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Edge Power & Backup: eFuse, Hot-Swap, PMBus Telemetry

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Edge power and backup design is about making power-up, faults, and short hold-up events behave in a controlled, repeatable way: avoid false trips, stay within SOA/thermal limits, keep the bus above UVLO/PG during switchover, and leave actionable telemetry/log evidence when something fails.

H2-1|Scope & Boundary: What “Edge Power & Backup” actually covers

This page focuses on the power path that decides whether an edge device survives the field: controlled turn-on (inrush), fault isolation (short/overload/over-voltage), ride-through/hold-up (seconds to minutes), and telemetry + fault logs that explain what happened. It does not expand into facility power, long-duration UPS, or full battery-management algorithms.

Typical inputs (minimum context)
  • 24 V industrial: long cables, load steps, transient events → inrush + brownout + nuisance trips.
  • PoE PD → 48 V / intermediate bus: negotiation and dynamic power limits → restart storms if thresholds are wrong.
  • 12 V adapters: different dynamic response and current limits → “swap adapter changes stability” is a common symptom.
Backup definition (measurable)
  • Hold-up window (thold): how long critical loads stay alive after input droops.
  • Allowed droop (Vhi → Vlo): usable voltage range set by PG thresholds and DC/DC UVLO.
  • Goal: finish essential actions (log flush / safe state / link preservation), not long runtime.

Success criteria (pass/fail, not slogans)

1) No nuisance trips
  • Cold/hot start, max load, worst input source: no repeated trip/retry loops.
  • Blanks/debounce windows prevent false OCP/UV events during intended inrush.
2) No thermal runaway / SOA abuse
  • Repeated start attempts do not push the pass FET into unsafe linear-energy zones.
  • OTP flags and temperature telemetry remain inside design limits across stress cases.
3) Controlled brownout behavior
  • Input droop does not cause reboot storms; PG/RESET sequencing behaves deterministically.
  • Critical rail stays up for thold to complete “must-do” actions.
4) Fault is diagnosable
  • Telemetry/logs answer: input collapse vs inrush too aggressive vs thresholds/time constants wrong.
  • Last-event record includes key voltages/currents/status bits near the fault timestamp.
Out of scope: UPS/PDU/facility distribution, full BMS (cell balancing, gauging algorithms), harvesting MPPT, OTA/security stacks, TSN/PTP networking, and certification walkthroughs. Mention is allowed only as a boundary sentence.
Figure F1 — Scope map: input → protection → hold-up → telemetry/logs (what this page covers)
Edge Power & Backup — Scope Map Controlled inrush · Fault isolation · Hold-up window · Telemetry & fault logs Inputs Protection & Inrush Hold-up & Evidence 24 V Industrial long cable · transients PoE PD Bus 48 V / intermediate 12 V Adapter dynamic limit varies eFuse / Hot-Swap dV/dt · I_limit · SOA FAULT ORing / Ideal Diode reverse block · switchover Main Bus & Rails PG/RESET boundaries Hold-up Storage supercap / small battery Telemetry V/I/P/T · status words PMBus Fault Logs timestamp · last-event record Critical Loads keep-alive rail TP1 Vin TP2 Vbus TP3 Iin TP4 Vcap

SEO note: This page uses explicit scope boundaries and measurable definitions (thold, Vhi, Vlo) to match “how-to debug” and “how-to size hold-up” search intent without drifting into UPS/BMS/harvesting topics.

H2-2|Power Path Topology: Input → controlled turn-on → bus → critical loads

Practical edge systems usually fall into one of three power-path templates. The goal is to pick a topology that matches the field failure pattern (brownout, overload, source swapping, intermittent shorts), then set thresholds/time constants so the system is stable across cold start, hot start, and worst-case input sources.

eFuse / Hot-swap controlled inrush + fault isolation
ORing / Ideal diode reverse blocking + fast switchover
Hold-up storage supercap / small battery
PG/RESET boundary defines Vlo and reboot behavior
PMBus telemetry evidence + last-event logs

Three templates (selection intent)

Template A — Single input, hardened path
  • Best for: one power source, but “dirty input” and frequent load steps.
  • Primary risk: inrush and linear-energy stress during startup or repeated retries.
  • Key metrics: dV/dt ramp, Ilimit, blanking, SOA/thermal, retry policy.
Template B — Dual input with ORing
  • Best for: need switchover without dropping the bus below UVLO/PG.
  • Primary risk: reverse feeding and supply “fighting”, plus bus dip during switchover.
  • Key metrics: reverse block, switchover threshold, ORing loss/heat, Vbus capacitance.
Template C — Keep-alive rail (partial backup)
  • Best for: whole system does not need backup; only critical functions must stay alive.
  • Primary risk: critical load definition expands over time → hold-up budget is exceeded.
  • Key metrics: keep-alive power cap, Vlo boundary, hold-up window, load shedding order.

Deliverable: topology selection mini-table (scenario → topology → what must be verified)

Field scenario trigger Recommended template Critical design knobs (must be explicit) First waveforms / evidence to capture Common failure mode if mis-set
Cold start trips, warm start is fine
“starts only after repeated plugging”
Template A dV/dt ramp, Ilimit, blanking window, SOA margin, retry/latch policy TP1 Vin, TP3 Iin peak, TP2 Vbus ramp, FAULT status and retry counter Inrush too aggressive → nuisance trips or linear-energy overheating during retries
Input droops cause reboot storms
“device keeps rebooting during brownouts”
Template C (or A + tuned UV/PG) Vlo boundary (PG vs UVLO), hold-up window, load shedding order, reset gating TP2 Vbus vs PG/RESET timing, TP4 Vcap, last-event log around droop PG/UV thresholds inconsistent → uncontrolled resets and log corruption
Main power fails but system must stay alive briefly
“needs safe shutdown / log flush”
Template C keep-alive rail power cap, Vhi/Vlo, storage ESR, peak-power tasks TP4 Vcap droop under peak load, keep-alive rail current, completion time for critical actions Underestimated peak tasks (write flash, radio burst) → hold-up window collapses
Dual source present (main + backup), but switchover is unstable
“sometimes stable, sometimes resets”
Template B reverse blocking, switchover threshold, ORing loss/heat, bus capacitance, priority policy TP2 Vbus dip at switchover, reverse current indication, ORing thermal, event logs Reverse feed or supply fighting → unexpected trips, overheating, or bus collapse
Role boundary reminder: eFuse/hot-swap defines inrush + fault isolation, ORing defines multi-source behavior, and PG/RESET defines what “usable Vlo” means. DC/DC topology details stay out of scope here.
Figure F2 — Three practical power-path templates (A/B/C) with shared measurement points
Power Path Templates (A/B/C) Same building blocks, different failure modes and verification points A Single input hardened path B Dual input with ORing C Keep-alive rail backup Input eFuse / Hot-Swap VBUS Loads rails + PG Main Backup ORing Hot-Swap VBUS no dip Input eFuse / Hot-Swap VBUS Keep-alive critical rail TP1 Vin TP2 Vbus TP3 Iin TP4 Vcap Verify: no dip below PG/UVLO during events

Next chapters (H2-3+) will zoom into eFuse vs hot-swap boundaries, inrush/SOA setting, fault response policy, hold-up sizing, ORing switchover stability, and PMBus evidence logging—without drifting into UPS, harvesting, or full BMS.

H2-3|eFuse vs Hot-Swap: Practical boundary, tradeoffs, and the most common mistakes

eFuse and hot-swap controllers often solve the same headline problem—protecting an input rail—but they behave very differently under linear operation (inrush limiting, brownout recovery, and repeated retries). A correct choice is less about the steady-state current rating and more about fault energy, response policy, and diagnostics.

SOA / linear energy Vds × Id × time
Inrush control dV/dt + blanking
Fault policy latch vs retry
Voltage drop bus margin
Diagnostics flags, counters, telemetry

Where the boundary actually sits

eFuse is a strong fit when…
  • Compact integration is valued and the expected fault energy is modest.
  • Start-up is predictable (Cload and ramp behavior are well-bounded).
  • Basic fault flags and simple GPIO reporting are sufficient for service.
Hot-swap is preferred when…
  • Repeated retries, large Cload, or harsh shorts make linear-energy the dominant risk.
  • External FET selection and thermal design are needed to scale SOA margin.
  • Richer fault policy and diagnostics are required to cut field debug time.

The 3 mistakes that cause “it limits current but still fails”

  • Only checking Ilimit, ignoring MOSFET SOA: during inrush limit or short-circuit limiting, the pass FET operates in the linear region where loss is Vds × Id, not I²R. If the device repeats this event, thermal stress accumulates quickly.
  • Using steady-state current to size protection: inrush peak is driven by Cload and ramp rate, so a “small-load” system can still trip at cold start or overload the upstream supply.
  • Treating eFuse like a breaker (unbounded retries): automatic retries can turn a recoverable event into repeated linear-energy hits, causing the device to run hotter each cycle and fail sooner.
Field-proof rule: Any retry behavior must be bounded (count, cooldown condition, or latch) and must emit a diagnosable record (fault reason + counter + temperature/elapsed time if available). Otherwise, a stable lab startup can become a failure pattern in the field.

One-card comparison table (selection + debug oriented)

Dimension eFuse (integrated pass FET) Hot-swap (controller + external FET) Typical symptom when misapplied
Linear energy / SOA headroom Fixed by package + internal FET; limited ability to scale Scalable by FET choice, heatsinking, and layout/thermal path “Limits current” but fails after retries or long-limit events
Inrush control Often simpler ranges; may be adequate for bounded Cload Wider ramp control and policy options for complex starts Cold start trips, warm start works; long ramp causes upstream droop
Fault response policy Commonly fixed or limited modes (retry/hiccup/latch) More flexible policies and timing windows Restart storms; “random” resets around brownouts
Voltage drop & dissipation Rds(on) and heating are fixed; bus margin may shrink Drop/heat can be optimized by choosing a lower-Rds FET PG flicker or UVLO events even without overload
Diagnostics Often basic flags and limited counters Potentially richer fault reason codes and telemetry integration Long debug time; parts swapped without identifying root cause
Figure F3 — eFuse vs Hot-Swap boundary: integrated SOA vs scalable SOA + diagnostics
eFuse vs Hot-Swap (Practical Boundary) Key: linear-energy headroom, policy, and diagnostics eFuse integrated pass FET VIN eFuse IC Ilimit · dV/dt VBUS LOADS rails + PG Linear-energy headroom fixed Hot-Swap controller + external FET VIN CTRL policy EXT FET scalable SOA VBUS LOADS rails + PG Linear-energy headroom scalable FAULT FLAGS COUNTERS TP1 Vin TP2 Vbus TP3 Iin TPx FAULT

This chapter intentionally avoids ORing switchover details and hold-up energy sizing; those are handled in later chapters to prevent scope overlap.

H2-4|Inrush & SOA: Controlled turn-on that avoids nuisance trips and device damage

Most edge power failures attributed to “random trips” are predictable outcomes of two coupled mechanisms: inrush peak (charging Cload) and linear energy (Vds × Id × time) during current limiting. A robust design chooses a ramp strategy that the upstream supply can tolerate and verifies SOA margin across single events and retry sequences.

Where inrush really comes from (Cload is a system property)

Cload contributors
  • Input bulk/EMI capacitors (near the connector).
  • DC/DC input capacitors (often the dominant term).
  • Downstream module caps (radio, storage, compute modules).
  • Sequenced attachments (modules that connect after enable).
Why “steady current” is misleading
  • Inrush is governed by dV/dt and effective Cload, not steady load current.
  • Upstream supplies with different current-limit behavior can reshape dV/dt and stability.
  • Repeated limiting events can accumulate heat even when average current looks small.

Two engineering-level calculations (useful, minimal)

Peak inrush estimate
  • Iinrush ≈ Cload × dV/dt
  • dV/dt is the controllable knob (soft-start / gate ramp).
  • Use this to keep peak current below upstream limit.
Linear energy (SOA driver)
  • Epulse ≈ ∫ Vds × Id dt
  • During limiting, loss is dominated by Vds × Id.
  • Retry loops add energy repeatedly; heat may not fully recover.
Verify: Iin peak vs upstream limit
Verify: Vbus ramp vs PG/UVLO
Verify: E_pulse margin (single + retries)
Capture: FAULT reason + retry counter

Limit-mode choice (startup success vs heat vs safety)

Constant-current limit
  • Higher startup success for heavy loads.
  • Risk: longer linear operation can raise E_pulse and heating.
  • Needs strict time windows and thermal protection.
Foldback limit
  • Reduces dissipation under hard faults.
  • Risk: some loads cannot start if current collapses too early.
  • Useful when fault probability is high and restart must be safe.
Fast disconnect
  • Strong safety and minimal linear stress.
  • Risk: poor availability without a controlled retry/latch policy.
  • Best paired with evidence logging to avoid “blind swapping”.

Symptom → likely cause (evidence-first mapping)

“Cold start trips, warm start works”
  • Effective Cload and ESR behave differently at temperature.
  • dV/dt too fast or blanking window too short for the actual ramp.
  • Upstream supply cold-start dynamics are weaker than assumed.
  • Evidence: Iin peak, Vbus ramp slope, fault timing relative to blanking.
“Swapping the adapter changes stability”
  • Different upstream current-limit strategies reshape dV/dt and Vin sag.
  • Output impedance differences change the Vin droop depth and UV behavior.
  • Some sources enter foldback early, forcing repeated restart attempts.
  • Evidence: Vin sag profile, Vbus build time, retry counter/fault reason.

Deliverable: 3-step parameter-setting flow (repeatable)

  1. Estimate worst-case Cload
    Output: Cload_max used for inrush design baseline (include DC/DC input caps and attached modules).
  2. Choose dV/dt to bound Iinrush
    Output: a dV/dt range that keeps Iinrush below upstream limit while meeting startup time needs.
  3. Check SOA/thermal for single + retry sequences
    Output: E_pulse margin and a bounded retry/latch policy (count + cooldown condition) tied to diagnosable logs.
Figure F4 — Inrush and SOA: dV/dt → Iinrush, and linear energy E_pulse during limiting
Inrush & SOA (Controlled Turn-on) dV/dt sets Iinrush · Vds × Id sets linear-energy stress Power path (simplified) VIN Pass FET dV/dt · Ilimit VBUS CLOAD bulk + DC/DC + modules Vds Iinrush ≈ Cload × dV/dt Epulse ≈ ∫ (Vds × Id) dt Evidence waveforms (simplified) time Vin sag Vbus Iin peak Typical symptoms cold start: higher peak adapter swap: different sag TP1 Vin TP2 Vbus TP3 Iin TPx FAULT

This section sets up later chapters: fault policy (blanking/retry/latch) and evidence logging must be consistent with SOA/thermal margins, otherwise stability varies with temperature and upstream power sources.

H2-5|Fault Coverage Map: What to protect, and how to prioritize responses

A stable edge power path is defined by what faults are covered and how each fault is qualified and acted on. “Nuisance trips” and “insufficient protection” are usually the same design error: thresholds were chosen without consistent time qualification and without respecting linear-energy limits during current limiting.

Prevent damage SCP / reverse / thermal
Avoid false trips blanking / debounce
Keep serviceable report + evidence
Control retries budget + cooldown

Fault list (edge-relevant) and why they matter

High-energy / fast damage risks
  • SCP: hard short; linear operation becomes destructive quickly.
  • OCP: overload or partial short; can heat the pass FET during limiting.
  • Reverse: reverse polarity or reverse current backfeed.
Stability / reset-storm risks
  • UV / Brownout: sag causes repeated restarts without proper qualification.
  • Power bounce: upstream foldback or cable drop produces oscillation.
  • OVP: abnormal source or transient; may require immediate isolation.
Thermal accumulation risks
  • OTP: device/FET heating from repeated limit or poor airflow.
  • Clamp heating: surge clamp path (e.g., TVS) runs hot after events.

Three response styles (choose by amplitude × time)

Immediate disconnect
  • Use for SCP, severe reverse, unsafe OVP, runaway thermal.
  • Goal: avoid extended Vds × Id dissipation in linear region.
  • Typical post-action: Latch + Report.
Current limit (hold)
  • Use for controlled start and bounded overload.
  • Must include: time limit + retry budget + cooldown rule.
  • Typical post-action: bounded Retry/Hiccup + Report.
Time-qualified decision
  • Use for UV/bounce/PG noise where false trips are costly.
  • Key tool: blanking/debounce aligned with safe energy limits.
  • Typical post-action: Report with min/peak capture.
Boundary rule: protection is rarely a single threshold. It is a threshold + qualification window. Large amplitude events require short windows; mild events can be qualified longer—but must still be bounded and logged.

Deliverable: Fault → Action matrix (policy + evidence)

Fault Primary action Qualification Post-action Retry budget (if any) Report / evidence to capture
SCP (hard short) Disconnect Very short / none Latch 0–small (only if proven safe) Fault reason + Iin peak + Vbus min + counter
OCP (overload/soft short) Limit Short window to avoid false trips Retry or Hiccup Bounded retries + cooldown condition Limit duration + Iin peak/avg + temp peak + counter
OVP Disconnect (typ.) Short (avoid slow thermal overstress) Latch or Retry Retry only if source is known to recover Vin max + event timestamp + reason code
UV / Brownout Qualify then Disconnect or Hold Debounce/blanking to avoid oscillation Retry Bounded; prevent reset storms Vin min + Vbus ramp time + retry counter
Reverse (polarity/backfeed) Disconnect / block None Latch 0 Reverse detect flag + Vbus/Vin relation
OTP Limit or Disconnect Time-qualified to avoid chatter Latch or Retry Cooldown-based Temperature peak + time-to-trip + counter
Power bounce Qualify + stabilize Debounce + restart gating Retry Bounded Vin sag profile + Vbus min + retry counter
Clamp heating Derate / Report Time-qualified Report N/A Event count + thermal sensor (if present)

Evidence checklist (minimum to make field failures diagnosable)

  • TP1 Vin: min/max during the event (sag/overshoot behavior).
  • TP2 Vbus: minimum value and ramp time (brownout and restart storms).
  • TP3 Iin: peak and/or limit duration (linear-energy driver).
  • TPx Fault: reason code + counter (and temperature peak if available).
Figure F5 — Fault Coverage Map: action matrix + response priority ladder
Fault Coverage Map (Action Policy) Threshold + time qualification + bounded retries + reporting evidence Fault → Action matrix Disconnect Limit Qualify Latch Retry Report SCP OCP OVP UV Reverse OTP Bounce ClampHeat Legend Enabled Conditional Not used Response priority fast damage → disconnect/latch TP1 Vin TP2 Vbus TP3 Iin TPx Fault

The matrix defines consistent behavior across sources, temperature, and load variability by tying actions to time qualification and bounded retry policies with diagnosable evidence.

H2-6|Backup Energy: Supercap vs Battery (hold-up / ride-through only)

“Backup” in edge devices typically means hold-up / ride-through: maintaining critical operation for seconds to minutes through brownouts, cable drops, or brief input loss. The decision is driven by power level, required time, and the allowed voltage droop window (Vhi → Vlo).

When each option fits (and what it costs)

Supercap fits best when…
  • High pulse power is needed for short durations.
  • Frequent ride-through events demand long cycle life.
  • Cold environments require predictable short-term behavior.
Supercap tradeoffs
  • Leakage current increases standby energy cost.
  • Volume grows quickly for minute-level energy.
  • Series stacks may require basic balancing/protection.
Small battery fits best when…
  • Minute-level energy is required in a small volume.
  • Critical loads are modest and power is not extremely pulsed.
  • Graceful shutdown or data preservation needs more time.
Scope boundary: this section covers interface and protection needs for hold-up only (charger limiting, UV/OV/OT protection, ORing). It intentionally avoids detailed battery management algorithms and long-term energy system design.

Key metrics that decide the design

Hold-up requirements
  • thold: required ride-through time (seconds → minutes).
  • Pcrit: critical load power to maintain.
  • V window: allowed droop from Vhi to Vlo.
Transient realism
  • ESR matters: ΔV ≈ Ipeak × ESR can cause immediate brownout.
  • Peak current and thermal rise must be checked under worst-case pulses.
  • Charge time and charge limiting define recovery behavior after events.

Minimal engineering formulas (enough for sizing decisions)

Supercap usable energy
  • E ≈ 1/2 · C · (Vhi2 − Vlo2)
  • Wider droop window yields more usable energy for the same capacitance.
Instant droop (ESR)
  • ΔV ≈ Ipeak · ESR
  • “Energy is sufficient” does not guarantee “voltage stays above Vlo”.

Deliverable: three selection questions (fast decision tool)

  1. How long must the system ride through?
    Seconds often favor supercap; minutes often favor small battery, depending on power and volume constraints.
  2. How much power is truly critical?
    High pulse loads push the design toward low-ESR buffering (supercap-friendly behavior).
  3. How low may the rail droop (Vhi → Vlo)?
    A tighter droop window increases required storage and raises the importance of ESR and ORing losses.
Figure F6 — Hold-up choices: Supercap vs Battery power-path blocks + droop window (Vhi→Vlo)
Hold-up (Ride-through) Choices Supercap vs Battery: interface blocks and voltage droop window Supercap hold-up high power · short time VIN Power-path eFuse / hot-swap VBUS Hold-up block Charger I-limit Supercap low ESR ORing ideal diode Battery hold-up higher energy · minutes VIN Power-path eFuse / hot-swap VBUS Hold-up block Charger limit Battery minutes Protect UV/OV/OT Voltage droop window (critical rail) time Vhi Vlo ΔV = I·ESR TP1 Vin TP2 Vbus

A hold-up design is only “real” when it passes both checks: (1) energy is sufficient over Vhi→Vlo for the required time, and (2) ESR and ORing losses do not cause an immediate droop below Vlo during peak load.

H2-7|Hold-up Sizing: an engineering-ready way to estimate “how long it lasts”

Hold-up time is determined by two practical constraints: (1) the usable voltage window (Vhi → Vlo) and (2) the real load profile (average + peaks). A correct estimate must map Vlo to the system’s actual stop points (UVLO/PG/critical-min) and must subtract immediate droop from ESR and path losses.

Voltage window Vhi → Vlo
Load realism avg + peak
Instant droop ΔV = I·ESR
Stop points UVLO / PG

Map Vhi / Vlo to real system thresholds

Vhi comes from
  • Storage charge limit (supercap charger CV / stack rating).
  • Backup source regulation point (battery + protection cutoff).
  • Path headroom (ORing drop, protection drop).
Vlo must be ≥ max of
  • DC/DC UVLO (input lockout of the downstream converter).
  • Critical load minimum (MCU/modem/storage min voltage).
  • PG/Reset policy (avoid premature reset due to short dips).
Immediate droop to reserve
  • ΔVESR ≈ Ipeak · ESRtotal
  • ESRtotal includes storage ESR + trace/cable + ORing/series elements.
  • Subtract ΔVESR from the usable window before computing time.
Practical definition: use (Vhi − Vlo − ΔVESR) as the usable droop window when peak events can occur during hold-up.

Supercap sizing: two approximations (choose by load behavior)

Constant-current approximation
  • Use when the bus-side load current can be treated as roughly constant.
  • thold ≈ C · (Vhi − Vlo) / Iload
  • Good for quick checks and bounded current profiles.
Constant-power hint (common in regulated loads)
  • Use when critical loads are closer to constant power (DC/DC regulated).
  • thold ≈ [½ · C · (Vhi2 − Vlo2)] / Pload
  • Apply a conservative path efficiency factor η for drops and conversion losses.

Battery sizing (minute-level): energy estimate only

Minute-level estimate
  • thold ≈ (Eusable · η) / Pcrit
  • Eusable can be approximated by Wh with a conservative usable fraction k.
  • Keep the model simple; focus on cutoff voltage and protection boundaries.
Must include in the estimate
  • Protection cutoff / minimum allowed battery voltage (effective “Vlo”).
  • Peak power events during hold-up (radio TX, flash write, actuator pulses).
  • Temperature and aging margin in the usable fraction k.

Common sizing pitfalls (and the symptom they create)

Pitfall Typical symptom Engineering fix
Capacitance is sized, but ESR droop is ignored “Energy looks sufficient,” yet the system resets immediately on input loss Reserve ΔVESR = Ipeak·ESRtotal; increase headroom, reduce ESR, or limit peaks
Average load is used, but peak events occur during hold-up Stable at idle; fails during flash write / modem TX / startup spikes Model Ppeak / Ipeak; define whether peak events are allowed during hold-up
Vlo is chosen without UVLO/PG/critical-min mapping Unexpected early shutdown or repeated reset storms Set Vlo to the highest of (UVLO, critical-min, PG policy) with margin
Path drops are ignored (ORing, protection, conversion) Time estimate matches bench but fails in the field at temperature Use conservative η; treat series drops as reduced V window

Deliverable: minimum usable calculation box (variables + steps)

The box below is structured for copy/paste into a design note or test plan. Replace placeholders with measured values.

Symbol Meaning Typical unit Fill-in
CEffective capacitance (at operating voltage)F[ ___ ]
VhiInitial bus/storage voltage at hold-up startV[ ___ ]
VloMinimum allowed bus voltage (mapped to UVLO/PG/critical-min)V[ ___ ]
IavgAverage bus-side current during hold-upA[ ___ ]
IpeakPeak current during hold-up eventsA[ ___ ]
ESRtotalStorage + interconnect + ORing equivalent ESRΩ[ ___ ]
ηPath efficiency (drops and conversion losses)[ ___ ]
PcritCritical-load power (for constant-power estimate)W[ ___ ]
  1. Set Vlo from real stop points.
    Vlo ≥ max(UVLO, critical-min, PG policy) + margin.
  2. Reserve immediate droop.
    ΔVESR = Ipeak · ESRtotal. Use (Vhi − Vlo − ΔVESR) as usable droop when peaks can occur.
  3. Compute hold-up time (choose one model).
    Constant-current: t ≈ C · (Vhi − Vlo) / Iavg. Constant-power: t ≈ [½ · C · (Vhi2 − Vlo2)] / Pcrit, then apply η conservatively.
  4. Sanity-check against peaks.
    Verify Vbus does not cross UVLO/PG during peak events (radio TX / flash write / actuator pulse).
Figure F7 — Hold-up sizing model: Vhi→Vlo window, ESR droop, and load peaks
Hold-up Sizing (Quick Model) V window + ESR droop + avg/peak load Blocks Storage Supercap / Battery Power-path ORing / protection drops + losses Critical load MCU / Modem / Storage TP1 Vstorage TP2 Vbus TP3 Iload Voltage window and thresholds Vhi Vlo UVLO PG V(t) ΔV = I·ESR Peak event Const-current t ≈ C·(Vhi−Vlo)/I Const-power t ≈ ½C(V²)/P

A sizing result is only acceptable if the measured Vbus minimum stays above UVLO/PG during the worst allowed peak event, and if ΔVESR is explicitly reserved rather than assumed away.

H2-8|Power-Path Management: switching between main and backup without dropouts or reverse feed

Main/backup switching fails for two reasons: uncontrolled current direction (reverse feed or source fighting) and insufficient transient support (Vbus briefly crosses UVLO/PG during handover). Power-path management must guarantee reverse-current blocking, bounded voltage drop, and a PG/Reset policy that matches real switching dynamics.

ORing / ideal-diode control: what it actually prevents

Reverse feed (backfeed)
  • Prevents backup from energizing the main bus or upstream supply.
  • Avoids unintended heating, “mystery power,” and unsafe current loops.
  • Key feature: reverse current blocking (not just low forward drop).
Source fighting (parallel contention)
  • Two sources with slightly different voltages can circulate current.
  • Creates heat and can trip protection even at modest load power.
  • Controlled ORing ensures only the preferred path conducts.
Drop and thermal reality
  • Forward drop reduces the usable V window for hold-up sizing.
  • Losses scale with current; thermal rise can worsen drop and stability.
  • Design target: “low drop + controlled direction + diagnosable events.”
Switching rule: handover stability is a combined outcome of (1) current direction control, (2) bus capacitance support, and (3) PG/Reset qualification (blanking/debounce) that matches the real Vbus trajectory.

What matters during the handover instant (microseconds to milliseconds)

  • Current direction: load current must migrate to the intended source without reverse conduction.
  • Bus capacitance support: Cbus bridges the delay while ORing transitions and control reacts.
  • PG/Reset timing: PG thresholds and blanking must prevent reset storms during brief dips, without hiding real brownouts.

Two failure modes that most often “flip the system”

Failure #1: backup backfeeds the main bus
  • Observation: main input “looks alive” after removal; unexpected heating or current.
  • Root causes: missing reverse blocking, body-diode paths, unintended conduction through protection.
  • Fix direction: true ideal-diode ORing or back-to-back FET strategy; log reverse-current events.
Failure #2: Vbus dips below UVLO during switching
  • Observation: repeating resets / reconnect loops during brownouts and cable drops.
  • Root causes: Cbus too small, ORing delay, excessive path drop, PG too sensitive.
  • Fix direction: increase effective window (reduce drop, add C, tune thresholds/blanking) and verify with waveforms.

Deliverable: switching validation checklist (must-capture waveforms)

Minimum 4 waveforms (recommended baseline)
  • Vin_main and Vin_backup (relative timing and sag).
  • Vbus (Vmin, dip duration, recovery time).
  • Ipath (direction + peak during handover).
  • PG/Reset (whether resets correlate with brief dips).
Highly useful add-ons
  • ORing Vds / gate (confirm intended turn-on/off and reverse blocking).
  • Vcrit (critical rail at the load, not only at the bus).
  • Trigger: on Vbus falling edge or UVLO crossing for repeatable captures.

A switching design is considered robust only if it demonstrates (1) no reverse feed under worst-case source mismatch, and (2) no UVLO/PG crossings at the critical rail during the full handover envelope.

Figure F8 — Main/backup ORing handover: current direction control + Cbus support + PG blanking
Power-path Switching (Main ↔ Backup) ORing direction control + transient support + PG policy Inputs and ORing Main In Backup In ORing ideal diode ORing reverse block Shared bus and loads VBUS Critical rail MCU / Modem / Storage Cbus reverse feed blocked Handover stability (Vbus dip and PG policy) Vbus UVLO PG PG blanking debounce window Cbus support bridge the delay TP1 Vin_main TP2 Vin_backup TP3 Vbus TP4 Ipath TP5 PG/Reset

H2-9|PMBus Telemetry & Fault Logs: treating the power system as a “black box”

A robust edge device does not rely on guesswork during brownouts and trips. It collects a small but decisive set of telemetry signals and turns them into two outcomes: (1) online closed-loop protection (derate before a crash) and (2) offline forensics (reconstruct what happened right before the last reset or shutdown).

Online loop derate / limit / disable
Offline trace timeline + snapshots
Evidence first not assumptions

What to measure (minimum set that explains most failures)

Input evidence
  • Vin_main / Vin_backup (or post-PD bus for PoE)
  • Iin (or Pin if available)
  • UV/brownout indication (sag window)
Bus evidence
  • Vbus (Vmin + dip duration)
  • Ibus / Pbus (load migration signature)
  • ORing / switch state (handover events)
Critical rails
  • MCU rail, modem rail, storage rail (only the rails that define “alive”)
  • PG/Reset reason (if accessible)
  • Rail undervoltage flags
Protection & storage state
  • eFuse / hot-swap: OCP/OTP/UV/OV flags
  • Retry / hiccup counters, latch reason
  • Vcap / Vbat (backup energy readiness)
Key discipline: log both what the source did (Vin/Iin) and what the device did (Vbus/flags/counters), otherwise the failure will be misclassified.

Two values from the same telemetry: online loop vs offline forensics

Online closed-loop actions (before a crash)
  • Soft derate: CPU frequency cap, radio TX power cap
  • Peak shaping: postpone non-critical tasks, limit concurrent loads
  • Selective disable: turn off high-peak peripherals first
  • Safe shutdown when inevitable: persist state → power down cleanly
Offline forensics (after the crash)
  • Reconstruct a timeline: what changed first (Vin sag, OCP, OTP, PG drop)
  • Capture a snapshot window: pre-event + post-event samples
  • Use counters to detect patterns: repeated retries vs single hard trip

Event logging strategy: timestamp + reason code + pre/post window

A black-box log must do more than store a fault bit. It needs a timestamped event record, a cause code, and a bounded capture window around the event. The practical implementation is a ring buffer in RAM that keeps recent telemetry frames and freezes on triggers, then commits the frozen record to non-volatile memory.

Field Why it matters Example content (compact)
Timestamp Places all evidence on a single timeline t = 123456 ms (monotonic) or RTC time
Event type + cause Distinguishes source sag from protection action UV / OCP / OTP / ORing switch / PG drop
Pre-trigger frames Explains what was trending before the event Last N frames of Vin/Vbus/I/T/Vcap
Post-trigger frames Shows recovery attempt (or collapse behavior) Next M frames after trigger
State snapshot Converts raw waveforms into actionable clues eFuse flags + retry count + latch reason

Deliverable: “Telemetry → Action” mapping table (firmware-ready)

Thresholds below are expressed as “value + time window” to prevent false triggers. Replace with product-specific numbers.

Anomaly signal Detection rule (value + time) Firmware action What to log
Vin sag / brownout window Vin < threshold for Δt (debounced) Derate loads; prepare safe state; prefer backup path if available Vin/Vbus/Iin + event stamp + mode
Vbus dip near UVLO Vbus min < margin-to-UVLO Peak shaping; temporary peripheral disable; PG blanking policy check Vbus min, dip duration, PG state
Iin spike / repeated pulses Iin peaks repeating within window Limit peak, extend ramp, avoid repeated retries Iin peaks + retry counter + cause flags
Protection warning (pre-OTP / near-limit) T rising to warning band Thermal derate; reduce duty; pause high-power features T trend + current + power
Backup energy low Vcap/Vbat below ready threshold Reduce hold-up expectations; block certain peak actions Vcap/Vbat + charge state
Figure F9 — Power “black box”: what to measure, how to trigger, and how to preserve evidence
PMBus Telemetry & Fault Logs Evidence: signals → trigger → ring buffer → NVM log Power system Vin main / backup Iin inrush / pulses Protection eFuse / hot-swap flags + counters VBUS Vmin / dips Rails + PG Vcap / Vbat Telemetry engine Sampler PMBus / ADC Ring buffer recent frames Event trigger UV / OCP / OTP NVM log frozen record Evidence export local MCU TP1 Vin TP2 Iin TP3 Vbus TP4 Vcap/Vbat TP5 flags

Telemetry is successful only if it can answer three questions after any failure: (1) did the input collapse, (2) did protection act, and (3) which threshold or sequence happened first on the timeline.

H2-10|Field Debug Evidence: why swapping an adapter or cable can fix—or worsen—dropouts

In the field, “swap the adapter” often changes three hidden parameters: source current limiting behavior, output impedance, and transient response. A cable swap changes DC drop and pulse droop. The fastest way to converge is to follow an evidence priority: voltage first, current second, and state+temperature+logs last to confirm the diagnosis.

Evidence priority (must be executable in the field)

1) Voltage evidence
  • Vin sag depth + duration (brownout window)
  • Vbus minimum vs UVLO/PG thresholds
  • Ripple growth during load events
2) Current evidence
  • Inrush peak (start-up and retries)
  • Repeating pulses (hiccup source or retry protection)
  • Abnormal bursts aligned with resets
3) State + temperature evidence
  • eFuse/hot-swap flags: OCP/OTP/UV/OV
  • Retry counters and latch reasons
  • Thermal trend near protection limits
Fast split: determine whether the collapse starts at Vin (source-limited) or at Vbus (device/path/protection), then use current and flags to confirm.

Diagnosis split (three outcomes)

Outcome What the waveforms usually show What the logs/flags usually show Action direction (within scope)
A) Source-limited Vin collapses first; Vbus follows; dips repeat if the source hiccups UV/brownout timestamps lead; protection may not trip first Reduce peak demand; widen ramp; validate cable drop; confirm input margin
B) Inrush / peak-limited Iin spike then Vin/Vbus dip; repeated current pulses indicate retries OCP with retry count rising; “start succeeds warm but fails cold” patterns Shape inrush; avoid repeated retries; reserve ESR droop; align thresholds
C) Policy mismatch Vbus briefly dips near thresholds; PG/Reset toggles despite quick recovery PG/Reset events correlate with short dips; UVLO/PG policy too aggressive Tune debounce/blanking; ensure Vmin stays above UVLO; validate handover dynamics

Deliverable: “10-minute triage card” (meter → scope → logs)

  1. 0–3 min: basic checks (meter / quick record).
    Measure Vin and Vbus at light and heavy load. Note cable and connector temperature or discoloration if present.
  2. 3–7 min: capture waveforms (scope).
    Capture Vin, Vbus, PG/Reset. Add Iin/Ipath if possible. Trigger on Vbus falling edge or threshold crossing.
  3. 7–10 min: confirm with state and logs.
    Read last event: cause flags, retry counters, and the pre/post snapshots. Confirm what happened first on the timeline.
Figure F10 — Field evidence chain: waveforms → flags/logs → 10-minute triage split
Field Debug Evidence Voltage first, current second, state+logs to confirm Waveform evidence (simplified) Vin brownout window Vbus UVLO Iin inrush / retries Evidence categories Voltage Current State + Temp + Logs 10-minute triage split A) Source-limited Vin collapses first B) Inrush-limited Iin spike + retries C) Policy mismatch PG/UV thresholds 1 meter 2 scope 3 logs

H2-11|Validation Plan: proving it is truly “more stable” (not just lucky)

A stable edge power + backup design must be verified as a repeatable system behavior, not a one-off demo. This plan converts “more stable” into measurable pass/fail criteria plus a mandatory evidence set (waveforms + fault logs) so every failure is classifiable and reproducible.

No false trips under allowed disturbances
No thermal runaway under real faults
Reproducible logs timeline + cause
Correct recovery no reboot loops

Define “stable” as testable metrics

Start-up stability
  • Cold start and hot start success across N cycles
  • No protection misfire during ramp or load attach
  • PG/Reset does not chatter near thresholds
Disturbance tolerance
  • Brownout / jitter / dropout handled without reboot loops
  • Backup switchover does not cross UVLO/PG trip points
  • System enters derate / safe mode before collapse (if designed)
Fault correctness
  • Short/overload forces the intended action within time bounds
  • No uncontrolled heating from repeated retries
  • Fault cause is consistent with waveforms and logs
Mandatory evidence set: without these signals, the result cannot prove “more stable.”
Vin(main/backup) Vbus PG/Reset Iin (recommended) Vcap/Vbat (backup) Flags + retry counters Pre/Post log window

Example BOM material numbers (for building a verifiable platform)

The list below is a pragmatic “validation-friendly” BOM: protection devices with readable status, power-path mux/ORing, backup managers, telemetry parts, and non-volatile logging. Choose according to voltage/current, SOA, thermal limits, and availability.

eFuse / protected load switch (status-friendly)
  • TPS25982 (TI) — eFuse with adjustable protection, diagnostics
  • TPS25947 (TI) — eFuse family for inrush/OV/UV/OCP use-cases
  • TPS2662 (TI) — dual-channel eFuse-class protection for rails/branches
  • MAX17613 (Analog Devices/Maxim) — protected high-voltage switch family (use-case dependent)
Hot-swap / surge stopper (SOA-centric protection)
  • LTC4215 (Analog Devices) — hot-swap controller (external MOSFET)
  • LTC4217 (Analog Devices) — hot-swap controller options for higher power
  • LTC4368 (Analog Devices) — surge stopper / overvoltage protection
  • LTC4365 (Analog Devices) — OV/UV + reverse protection controller class
Power mux / ideal diode / ORing (clean switchover)
  • TPS2121 (TI) — power mux (priority + seamless switchover)
  • TPS2120 (TI) — power mux family option (ratings vary)
  • LTC4412 (Analog Devices) — ideal diode controller class
  • LTC4359 (Analog Devices) — ideal diode ORing controller
Backup power manager (supercap/battery hold-up layer)
  • LTC3350 (Analog Devices) — supercap backup controller + monitoring
  • LTC4040 (Analog Devices) — backup power manager for 2.5V–5V rails (use-case dependent)
  • LTC3225 (Analog Devices) — 2-cell supercap charger/balancer class
  • MAX38888 (Analog Devices/Maxim) — backup/supercap manager family (check rail domain)
Telemetry / power monitors (for evidence & closed-loop)
  • INA238 (TI) — current/voltage/power monitor (I²C, fast captures)
  • INA229 (TI) — precision monitor options (logging-friendly)
  • LTC2946 (Analog Devices) — power/energy monitor class (application dependent)
  • ADT7420 (Analog Devices) — digital temperature sensor (for OTP correlation)
PMBus / power-system manager (sequencing + fault logging)
  • LTC2977 (Analog Devices) — PMBus power system manager (multi-rail)
  • LTC2974 (Analog Devices) — PMBus manager family
  • UCD9090A (TI) — system health monitor / supervisor with telemetry concepts
  • UCD90240 (TI) — digital power sequencer / supervisor class
Non-volatile logging (fast commits, many writes)
  • FM24CL64B (Infineon/Cypress) — I²C FRAM (write endurance friendly)
  • FM25V10 (Infineon/Cypress) — SPI FRAM option
  • 24LC256 (Microchip) — I²C EEPROM (budget logging, slower writes)
  • W25Q32JV (Winbond) — SPI NOR flash (bulk logs; manage wear)
Supercap balancing / cell monitors (when needed)
  • LTC3225 (Analog Devices) — 2-cell supercap charger + balance
  • LTC3350 (Analog Devices) — system-level supercap controller + monitor
  • TLV431 (TI) — shunt reference used in simple balance/clamp topologies
  • LMV331 (TI) — comparator class for simple UV/OV detect hooks
Material numbers above are deliberately “validation-friendly”: choose parts that expose flags, counters, and measurable points, otherwise you cannot prove why a field issue improved (or worsened) after a swap.

Validation Matrix (Test item → Setup → Pass/Fail → required waveforms/log fields)

Use this as an execution script. For each test, capture the evidence set and enforce the pass criteria. If a failure occurs, the waveform + log must produce a consistent “failure signature” (source-limited vs inrush-limited vs policy mismatch).

Test item Setup (conditions) Stimulus / injection Must-capture waveforms Must-capture log fields Pass / Fail criteria
Cold start T = Tmin, load = typical, input = source A Power-on ramp to nominal Vin, Vbus, PG/Reset (Iin recommended) Boot event stamp; any OCP/UV/OTP flags; retry counters Pass: 100% boot success across N cycles; no false trips; no PG chatter
Hot start T = after warm-up (steady thermal), load = typical Power-cycle with short off-time Vin, Vbus, PG/Reset, Iin Cause of any trip; pre-trigger frames (Vin/Vbus/I/T) Pass: no degradation vs cold start; no “retry heating” pattern
Input source variation Same device/load; swap input sources (A/B/C) Repeat start + load steps per source Vin, Vbus, Iin, PG/Reset Event timeline; UV window duration; source sag signature Pass: stable across sources; if behavior changes, logs must clearly classify root cause
Max load + peak events Load = max; enable known peak (radio TX / write / actuator) Peak bursts while monitoring Vbus min, Iin peaks, PG/Reset Derate actions taken; peak limiter state; counters Pass: no unexpected reset; no thermal runaway; controlled derate if designed
Brownout window Operate near minimum input margin Inject sag (depth + duration sweep) Vin sag profile, Vbus response, PG/Reset UV event; pre/post capture; recovery mode Pass: no false trips outside defined boundary; within boundary → recovery strategy is correct and repeatable
Jitter / dropout Nominal load; input toggles or intermittent contact Short dropouts & bursts Vin/Vbus/PG, Iin pulses Event counters; retry count growth; any latch reason Pass: no reboot loops; protection does not self-heat via repeated retries
Backup switchover (main→backup) Main + backup present; backup charged/ready (Vcap/Vbat) Remove main input Vin_main, Vin_backup, Vbus, PG/Reset, Vcap/Vbat ORing/switch event; Vcap/Vbat min; any UV flags Pass: Vbus stays above UVLO/PG; switchover logged with correct time order
Backup switchover (backup→main) Running on backup; main restored Restore main input Vin_main/Vbus/Iin, PG/Reset Switch event; reverse-current flags if available Pass: no shoot-through/contest; no PG dip; no reverse feed into main path
Short-circuit injection Representative output/branch point (document the point) Hard short for controlled duration Vbus collapse response, Iin limit profile, device temperature trend OCP cause; action type (latch/retry); retry count Pass: intended action occurs within bounds; no uncontrolled heating; logs match waveforms
Overload injection Step load beyond rated; then sustained overload Load step + dwell Vbus dip, Iin profile, PG/Reset behavior Derate/limit flags; OCP/OTP warnings Pass: no oscillatory reboot; controlled limit or shutdown with evidence
Reverse polarity (if allowed) Only if design intent supports it Apply reverse input within safe bounds Input current behavior; protection response Reverse flag/cause; latch reason Pass: no damage; no uncontrolled current; event correctly logged
Pass criteria must include evidence: every key event must be supported by a waveform trigger point and a matching log record (timestamp + cause + pre/post frames). Otherwise the outcome is not auditable.
Figure F11 — Validation coverage map: conditions × injections × evidence set × pass criteria
Validation Plan Prove stability with repeatable coverage + evidence Conditions Cold / Hot start Input sources A/B/C Load: min/typ/max Temp: Tmin/Tmax Brownout / jitter dropout windows Injections Short circuit Overload Reverse (if allowed) Backup switchover main ↔ backup Peak burst event Evidence Vin / Vbus dip depth + duration PG / Reset Iin (opt) Vcap / Vbat Flags + logs timestamp + pre/post Pass criteria No false trips No thermal runaway Logs reproducible

Practical rule: a test only “counts” when the captured waveforms and the logged cause/timeline agree. If they disagree, the platform lacks observability.

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H2-12|FAQs (12) — Edge Power & Backup

Each FAQ maps to the corresponding chapter (H2-3…H2-11) and stays within this page boundary: protection, hold-up, switchover, telemetry/logs, field evidence, and validation methodology.

Figure F12 — FAQ map (questions → chapters)
FAQ Map Evidence-driven answers mapped to chapters Questions Q1 eFuse vs Hot-swap Q2 Frequent trips @ low avg I Q3 C_load ↑ : dV/dt or I_limit? Q4 Foldback vs Constant Q5 Retry vs Latched safety Q6 ESR: “calc OK, run wrong” Q7 V_lo: PG or UVLO? Mapped chapters H2-3 eFuse vs Hot-swap H2-4 Inrush & SOA H2-5 Fault coverage map H2-7 Hold-up sizing H2-8 Power-path switching H2-9 PMBus telemetry & logs H2-10 Field debug evidence H2-11 Validation plan Q8–Q9 → H2-8 · Q10 → H2-9 · Q11 → H2-10 · Q12 → H2-11

1What is the clean engineering boundary between an eFuse and a hot-swap controller, and when is hot-swap mandatory?
Maps to: H2-3 (eFuse vs Hot-Swap)
The boundary is dominated by how much linear-mode energy must be controlled. eFuses integrate the pass FET plus protection/diagnostics and fit moderate energy start-up profiles. Hot-swap controllers drive an external MOSFET, so SOA and thermal capacity scale with FET choice and heatsinking. Hot-swap becomes mandatory when large capacitance or long ramps force high VDS×ID energy, when voltage/current are high, or when a custom SOA/thermal design is required.
  • Evidence: startup Vbus ramp, Iin profile, and whether the pass element spends long time in linear mode.
  • Rule: pick the device class by energy + thermal, not just steady-state current.
Example MPNs: eFuse: TPS25982, TPS2662 (TI) · Hot-swap/surge stopper: LTC4215, LTC4368 (Analog Devices)
2Why can a system trip frequently even when average load current is small, and what are the top three root-cause classes?
Maps to: H2-4 (Inrush & SOA) + H2-5 (Fault Coverage Map)
Frequent trips at “low average current” usually come from peak current and time-window policy. The top three classes are:
  • Inrush or burst peaks (capacitor charge, radio TX bursts, motor/relay events) that exceed the limit briefly.
  • Threshold/blanking mismatch where ripple or short droops hit OCP/UV filters too aggressively.
  • Thermal accumulation from repeated retries: each attempt adds heat even if “average” looks small.
Quick proof: capture Vin/Vbus/Iin + fault flags; a repeating “hiccup” signature indicates policy/thermal, while one sharp spike indicates inrush.
Example MPNs: current/voltage monitor: INA238, INA229 (TI) · protection with diagnostics: TPS25947 (TI), LTC4217 (Analog Devices)
3After load capacitance increases, should dV/dt or current limit be adjusted first?
Maps to: H2-4 (Inrush & SOA)
Start with dV/dt because inrush is approximately I ≈ C×dV/dt; reducing the ramp lowers the peak without immediately raising stress elsewhere. Then adjust I_limit only if start-up time becomes too long or UV windows are crossed. The final step is always an SOA/thermal check: if the pass element must hold high VDS at high ID for longer, total energy and heating may increase even when peak current falls.
  • Evidence: compare peak Iin, ramp time, and pass-element temperature across settings.
Example MPNs: ramp/limit controls: TPS25982, TPS2662 (TI) · external-FET hot-swap: LTC4215 (Analog Devices), mux for controlled sourcing: TPS2121 (TI)
4Foldback vs constant-current limiting: which is more likely to “start successfully but run hotter”?
Maps to: H2-4 (Inrush & SOA) + H2-5 (Fault policy)
Constant-current limiting most often creates “starts successfully but runs hotter” because it can keep the pass element in a sustained linear region while the system finally comes up. Foldback reduces stress by lowering current as Vout droops, but it may fail to start heavy capacitive loads and can trigger repeated retry cycles that also heat the device. The safe choice depends on energy over time (VDS×ID×t), not on a single current number.
  • Evidence: log retry counts and temperature; correlate with Vbus ramp duration under limiting.
Example MPNs: eFuse limiting options: TPS25947, TPS25982 (TI) · hot-swap control: LTC4217 (Analog Devices) · telemetry: INA238 (TI)
5Why do more retries make failures more likely to burn parts, and how should retry vs latched behavior be set safely?
Maps to: H2-5 (Fault Coverage Map)
Retries can burn parts because each retry injects a thermal pulse into the pass element; if cooling time is shorter than thermal time constants, heat stacks and SOA margin collapses. A safe policy typically uses: (1) a small retry limit plus a cool-down delay, (2) latched-off for hard faults (shorts, repeated OCP, or high temperature), and (3) a mandatory log record with cause code, peak current, and temperature per attempt. The goal is to stop “self-heating via policy.”
Example MPNs: protection with fault timers/flags: TPS25982 (TI), LTC4215 (Analog Devices) · persistent logs: FM24CL64B (FRAM, Infineon/Cypress) · supervisor/health monitor: UCD9090A (TI)
6In supercap hold-up sizing, how does ESR cause “the math is right but the hardware fails”?
Maps to: H2-7 (Hold-up Sizing)
ESR adds an immediate drop ΔV_ESR ≈ I_step×ESR at the very moment backup current steps up (dropout or switchover). A hold-up calculation based only on capacitance predicts the slower C-based voltage decay, but the system can reset instantly when the ESR step pushes Vbus below PG threshold or DC/DC UVLO. The fix is margining Vhi/Vlo against ESR drop and validating with a scope: Vcap/Vbus plus load current during the first milliseconds of switchover.
Example MPNs: supercap controller/monitor: LTC3350 (Analog Devices) · 2-cell charger/balancer: LTC3225 (Analog Devices) · current monitor: INA238 (TI) · power mux: TPS2121 (TI)
7For hold-up, should V_lo be defined by the PG threshold or by the DC/DC UVLO threshold?
Maps to: H2-7 (Hold-up Sizing)
Use the threshold that defines “system success.” If the requirement is “no reset / no link drop,” V_lo should respect PG/Reset behavior (including debounce/blanking). If the requirement is “rail still regulated,” V_lo must respect DC/DC UVLO and minimum operating voltage. In practice, pick the more restrictive of the two once timing is included, then verify on a waveform: identify the first point where either PG deasserts or the converter drops out, and set the hold-up window above that boundary.
Example MPNs: supervisor (PG/UV): TPS3702 (TI) · system monitor/sequencer: UCD9090A (TI) · backup manager: LTC3350 (Analog Devices) · power mux: TPS2121 (TI)
8If the system reboots during backup switchover, which three waveforms should be captured first?
Maps to: H2-8 (Power-Path Management)
Capture these three first because they classify the failure in minutes:
  • Vin_main and Vin_backup (or the mux/ORing input nodes) to confirm the source transition.
  • Vbus to see whether the bus crosses UVLO/PG boundaries and for how long.
  • PG/Reset to mark exactly when the system decides it is “not OK.”
If available, add Iin as a fourth channel to detect reverse-current contest or a current-limited source.
Example MPNs: power mux: TPS2121 (TI) · ideal diode: LTC4412 (Analog Devices) · monitor: INA238 (TI) · PMBus manager (logs): LTC2977 (Analog Devices)
9How can backfeed from the backup rail into the main bus be prevented?
Maps to: H2-8 (Power-Path Management)
Prevent backfeed by ensuring the switchover element enforces reverse-current blocking. Common approaches are ideal-diode/ORing controllers driving back-to-back FETs, power mux devices with reverse blocking, or explicit reverse-protection controllers at the boundary between backup and main bus. Validation must include a switchover test where the main bus is low and backup is high: measure current direction (or sense resistor sign) and check whether the ORing node rises unexpectedly.
Example MPNs: ideal diode controllers: LTC4412, LTC4359 (Analog Devices) · power mux with priority: TPS2121 (TI) · reverse/OV protection class: LTC4365 (Analog Devices)
10For PMBus telemetry, which fields are most valuable for a “black-box” record around power-loss events?
Maps to: H2-9 (PMBus Telemetry & Fault Logs)
The most valuable “black-box” fields are those that separate source collapse from protection action and thermal accumulation:
  • VIN/VOUT, IIN/IOUT, input/output power, temperature (board/hotspot if possible).
  • Status/fault flags: OCP/OV/UV/OTP, retry counters, last fault code.
  • Energy store voltage (Vcap/Vbat) and switchover state.
Store a timestamped pre/post window so “what happened right before reset” is not guesswork.
Example MPNs: PMBus system manager: LTC2977, LTC2974 (Analog Devices) · health monitor/sequencer: UCD9090A (TI) · non-volatile logs: FM24CL64B (FRAM, Infineon/Cypress)
11When “swapping the adapter” makes the system stable (or worse), what does it usually imply—and should the input source or the local design be checked first?
Maps to: H2-10 (Field Debug Evidence)
Adapter sensitivity usually indicates a boundary problem between source capability and local inrush/protection policy. Triage should start with evidence, not guesses:
  • Voltage evidence: Vin droop depth and duration, ripple, and brownout window relative to UV thresholds.
  • Current evidence: inrush peak, retry pulse train, and whether the source hits its own current limit.
  • Status/thermal evidence: protection flags, OTP events, and retry counters over time.
If Vin collapses before protection flags rise, the source is likely limited; if flags lead the collapse, local policy/inrush is likely dominant.
Example MPNs: power monitor: INA238 (TI) · eFuse diagnostics: TPS25982 (TI) · surge stopper: LTC4368 (Analog Devices) · supervisor: TPS3702 (TI)
12How should validation cases be designed to prove the architecture is truly more stable, not just “occasionally not failing”?
Maps to: H2-11 (Validation Plan)
“Truly more stable” requires coverage + repeatability + consistent evidence. Build a matrix across cold/hot starts, input sources, Tmin/Tmax, load min/typ/max, and disturbance windows (brownout/jitter/dropout). Add injected faults (short/overload and switchover events). Define pass/fail as: no false trips, no thermal runaway under true faults, correct recovery (no reboot loops), and a log record that matches the waveform timeline. A test only counts when waveforms and logs agree on cause.
Example MPNs: observability: INA238 (TI) · PMBus logs: LTC2977 (Analog Devices) · persistent storage: FM25V10 (FRAM, Infineon/Cypress) · switchover element: TPS2121 (TI)

Tip: keep each acceptedAnswer aligned with the evidence set (Vin/Vbus/PG/Iin/Vcap + flags + timestamped pre/post window) so Google snippets and field engineers see the same “truth source.”