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This page delivers a practical “protection set” blueprint for buck/boost/buck-boost rails: OCP/OVP/UVP/OTP operate as one safety envelope, with a fast-short path and hiccup/latch/auto-retry timers aligned to soft-start. You get actionable thresholds, tolerances, test hooks, and cross-brand IC picks so small-batch builds can set numbers, validate, and ship with confidence.

1) Introduction & Scope

Protection sets for buck/boost regulators work as a cohesive safety envelope: OCP, OVP, UVP, and OTP backed by a fast-short path for severe faults, plus restart policies (hiccup, latch, auto-retry) and right-sized timers tied to soft-start. Set thresholds with tolerance and drift in mind, filter noise to avoid nuisance trips, and validate across load × VIN × temperature so small-batch builds remain robust in the field.

Reader promise: actionable thresholds, timers, validation checklist, and brand-agnostic IC selection logic.

2) Taxonomy of Protections (What each one does)

OCP — cycle-by-cycle vs average; valley/peak; SS fold-back

  • Sense path: RDS(on) / Rsense (Kelvin) / DCR; valley detection reduces spikes.
  • Trip & latency: cycle-by-cycle is fastest; average limit is smoother but slower.
  • Policy tie-ins: persistent OCP → hiccup; fast-short path runs in parallel.
  • Knobs: ILIMIT = Iload,max + 0.5×ΔI; leading-edge blanking.
  • Pitfalls: RDS(on) temp drift; non-Kelvin routing error.

OVP — clamp vs shutdown; bleed; downstream LDO coexistence

  • Sense: FB divider tolerance/leakage; optional clamp FET or bleed.
  • Trip: comparator direct; clamp adds heat/ripple.
  • Policy: sensitive loads → shutdown + hiccup; mild events may clamp.
  • Knobs: map divider tolerance to ±VOVP (target ±1–2%).
  • Pitfalls: backfeed into downstream LDO; using clamp as regulation.

UVP — brownout ride-through vs restart; hold-up; preload

  • Sense: output comparator or PG threshold.
  • Trip: linked to SS ramp and error-amp recovery.
  • Policy: batteries/automotive → ride-through + debounce; deep dips → auto-retry.
  • Knobs: tdeglitch, preload, hold-up capacitance sizing.
  • Pitfalls: too-tight UVP causing nuisance trips; small preload destabilizes loop.

OTP — die vs external NTC; fold-back slope; hot-soak

  • Sense: junction sensor + external NTC near hot spots/copper.
  • Trip: fold-back (current derate) vs hard trip.
  • Policy: long hot environments → fold-back; safety-critical → hard trip + latch.
  • Knobs: NTC divider curve, thermal hysteresis ΔT.
  • Pitfalls: poor thermal coupling; restart “temperature chatter”.

Fast-short — dedicated high-speed path bypassing slow loops

  • Sense: dedicated comparator + leading-edge blanking (LEB).
  • Latency: microsecond-class gate discharge / SW clamp.
  • Policy: pair with hiccup to avoid sustained stress.
  • Knobs: blanking too short → false trips; too long → miss first peak.
  • Pitfalls: jig parasitics / probe ground loops creating fake spikes.
Protection Set: OCP · OVP · UVP · OTP · fast-short · timers OCP Cycle-by-cycle vs average; valley/peak; SS fold-back OVP Clamp vs shutdown; bleed; LDO coexistence UVP Ride-through vs restart; hold-up; preload OTP Die vs NTC; fold-back slope; hot-soak behavior Fast-short path Dedicated high-speed comparator bypassing slow loops; pair with hiccup

3) Sensing & Trip Architecture

Current sense options, FB/OVP/UVP path, and comparator speed vs noise (deglitch, leading-edge blanking, slope compensation).

Current sense: RDS(on), sense-resistor (Kelvin), DCR

  • RDS(on): lowest cost, strong temp drift; guardband for +60…90% rise hot.
  • Sense-resistor (Kelvin): most accurate; route true Kelvin pads; keep return off gate driver ground.
  • DCR of inductor: low loss; needs temp compensation (NTC or table).
  • Noise tools: leading-edge blanking tblank & RC sense filter tied to slope comp.

Voltage sense: FB comparators, divider tolerances, leakage

  • Keep FB node impedance ≤ 100 kΩ eq.; place Rbot close to FB pin.
  • Account for bias/leakage around FB and routing; map E96 tolerances to Vout accuracy.
  • OVP clamp/bleed gate available on some ICs—use for mild overshoot only.
  • Consider small Cff only after loop stability check.

Comparator speed vs noise: deglitch, LEB, slope-comp tie-ins

  • Deglitch: ns–µs digital window; choose ≈3–5× the dominant spike width.
  • LEB location: at sense amp or PWM latch; verify trip under worst-case VIN/load.
  • Slope compensation: match inductor ramp; too small → subharmonic; too large → slower trips & lower loop gain.
Current sense RDS(on) — temp drift; low BOM Rsense (Kelvin) — accurate; power loss Inductor DCR — low loss; needs temp comp Tools: t_blank + RC filter + slope comp Voltage sense FB comparators; divider E96 tolerance Leakage & bias currents at FB node OVP clamp/bleed gate for mild overshoot Timing Deglitch window (ns–µs) Leading-edge blanking (t_blank) Switch period Slope compensation tied to current ramp

4) Thresholds & Tolerances (How to set numbers)

Practical formulas and guardbands for OCP, OVP/UVP, OTP; include margins for VIN, temperature, tolerances, and mode transitions.

OCP: derive ILIMIT

  • Inductor ripple: ΔI ≈ (VL/L) · D · Ts.
  • Rule: ILIMIT ≥ ILOAD,max + 0.5·ΔI + margin.
  • Rsense: Vtrip = ILIMIT · Rsense; include amp offset and resistor tolerance.
  • RDS(on): guardband +60…90% hot drift; validate at hot VIN.
  • DCR: temperature-calibrate (NTC/table) and include copper coeff.

OVP / UVP bands

  • Target ±(1–2%) at Vout; map E96 divider tolerances via Vout = Vref · (1 + Rtop/Rbot).
  • Include bias/leakage at FB node and routing film.
  • UVP deglitch: long enough for ripple ride-through; short enough for real brownouts.
  • Example start: OVP +4% trip / +1% clear; UVP −8% trip / −3% clear.

OTP setpoint via NTC & PCB thermal path

  • Ttrip = Tmax,allowed − ΔTpath (junction-to-NTC gradient).
  • Hysteresis: ΔThyst ≥ ramp_rate · restart_latency to prevent temperature chatter.
  • Place NTC near hotspot copper; avoid airflow artifacts; validate hot-soak and cycles.
Input Value Derived Result Notes
L, Fsw, VIN, VOUT (user) ΔI ≈ (VL/L) · D · Ts ΔI Use worst-case VL at VIN max/min
ILOAD,max, ΔI (user) ILIMIT ≥ ILOAD,max + 0.5·ΔI ILIMIT Then add policy margin (mode transitions)
Rsense (pick) Vtrip = ILIMIT · Rsense Vtrip Include amp offset & tolerance
Starter values; verify at cool/room/hot and VIN min/max.
Component Tolerance / Drift Affects Add to Margin
Rtop/Rbot (FB)±1–2% + leakageOVP/UVP bands±VOUT error budget
RDS(on)+60…90% hotOCPRaise ILIMIT margin
Rsense±1% + tempOCPAdjust Vtrip
Sense ampoffset + noiseOCP tripsIncrease tblank/RC or threshold
NTC networkβ toleranceOTPΔThyst sizing
OCP (I_LIMIT) I_LIMIT ≥ I_LOAD,max + 0.5·ΔI + margin Rsense → V_trip = I_LIMIT · Rsense RDS(on) hot drift +60…90% Margin for VIN/T/mode/tolerance OVP / UVP bands Target ±(1–2%) at Vout Vout = Vref · (1 + Rtop/Rbot) Trip/Clear thresholds window OTP setpoint & hysteresis T_trip = T_max,allowed − ΔT_path; ΔT_hyst ≥ ramp_rate · restart_latency Place NTC at hotspot copper; validate hot-soak cycles

5) Timers, Blanking & Deglitch

tBLANK (LEB), tDEGLITCH for comparators, tHICCUP & tRESTART; relationship to tSS and error-amp recovery; defaults matrix for motor vs digital loads.

Definitions

  • tBLANK: leading-edge blanking to mask turn-on spike in the OCP path.
  • tDEGLITCH: window filter for comparator outputs (OVP/UVP/OTP) against noise.
  • tHICCUP: off-time after fault before reattempt; thermal & input recharge.
  • tRESTART: controlled re-enable window (usually equals or exceeds soft-start).

Interactions with tSS & EA recovery

  • Choose tHICCUP ≈ 4–8 × tSS to cool and recharge caps.
  • Ensure tRESTART ≥ tSS + EA_unwind to avoid chatter on restart.
  • PFM needs longer tDEGLITCH than CCM; tBLANK tied to di/dt and FSW.

Starter ranges

  • tBLANK: 80–200 ns (500 kHz–2 MHz); start ≈120 ns at VIN max/hot.
  • tDEGLITCH: digital rails 0.2–0.5 µs; motor/inductive 0.5–2.0 µs.
  • tHICCUP: 4–8 × tSS (or fixed 10–200 ms per IC).
  • tRESTART: 1–2 × tSS depending on pre-bias and PG gating.
Load class tBLANK tDEGLITCH tHICCUP tRESTART Notes
Quiet digital~100 ns0.3 µs4× tSS1× tSSTight OVP/UVP bands
Mixed I/O120–150 ns0.5–0.8 µs5× tSS1–1.5× tSSFilter FB routing
Motor / inductive150 ns1.0 µs6× tSS1–2× tSSAdd RC on sense
Automotive cranking150–200 ns1.5 µs8× tSS≥1.5× tSSBrownout ride-through
Switch-edge windows Deglitch (ns–µs) Leading-edge blanking (t_blank) Switch period Fault policy windows t_HICCUP ≈ 4–8 × t_SS t_RESTART ≥ t_SS + EA_unwind Soft-start (t_SS)

6) Restart Policies: Hiccup / Latch / Auto-Retry

Failure trees and tradeoffs: persistent short → hiccup; intermittent EMI → auto-retry; safety certification → latch. Consider PG/FAULT signalling and field reset.

Failure trees (quick rules)

  • Persistent short / severe overload → Hiccup for thermal relief and repeated attempts.
  • Intermittent EMI / brownouts → Auto-retry with short cadence and good deglitching.
  • Safety certification / hazard → Latch with manual clear via EN/RESET or power cycle.

User experience vs availability

  • Hiccup: self-recovering, low heat; may pulse downstream rails.
  • Auto-retry: quick service return; can chatter if margins are tight.
  • Latch: safest/auditable; needs field reset path and clear PG messaging.

PG/FAULT behavior & memory

  • PG low during fault; hiccup toggles PG on retries; auto-retry holds PG low until stable; latch keeps PG low until manual clear.
  • FAULT pin is open-drain; OK to wire-OR; add debounce on noisy backplanes.
  • Use sticky FAULT registers (if available) to log last-fault cause for service.
System Preferred policy Retry / tHICCUP Thermal headroom UX note Certification note
Consumer gadgetAuto-retryShort cadenceLow–medFast recovery
Industrial motorHiccup≥6× tSSHighAvoid coil heating
Automotive ECUAuto-retry / HiccupBackoff or 6–8× tSSMedRide-throughOEM profile
Safety-criticalLatchManual clearN/APredictable stopManual reset required
Hiccup Repeated attempts with off-time (t_HICCUP) PG EN Auto-retry Short retry cadence; non-sticky PG EN Latch Stays off until manual clear (EN/RESET or power cycle) PG EN

7) Fast-Short Path (Severe short response)

Dedicated high-speed comparator, FET gate discharge path and SW node clamp; blanking pitfalls and slope coordination; µs-class test recipe.

What happens in microseconds

  • Fast comparator: hard-short threshold bypasses slow control loop.
  • Gate discharge: low-impedance pull-down, shortest return to PGND.
  • SW clamp: limits dv/dt and peak current; contains first spike.
  • Goal: detect-to-turn-off within ~1–3 µs (family dependent).

Blanking pitfalls & coordination with current-limit slope

  • Too long tBLANK: misses the first edge of a hard short.
  • Too short tBLANK: switching spikes trigger false shutdown.
  • Coordinate: align blanking and slope compensation with inductor di/dt; validate at VIN max/hot.

Test recipe

  • Low-Z short via pulse MOSFET on Vout (2–20 µs pulses).
  • Scope GATE, SW, Vout, Isense with ≥200 MHz probes.
  • Capture turn-off delay, overshoot, PG/FAULT timing, and thermal under repeated pulses.
Fast comparator Hard-short threshold, fast trip Gate discharge Low-Z pull-down to PGND SW clamp dv/dt limit & peak control Timing Leading-edge blanking (t_blank) Trip to gate-off Switch period Missed first edge (too long t_blank)

8) Interactions: Soft-Start, Pre-bias, Sequencing

Pre-bias start and reverse discharge avoidance; SS ramp vs OCP fold-back; coordination with upstream Boost and downstream LDO/VRM via PG gating.

Pre-bias start & reverse discharge avoidance

  • When Vout is pre-charged, prevent body-diode back-discharge with ideal-diode FET/ORing.
  • Disable active discharge during faults if reverse current is a risk.
  • Probe for reverse current on SW/body diode at startup.

Soft-start ramp vs OCP fold-back

  • Ramp too fast → inrush trips OCP; too slow → long start and potential dropouts.
  • Ensure ILIMIT(startup) ≥ Iinrush + 0.5·ΔI; use fold-back if IC supports it.
  • Tune CSS, Cout/ESR and startup current limit per load type.

Sequencing with Boost / LDO / VRM (PG gating)

  • Use Boost PG → Buck EN, then Buck PG → downstream EN cascading.
  • Block downstream start during OVP/UVP; add debounce and min-EN-pulse.
  • For multi-rail systems, avoid reset storms with staged PG/FAULT and deglitch.
Soft-start, pre-bias & sequencing VIN Boost PG Buck EN SS ramp I_LIMIT(startup) Vout (pre-bias) Downstream PG Block downstream on OVP/UVP Reverse discharge avoided

9) Pins & Telemetry: PG / PGOOD / FAULT / EN

Truth table for PG vs fault-latch, FAULT open-drain behavior, EN/RESET minimum pulse; wire-OR with pull-ups and debounce for noisy backplanes; a minimal supervisor network for multi-rail coordination.

Quick primer

  • PG/PGOOD: asserts when Vout within regulation window; open-drain or push-pull.
  • FAULT: open-drain; may be sticky (latches until cleared) or momentary.
  • EN/RESET: observe min high/low pulse; some devices require hysteretic thresholds.

Wiring patterns

  • Wire-OR FAULTs to one MCU input (open-drain, shared bus).
  • Pull-ups: 4.7–10 kΩ typical; long/noisy backplanes may use 2.2–4.7 kΩ + RC.
  • Debounce: RC 1–5 ms or digital filtering to reject hot-plug/EMI chatter.
  • PG→EN gating: cascade upstream PG to downstream EN; apply min EN pulse.

Minimal supervisor network

  • OR all FAULT (open-drain) → one pull-up → MCU + LED/relay.
  • Comparator/supervisor sets window for critical rails; outputs gate downstream EN.
  • Expose testpads for EN, PG, and FAULT; log sticky fault cause when available.
State Policy PG FAULT EN requirement Clear condition Notes
Normal regulationHighHigh-ZPG may glitch at load steps if tight bands
OCP persistentHiccupToggles with triesLow (momentary)Auto after tHICCUPEnsure tRESTART ≥ tSS
EMI/brownoutAuto-retryLow until stableLow (momentary)Auto after retry delayIncrease tDEGLITCH if chatter
Safety tripLatchLowLow (sticky)EN low ≥ tmin or power cycleManual clearLog fault code if available
Open-drain PG / FAULT Pull-ups 4.7–10 kΩ (noisy backplanes: 2.2–4.7 kΩ + RC) Reg A: FAULT Reg B: FAULT Wire-OR bus → MCU Truth cues Hiccup: PG toggles; FAULT momentary Auto-retry: PG low until stable Latch: PG low; FAULT sticky until clear PG → EN gating Upstream PG drives downstream EN; respect min EN pulse and debounce Boost PG Buck EN

10) Thermal & OTP Behavior

OTP trip, de-rating/fold-back vs hard shutdown; soak tests and airflow. Hot-spot vs average temperature, NTC placement and copper area; repeat-trip aging and guardbands.

Behavior map

  • Fold-back: current derates with temperature; maintains output but reduces capability.
  • Hard shutdown: fastest safe stop; may pair with latch for certification.
  • Trip/clear: define Ttrip and ΔThyst with explicit clear conditions.

Hot-spot vs average

  • Hot spots lead average temperature; place NTC near copper hot areas, not in direct airflow.
  • Copper area & vias control diffusion; measure ΔTpath to set Ttrip.
  • Validate with thermocouple/IR and on-die telemetry if available.

Setpoint & hysteresis

  • Ttrip = Tallow,max − ΔTpath.
  • ΔThyst ≥ ramp_rate × restart_latency (avoid temperature chatter).
  • Include β tolerance of NTC, divider error, and ADC quantization (if MCU involved).
Environment Ttrip start ΔThyst Fold-back? Sensor Validation focus
Sealed enclosureLower (earlier trip)≥10–15 °CYesDie + NTCSoak 60 min; repeated trips
Ventilated chassisNominal8–12 °CMaybeNTCAirflow X m/s; ramp cycles
Automotive engine bayLower12–18 °CYesDie + NTCCranking heat; brownouts
Outdoor airflowNominal–higher8–12 °CNo/MaybeNTCWind gusts; sun load
Fold-back vs hard shutdown Temperature Output current Fold-back Hard-off T_trip NTC placement near hotspot Hot copper area NTC close to hotspot Avoid direct airflow bias

Repeat-trip aging & validation

  • Track ESR drift, magnetics heating, MOSFET threshold shifts after repeated OTP trips.
  • Set max retry count or extend tHICCUP to limit thermal cycling duty.
  • Run soak tests (30–60 min) and 3–10 thermal cycles; log Ttrip/clear and PG/FAULT changes.

11) Layout, EMI, and Measurement Hooks

Kelvin sense for Rsense; shortest gate-discharge loop; local MLCC at FET. PGND/AGND partition with single-point bridge to protect comparators. Reserve injection points for loop probing (future §Bode page).

Current sense & power path

  • Rsense Kelvin: two sense traces direct to IC pins; avoid high-di/dt regions; matched length.
  • Gate discharge loop: driver → gate → back to PGND by the shortest path; avoid AGND/FB.
  • Local MLCC: 0.1–1 µF HF bypass at FET pins + 10–22 µF bulk; minimize loop area.

Ground & analog domain

  • PGND/AGND split with a single bridge near IC; keep comparators and FB divider on the AGND island.
  • Guard the SW node; avoid parallel routing with FB; add ground moat if needed.
  • Probe grounds on the AGND island to reduce bounce.

EMI optimization & measurement hooks

  • Minimize hot loop: VIN → HS FET → SW → inductor → Vout → return to CIN.
  • dv/dt control via gate resistor / RC snubber; keep SW copper compact.
  • Bode injection pad: 50–100 Ω series point at COMP/FB, with coax pads.
  • Dedicated testpads: GATE, SW, Vout, Vsense, PG/FAULT, EN (low-inductance, common ground).
PGND / AGND partition PGND island AGND island Single-point bridge R_sense Kelvin & gate loop Two Kelvin traces → IC pins Shortest gate discharge to PGND Injection & test pads Bode injection (50–100 Ω) GATE / SW / Vout Vsense / PG / FAULT / EN Coax-friendly footprints; common ground

12) Validation Checklist (engineering)

Load × VIN × T matrix; fast-short pulse; repeated hiccup cycles; OVP overshoot < spec; UVP ride-through at brownout; OTP hot-soak; PG timing; SS interaction. Artifacts: CSV logs, register dumps, scope screenshots.

Master checklist

  • Matrix: Load(0→full→transient) × VIN(min/nom/max) × Temp(cool/room/hot).
  • Fast-short: pulse MOSFET; detect-to-off ≤ µs; record overshoot & thermal.
  • Hiccup: N retries; duty & peak temp within limits.
  • OVP: overshoot < spec; clamp/bleed heating acceptable.
  • UVP: brownout ride-through ≥ target; no reset chatter.
  • OTP: soak 30–60 min + 3–10 cycles; record trip/clear temp.
  • PG/SS: EN→PG delay, PG glitches count; SS slope vs I_LIMIT(startup).

Artifacts & naming

  • CSV: VIN, Iload, Temp, Vsense_pk, Vout_pk, t_trip, t_clear, policy, PG, notes.
  • Registers: read FAULT/STATUS after events; mark sticky bits and retry count.
  • Scopes: consistent filenames with channels/temp/VIN/load/timebase.

Pass / fail thresholds

Item Target Method Pass threshold Notes
Fast-shortµs-class shutoffPulse MOSFETt_trip→gate-off ≤ 3 µsVIN max/hot
OVPOvershootLoad step≤ X%Clamp temp ≤ Y°C
UVPRide-throughBrownout profile≥ Z msNo chatter
HiccupThermal dutyN retriesT_hot < specBack-off if needed
OTPTrip/clearSoak & cycleWithin bandΔT_hyst as designed
PG/SSTiming & stabilityScopesEN→PG ≤ targetGlitches ≈ 0
Test matrix Load × VIN × Temp Scenarios Fast-short / OVP / UVP / OTP Artifacts CSV / regs / scopes P/F PG / FAULT checks EN→PG delay, PG chatter count Sticky FAULT bits readback Policy: hiccup / auto-retry / latch Thermal & duty Hiccup duty vs hotspot temp Soak/cycle distributions ΔT_hyst validation

13) IC Selection Guide (structure slot; real PNs)

Built-in robust protection setExternal sense & supervisor-friendlyAutomotive AEC-Q variants。 Brand | Series/PN | OCP | OVP | UVP | OTP | Fast-short | Restart | SS/PG features | Notes

Bucket A — Built-in robust protection set

Brand Series / PN OCP (type) OVP (mode) UVP OTP Fast-short Restart SS / PG features Notes
TI TPS562200 Cycle-by-cycle (valley) Comparator shutdown Yes (UVLO/UVP) Yes High-speed CL path Hiccup (auto-recover) Internal SS; (PG via family variants) 17 V in / 2 A sync buck; compact BOM
ST L7987 / L7987L Peak limit (prog.) OVP shutdown Yes Yes Fast shut via gate pull-down Hiccup SS pin; PGOOD 61 V / 3 A class; industrial wide-VIN
Renesas ISL85410 Cycle-by-cycle OVP shutdown Yes Yes Fast current limit path Auto-retry SS cap; PG/EN pins 40 V in / 1 A sync buck
onsemi NCV890430 Cycle-by-cycle OVP shutdown Yes Yes Gate rapid discharge Hiccup PG pin (variant-dep.) 45 V in / auto battery friendly
Microchip MCP16301 / MCP16301H Cycle-by-cycle OVP shutdown UVLO/UVP Yes Sense-path fast trip Auto-retry Soft-start (int.); EN 30 V non-sync buck; SOT-23-6

Bucket B — External sense & supervisor-friendly

Brand Series / PN OCP (type) OVP (mode) UVP OTP Fast-short Restart SS / PG features Notes
TI LM5145 Cycle-by-cycle + avg (ext. sense) Comparator; PG gating UVLO/UVP Yes Dedicated fast CL path Configurable hiccup PGOOD; SS pin; ext. amp friendly 75 V sync buck controller
TI LM5176 Peak + average (shunt/DCR) OVP shutdown UVLO/UVP Yes Fast-short path (cmp → gate off) Hiccup / auto-retry PGOOD; SS; 4-switch BB 55 V 4-switch buck-boost
Renesas ISL81601 Peak + average (bidirectional) OVP shutdown UVLO/UVP Yes Fast gate discharge Auto-retry PG; TRACK/SS; bidirectional 60 V 4-switch BB controller
onsemi NCV8871 Cycle-by-cycle (boost) OVP shutdown UVLO Yes Fast current limit Hiccup EN/SS; comp pin 40 V boost controller
Melexis MLX91220 / MLX91216 External current sensing (Hall) Diag. flags Fast over-current telemetry Isolation-friendly; feeds supervisor Use to enhance OCP/OTP strategy

Bucket C — Automotive AEC-Q variants

Brand Series / PN OCP (type) OVP (mode) UVP OTP Fast-short Restart SS / PG features Notes
TI LM5176-Q1 Peak + average OVP shutdown UVLO/UVP Yes Fast-short path Hiccup / auto PGOOD; SS; AEC-Q100 55 V 4-switch buck-boost
TI LM5145-Q1 / LM5146-Q1 Cycle-by-cycle + avg OVP shutdown UVLO/UVP Yes Gate rapid discharge Hiccup PGOOD; SS; AEC-Q100 75–100 V sync buck controllers
TI LM5156x-Q1 / LM51561-Q1 Cycle-by-cycle (boost/SEPIC) OVP shutdown UVLO Yes Fast current limit Hiccup SS/PG; AEC-Q100 65 V boost/SEPIC/flyback
onsemi NCV890430 Cycle-by-cycle OVP shutdown UVLO Yes Fast pull-down Hiccup PG pin (variant-dep.) Automotive battery rails
onsemi NCV8871 Cycle-by-cycle (boost) OVP shutdown UVLO Yes Fast CL path Hiccup EN/SS; AEC-Q Front-end boost
NXP FS5600 Integrated limit & monitor Supervisor OVP UVP/UVLO Yes Supervisor-aided Latch / auto configs Multi-rail PG/WDT; AEC-Q100 G1 Power System Basis IC style
Built-in protection OCP/OVP/UVP/OTP Fast-short + hiccup SS & PG External sense Avg + peak current Supervisor-friendly PG gating / telemetry Automotive AEC-Q AEC-Q100 / Q-grade Latch / hiccup profiles PG/FAULT diagnostics

14) FAQs

Engineer-tone, 45–60 words each. Click to expand. See related: sensing (§3), timers (§5), restart (§6), pins (§9), thermal (§10), validation (§12).

Cycle-by-cycle OCP vs average-current limit—when to use each?

Cycle-by-cycle trips at the next PWM decision, catching sub-millisecond surges to protect FETs and magnetics—best for spiky or fault-prone loads. Average limit filters ripple to preserve throughput and reduce nuisance trips—good for motors/LEDs. Many controllers combine both: set average near thermal safe current, cycle limit above ripple crest.

Validate at VINmax/hot with square-wave steps; log ttrip, duty loss.

Valley vs peak current detection and nuisance trips.

Peak sensing reacts earlier but is vulnerable to leading-edge spikes; blanking and RC filtering are mandatory. Valley sensing inherently ignores that spike but reacts one half-ripple later, so thresholds must include ripple amplitude. On noisy boards, start with valley plus modest slope compensation; migrate to peak only after measuring spike width.

Tune tblank ≈ 3–5× spike width; verify across temp.

How fast-short shutdown cooperates with blanking windows.

A fast-short path bypasses the slow error amp: comparator → strong gate pull-down → SW clamp. Keep the blanking window short enough not to mask the first catastrophic edge, yet long enough to ignore switch spikes. For MHz bucks, start ~100–150 ns and confirm turn-off within ~1–3 µs.

Measure detect-to-gate-off delay and overshoot at VINmax/hot.

OVP clamp vs full shutdown for sensitive loads.

Clamp limits overshoot with a bleed or clamp FET and keeps the rail alive—ideal for analog rails, but it dissipates heat and can modulate ripple. Full shutdown removes drive and is safest for digital/logic rails; it causes service interruption but avoids thermal stress during faults.

Set clamp only for small overshoot; otherwise prefer shutdown.

UVP ride-through vs restart for brownouts and battery dips.

Ride-through holds regulation through brief sags using output capacitance and deglitching—good for UX continuity. Restart drops the rail and re-ramps, clearing latched faults but resetting downstream devices. Choose ride-through for digital loads with hold-up; use restart when safety or sequencing requires a clean power-on.

Size deglitch for worst sag; confirm PG behavior.

Mapping divider tolerances to precise OVP/UVP thresholds.

Start from Vout=Vref(1+Rtop/Rbot). Propagate E96 tolerances, reference accuracy, and FB bias/leakage to the threshold. Keep the FB node impedance ≤100 kΩ to limit leakage error. Target ±1–2% at the output, and verify across temperature and PCB contamination scenarios.

Guardband with worst-case Vref, bias, and temp drift.

Hiccup timing that won’t overheat during persistent shorts.

Set tHICCUP about 4–8× tSS to limit average power in a hard short and allow input caps to recharge. Verify thermal duty by measuring hotspot temperature over repeated cycles. If temperature creeps upward, extend off-time or back-off retries to keep silicon and magnetics within limits.

Log duty vs temperature; cap worst-case retries.

Latch behavior and safe manual clear strategies.

Latch keeps the rail off until a manual clear via EN/RESET or power cycle—preferred for safety-critical paths. Document the minimum EN low pulse and any timing needed for supervisors. Expose FAULT/PG pins and log the cause to aid field service and certification audits.

Provide onsite clear path and visible FAULT indication.

Pre-bias startup without reverse discharge.

When Vout is pre-charged, prevent reverse discharge through body diodes. Use an ideal-diode ORing FET or controller, and disable active discharge during faults. Verify startup with pre-bias at various levels and ensure SW/node current never flows into the load on enable.

Probe SW/body-diode current; confirm no undershoot.

OTP fold-back profiles vs hard trips in hot enclosures.

Fold-back reduces current with temperature, preserving partial service but lowering capability; good for fan failures or transient heat. Hard trips shut down quickly to protect hardware and may require manual recovery. In sealed boxes, prefer fold-back with adequate hysteresis; log Ttrip and recovery time distributions.

Set ΔThyst ≥ ramp×latency; run soak tests.

PG/FAULT truth tables and multi-rail interactions.

Hiccup toggles PG with each attempt; auto-retry keeps PG low until stable; latch holds PG low until manual clear. FAULT is usually open-drain and can be wire-ORed. Debounce PG and respect minimum EN pulses to avoid reset storms in chained VRMs or MCU domains.

Document clear conditions and PG masks.

Sense-resistor vs RDS(on) for accurate OCP across temperature.

Rsense with Kelvin routing gives best accuracy and repeatability at the cost of power loss and area. RDS(on) saves BOM but drifts +60–90% hot and varies by lot; guardband aggressively or calibrate. For higher currents, DCR sense plus NTC compensation is a low-loss middle ground.

Recheck limits at hot VIN and hot board.

EMI bursts causing false trips—filter and deglitch recipes.

Start with a small RC at the sense node, tight Kelvin routing, and leading-edge blanking around 80–200 ns. Add comparator deglitch 0.5–2 µs for inductive loads, shorter for digital rails. Validate with conducted/radiated immunity bursts and count nuisance trips against thresholds.

Correlate spike width to tblank before increasing thresholds.

Coordinating upstream Boost and downstream VRMs during faults.

Gate downstream EN from upstream PG to avoid starting into a collapsing bus. Mask downstream PG during upstream faults and enforce minimum EN pulses. On brownouts, allow ride-through at the front end while holding downstream rails off until the boost recovers and PG is stable.

Scope PG/EN edges; add debounce to shared lines.

What to log in production to track rare field faults.

Log VIN, Iload, board temperature, ttrip, tclear, PG state, and a compact fault code (OCP/OVP/UVP/OTP/retry count). Include pre-bias flag and firmware revision. Store rolling windows in non-volatile memory and export CSV during service to accelerate root-cause analysis.

Add timestamps and board serials for traceability.

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