driver is strengthened. The typical first move is improving the driver (buffering, reducing effective source resistance during track), then tuning Chold to hit noise and droop targets without breaking settling budgets.
See: H2-4, H2-3
12How can production quickly screen droop risk caused by leakage, contamination, or humidity?
Use a short two-point droop screen: apply a fixed DC level, enter hold, measure the held value at two hold times (t1, t2), and compute ΔV/(t2−t1). Repeat on a sample subset under a humidity challenge (or before/after a controlled bake) to expose surface leakage. Units with abnormal slopes or strong humidity sensitivity are flagged for re-cleaning, coating review, or guard/keepout layout improvements.
See: H2-11, H2-10